Wafer level encapsulation - a transfer molding approach to system in package generation

2003 ◽  
Author(s):  
T. Braun ◽  
K.-F. Becker ◽  
M. Koch ◽  
V. Bader ◽  
U. Oestermann ◽  
...  
Keyword(s):  
Wafer Level ◽  
Transfer Molding

Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly

2016 ◽  
Author(s):  
Francisco Cadacio ◽  
Teng Wang ◽  
Abdellah Salahouelhadj ◽  
Giovanni Capuz ◽  
Goedele Potoms ◽  
...  
Keyword(s):  
Wafer Level ◽  
Transfer Molding ◽  
Wafer Level Transfer

Wafer-level packaged SAW filters with resistance to transfer molding

2008 ◽  
Author(s):  
Toru Fukano ◽  
Yoshihiro Okubo ◽  
Junya Nishii ◽  
Ikuo Obara
Keyword(s):  
Wafer Level ◽  
Transfer Molding

Exposed die wafer level encapsulation by transfer molding

2016 ◽  
Author(s):  
S.H.M. Kersjes ◽  
J.L.J. Zijl ◽  
W.G.J. Gal ◽  
H.A.M. Fierkens ◽  
H. Wensink
Keyword(s):  
Wafer Level ◽  
Transfer Molding

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing
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