Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.194 ◽

2016 ◽

Cited By ~ 1

Author(s):

Francisco Cadacio ◽

Teng Wang ◽

Abdellah Salahouelhadj ◽

Giovanni Capuz ◽

Goedele Potoms ◽

...

Keyword(s):

Wafer Level ◽

Transfer Molding ◽

Wafer Level Transfer

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Low-stress wafer-level transfer bonding of polymer layers using floatation

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference ◽

10.1109/transducers.2011.5969493 ◽

2011 ◽

Author(s):

J.M. Karlsson ◽

T. Haraldsson ◽

C.F. Carlborg ◽

W. van der Wijngaart

Keyword(s):

Wafer Level ◽

Polymer Layers ◽

Wafer Level Transfer

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Stackable dual-layer coil based on wafer-level transfer technique for electromagnetic energy harvester

2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) ◽

10.1109/memsys.2016.7421868 ◽

2016 ◽

Cited By ~ 2

Author(s):

Yufeng Wang ◽

Qian Zhang ◽

Lurui Zhao ◽

Anton Shkel ◽

Yongkui Tang ◽

...

Keyword(s):

Energy Harvester ◽

Electromagnetic Energy ◽

Wafer Level ◽

Wafer Level Transfer

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Wafer-Level Transfer of Thermo-Piezoelectric Si>inf/infinf/inf

19th IEEE International Conference on Micro Electro Mechanical Systems ◽

10.1109/memsys.2006.1627951 ◽

2006 ◽

Cited By ~ 1

Author(s):

Young-Sik Kim ◽

Hyo-Jin Nam ◽

SeongSoo Jang ◽

Caroline Sunyong Lee ◽

Won-Hyeog Jin ◽

...

Keyword(s):

Data Storage ◽

High Density ◽

Cmos Circuit ◽

Wafer Level ◽

Cantilever Array ◽

Wafer Level Transfer ◽

Density Probe

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Bandwidth-tunable SAW filter based on wafer-level transfer-integration of BaSrTiO3 film for wireless LAN system using TV white space

2014 IEEE International Ultrasonics Symposium ◽

10.1109/ultsym.2014.0197 ◽

2014 ◽

Cited By ~ 8

Author(s):

Hideki Hirano ◽

Tetsuo Samoto ◽

Tetsuya Kimura ◽

Masahiro Inaba ◽

Ken-ya Hashimoto ◽

...

Keyword(s):

Wireless Lan ◽

White Space ◽

Wafer Level ◽

Tv White Space ◽

Wafer Level Transfer

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Characterization of Aligned Wafer-Level Transfer of Thin and Flexible Parylene Membranes

Journal of Microelectromechanical Systems ◽

10.1109/jmems.2007.906759 ◽

2007 ◽

Vol 16 (6) ◽

pp. 1386-1396 ◽

Cited By ~ 10

Author(s):

Hanseup Kim ◽

Khalil Najafi

Keyword(s):

Wafer Level ◽

Wafer Level Transfer

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FTIR analysis of PZT damage during wafer level transfer of thermo-piezoelectric SI3N4 cantilevers on the CMOS-wafer for nano data storage applications

Physica Scripta ◽

10.1088/0031-8949/2007/t129/048 ◽

2007 ◽

Vol T129 ◽

pp. 213-217

Author(s):

Young-sik Kim ◽

WonHyeok Jin ◽

Sung Hoon Ahn ◽

Caroline Sunyong Lee

Keyword(s):

Data Storage ◽

Ftir Analysis ◽

Wafer Level ◽

Wafer Level Transfer

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Wafer-level packaged SAW filters with resistance to transfer molding

2008 IEEE Ultrasonics Symposium ◽

10.1109/ultsym.2008.0026 ◽

2008 ◽

Cited By ~ 5

Author(s):

Toru Fukano ◽

Yoshihiro Okubo ◽

Junya Nishii ◽

Ikuo Obara

Keyword(s):

Wafer Level ◽

Transfer Molding

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Flexible field-effect transistors using top-down fabrication of (111)-silicon nanowires and wafer-level transfer process for neural prostheses

Microelectronic Engineering ◽

10.1016/j.mee.2016.12.011 ◽

2017 ◽

Vol 175 ◽

pp. 23-29 ◽

Cited By ~ 1

Author(s):

Sangmin Lee ◽

Dong-il “Dan” Cho

Keyword(s):

Transfer Process ◽

Silicon Nanowires ◽

Field Effect ◽

Field Effect Transistors ◽

Neural Prostheses ◽

Wafer Level ◽

Top Down ◽

Wafer Level Transfer

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Wafer-Level Transfer Technologies for PZT-Based RF MEMS Switches

Journal of Microelectromechanical Systems ◽

10.1109/jmems.2010.2047005 ◽

2010 ◽

Vol 19 (3) ◽

pp. 548-560 ◽

Cited By ~ 39

Author(s):

Roland Guerre ◽

Ute Drechsler ◽

Debabrata Bhattacharyya ◽

Pekka Rantakari ◽

Richard Stutz ◽

...

Keyword(s):

Rf Mems ◽

Wafer Level ◽

Mems Switches ◽

Rf Mems Switches ◽

Wafer Level Transfer

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Wafer level encapsulation - a transfer molding approach to system in package generation

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185674 ◽

2003 ◽

Cited By ~ 7

Author(s):

T. Braun ◽

K.-F. Becker ◽

M. Koch ◽

V. Bader ◽

U. Oestermann ◽

...

Keyword(s):

Wafer Level ◽

Transfer Molding

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