2018 International Wafer Level Packaging Conference (IWLPC)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781944543068

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Failure Relief in WLP and PLP Polymer Layers

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573260 ◽

2018 ◽

Author(s):

Robert L. Hubbard

Keyword(s):

Polymer Layers

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Redistribution-Layers (RDLS) for Fan-Out Panel-Level Packaging

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573284 ◽

2018 ◽

Cited By ~ 1

Author(s):

John H Lau

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Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573278 ◽

2018 ◽

Cited By ~ 8

Author(s):

Guilian Gao ◽

Laura Mirkarimi ◽

Thomas Workman ◽

Gabe Guevara ◽

Jeremy Theil ◽

...

Keyword(s):

Low Temperature ◽

Reliability Assessment ◽

Yield Improvement ◽

Direct Bond ◽

Interconnect Technology

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Improve Control Amidst Die shrink, 3D Package Complication

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573292 ◽

2018 ◽

Author(s):

Woo Young Han ◽

Mike Marshall ◽

Matt Wilson

Keyword(s):

3D Package

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Degas Module Thermal Architecture, Variable Wafer Delays, and Throughput, Productivity, and Consistency in Fan-Out Packaging Barrier/Seed Layer PVD

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573295 ◽

2018 ◽

Author(s):

Paul Werbaneth ◽

Billy Runstadler ◽

Sam North ◽

Vladimir Kudriavtsev ◽

Sriram Krishnaswami ◽

...

Keyword(s):

Seed Layer

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Heterogeneous Integration by Collective Die-To-Wafer Bonding

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573296 ◽

2018 ◽

Cited By ~ 6

Author(s):

Thomas Uhrmann ◽

Jurgen Burggraf ◽

Martin Eibelhuber

Keyword(s):

Wafer Bonding ◽

Heterogeneous Integration

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Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573275 ◽

2018 ◽

Author(s):

A. Martins ◽

M. Pinheiro ◽

A. F. Ferreira ◽

R. Almeida ◽

F. Matos ◽

...

Keyword(s):

Heterogeneous Integration ◽

Low Density

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The Road to Wafer-On-Wafer (WOW) High Volume Manufacturing (HVM)- Advanced Sensing in Wafer Handling

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573285 ◽

2018 ◽

Author(s):

Boris Kesil

Keyword(s):

High Volume ◽

The Road

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Optical Run-Out Correction for Improved Lithography Overlay Accuracy for Fowlp Applications

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573279 ◽

2018 ◽

Author(s):

Markus Arendt ◽

Matthew Gingerella ◽

Habib Hichri

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Comparative Study Of 3D Package Configurations In Power Delivery And Thermal Perspective

2018 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc.2018.8573271 ◽

2018 ◽

Cited By ~ 3

Author(s):

Heeseok Lee ◽

Yunhyeok Im ◽

Youngmin Shin

Keyword(s):

Comparative Study ◽

Power Delivery ◽

3D Package

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2018 International Wafer Level Packaging Conference (IWLPC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Failure Relief in WLP and PLP Polymer Layers

Redistribution-Layers (RDLS) for Fan-Out Panel-Level Packaging

Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment

Improve Control Amidst Die shrink, 3D Package Complication

Degas Module Thermal Architecture, Variable Wafer Delays, and Throughput, Productivity, and Consistency in Fan-Out Packaging Barrier/Seed Layer PVD

Heterogeneous Integration by Collective Die-To-Wafer Bonding

Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration

The Road to Wafer-On-Wafer (WOW) High Volume Manufacturing (HVM)- Advanced Sensing in Wafer Handling

Optical Run-Out Correction for Improved Lithography Overlay Accuracy for Fowlp Applications

Comparative Study Of 3D Package Configurations In Power Delivery And Thermal Perspective

2018 International Wafer Level Packaging Conference (IWLPC)
Latest Publications