Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages

Author(s):  
Chia-Kuei Hsu ◽  
Po-Yao Lin ◽  
Wen-Yi Lin ◽  
Ming-Chih Yew ◽  
Shu-Shen Yeh ◽  
...  
2015 ◽  
Vol 103 (5) ◽  
pp. 503
Author(s):  
Vladimir Gantchenko ◽  
Jacques Renard ◽  
Alexander Olowinsky ◽  
Gerhard Otto

1989 ◽  
Vol 170 ◽  
Author(s):  
Benjamin S. Hsiao ◽  
J. H. Eric

AbstractTranscrystallization of semicrystalline polymers, such as PEEK, PEKK and PPS, in high performance composites has been investigated. It is found that PPDT aramid fiber and pitch-based carbon fiber induce a transcrystalline interphase in all three polymers, whereas in PAN-based carbon fiber and glass fiber systems, transcrystallization occurs only under specific circumstances. Epitaxy is used to explain the surface-induced transcrystalline interphase in the first case. In the latter case, transcrystallization is probably not due to epitaxy, but may be attributed to the thermal conductivity mismatch. Plasma treatment on the fiber surface showed a negligible effect on inducing transcrystallization, implying that surface-free energy was not important. A microdebonding test was adopted to evaluate the interfacial strength between the fiber and matrix. Our preliminary results did not reveal any effect on the fiber/matrix interfacial strength of transcrystallinity.


Materials ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1573
Author(s):  
Qin Wang ◽  
Peikang Bai ◽  
Zhanyong Zhao

TiB2/316L stainless steel composites were prepared by selective laser melting (SLM), and the adhesion work, interface energy and electronic structure of TiB2/γ-Fe interface in TiB2/316L stainless steel composites were investigated to explore the heterogeneous nucleation potential of γ-Fe grains on TiB2 particles using first principles. Six interface models composed of three different stacking positions and two different terminations were established. The B-terminated-top 2 site interface (“B-top 2”) was the most stable because of the largest adhesion work, smallest interfacial distances, and smallest interfacial energy. The difference charge density and partial density of states indicated that a large number of strong Fe-B covalent bonds were formed near the “B-top 2” interface, which increased the stability of interface. Fracture analysis revealed that the bonding strength of the “B-top 2” interface was higher than that of the Fe matrix, and it was difficult to fracture at the interface. The interface energy at the Ti-poor position in the “B-top 2” interface model was smaller than that of the γ-Fe/Fe melt, indicating that TiB2 had strong heterogeneous nucleation potency for γ-Fe.


Metals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1034
Author(s):  
Massoud Malaki ◽  
Alireza Fadaei Tehrani ◽  
Behzad Niroumand ◽  
Manoj Gupta

Metal matrix composites (MMCs) have been developed in response to the enormous demand for special industrial materials and structures for automotive and aerospace applications, wherein both high-strength and light weight are simultaneously required. The most common, inexpensive route to fabricate MMCs or metal matrix nanocomposites (MMNCs) is based on casting, wherein reinforcements like nanoceramics, -carbides, -nitrides, elements or carbon allotropes are added to molten metal matrices; however, most of the mentioned reinforcements, especially those with nanosized reinforcing particles, have usually poor wettability with serious drawbacks like particle agglomerations and therefore diminished mechanical strength is almost always expected. Many research efforts have been made to enhance the affinity between the mating surfaces. The aim in this paper is to critically review and comprehensively discuss those approaches/routes commonly employed to boost wetting conditions at reinforcement-matrix interfaces. Particular attention is paid to aluminum matrix composites owing to the interest in lightweight materials and the need to enhance the mechanical properties like strength, wear, or creep resistance. It is believed that effective treatment(s) may enormously affect the wetting and interfacial strength.


2021 ◽  
Vol 279 ◽  
pp. 122511
Author(s):  
Pratik Gujar ◽  
Aleena Alex ◽  
Manu Santhanam ◽  
Pijush Ghosh

2021 ◽  
pp. 002199832110316
Author(s):  
Jiayang Zhang ◽  
Hongjiang Ni ◽  
Ming Gong ◽  
Jun Li ◽  
Daijun Zhang ◽  
...  

Electromagnetic shielding performance has been achieved for a polyimide (PI)-matrix composite by the strategy of self-metallization of its thermosetting PI matrix. Self-metallization of the thermosetting PI was realized by silver ion/poly(amic acid) (PAA) precursor ion exchange and thermal reduction. The factors influencing the self-metallization were investigated. The electrical conductivity and integrity for the surface of the PI were achieved by optimization of ion exchange/thermal reduction parameters. The fabricated PI-matrix composite exhibits a maximum electromagnetic interference shielding effectiveness value of 81 dB. Importantly, the electromagnetic shielding performance can be maintained even after heat condition of 300°C. Meanwhile, the surface-metallized PI composite exhibits mechanical property equivalent to the pristine composite, and an Ag/matrix interfacial strength higher than 19.6 MPa. Besides, self-metallization mechanism of the thermosetting PI was investigated.


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