Passivation schemes for copper/polymer thin-film interconnections used in multichip modules
1993 ◽
Vol 16
(1)
◽
pp. 53-59
◽
Keyword(s):
2007 ◽
Vol 244
(6)
◽
pp. 2166-2171
◽
Keyword(s):
2008 ◽
Vol 24
(3)
◽
pp. 261-265
◽
1999 ◽
Vol 38
(Part 1, No. 1A)
◽
pp. 95-100
◽
Keyword(s):
Keyword(s):