Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding

2015 ◽  
Author(s):  
Tamal Ghosh ◽  
E. Krushnamurthy ◽  
Ch. Subrahmanyam ◽  
V. SivaRamaKrishna ◽  
A. Dutta ◽  
...  
Keyword(s):  
Low Temperature ◽  
Room Temperature ◽  
Low Pressure ◽  
Copper Surface ◽  
Self Assembled Monolayer ◽  
Thermocompression Bonding ◽  
Self Assembled

Ambient Copper-Copper Thermocompression Bonding using Self Assembled Monolayers

2008 ◽  
Vol 1112 ◽  
Author(s):  
Xiaofang Ang ◽  
Jun Wei ◽  
Zhong Chen ◽  
Chee Cheong Wong
Keyword(s):  
Bonding Temperature ◽  
Three Dimensional ◽  
Copper Surface ◽  
Physical Contact ◽  
Ambient Conditions ◽  
Thermal Dependence ◽  
Self Assembled Monolayer ◽  
Assembled Monolayers ◽  
Thermocompression Bonding ◽  
Self Assembled

AbstractA typical copper-copper thermocompression bonding process is carried out in an ultrahigh vacuum (UHV) or inert environment at a bonding temperature >300°C. The ultraclean environment serves a single purpose – to maintain oxide-free copper surfaces, allowing intimate physical contact between copper atoms. This study investigates the temperature dependence of direct copper bonding from room temperature to 300°C under ambient condition. An anomalous thermal dependence of bond strength occurs between 80°C to 140°C where an increase in bonding temperature within this regime is in fact, detrimental to joint strength. This is interpreted as a thermal competition between oxidation and bond formation. This study also demonstrates that by simply coating the copper surface with a self assembled monolayer of 1-undecanethiol prior to bonding, Cu joints can be successfully formed at close to ambient temperature without a vacuum, yielding joint shear strengths on the order of 70MPa. The densely packed monolayer serves to passivate the copper surface against oxidation under ambient conditions. The ultrathin organic monolayer structure, as compared to a bulk oxide layer, could be easily displaced during the mechanical deformation at the bonding interface which accompanies thermocompression. This method could be an effective simple bonding solution for three-dimensional integrated chips.

Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding

RSC Advances ◽  
2015 ◽  
Vol 5 (125) ◽  
pp. 103643-103648 ◽  
Author(s):  
Tamal Ghosh ◽  
K. Krushnamurthy ◽  
Asisa Kumar Panigrahi ◽  
Asudeb Dutta ◽  
Ch. Subrahmanyam ◽  
...  
Keyword(s):  
Low Temperature ◽  
Thermal Plasma ◽  
Low Pressure ◽  
Smart Devices ◽  
Self Assembled Monolayers ◽  
Next Generation ◽  
Self Assembled Monolayer ◽  
Assembled Monolayers ◽  
Non Thermal Plasma ◽  
Self Assembled

This paper reports Self Assembled Monolayer (SAM) of propanethiol desorption assisted low temperature, low pressure Cu–Cu thermo-compression bonding, a technique which could be applied to developing next generation heterogeneous smart devices.

The dynamic behaviour of a single molecule inserted in a self-assembled monolayer matrix at low temperature

2004 ◽  
Vol 15 (4) ◽  
pp. S137-S141 ◽  
Author(s):  
Satoshi Wakamatsu ◽  
Shintaro Fujii ◽  
Uichi Akiba ◽  
Masamichi Fujihira
Keyword(s):  
Low Temperature ◽  
Single Molecule ◽  
Dynamic Behaviour ◽  
Self Assembled Monolayer ◽  
Self Assembled

Contact Angle Variation on a Copper Surface Treated With Self-Assembled Monolayer (SAM) of N-octadecyl Mercaptan

2011 ◽  
Vol 133 (8) ◽  
Author(s):  
Yulong Ji ◽  
Hsiu-hung Chen ◽  
Qingsong Yu ◽  
Xuehu Ma ◽  
H. B. Ma
Keyword(s):  
Contact Angle ◽  
Copper Surface ◽  
Self Assembled Monolayer ◽  
Angle Variation ◽  
Self Assembled

Ionically Self-Assembled Monolayer pH Sensitive Films-Fabrication and their Long Term Response to Varying Temperature Conditions

2021 ◽  
Vol 878 ◽  
pp. 15-22
Author(s):  
Brianna A. Richmond ◽  
Carisa D. Kunkle ◽  
Daniela M. Topasna
Keyword(s):  
Room Temperature ◽  
Ph Responsive ◽  
Self Assembled Monolayer ◽  
Percent Change ◽  
Temperature Conditions ◽  
Glass Slides ◽  
Long Time ◽  
Self Assembled ◽  
Term Response

This study presents the long time effects of varying temperature conditions on pH-responsive films deposited on glass slides. The films were fabricated from Brilliant Yellow and poly (allylamine hydrochloride) through ionically self-assembled monolayer technique using an automated slide strainer. The absorbance of the films was monitored and the effect of varying temperature on the optical properties of the films was studied. We found that as the films are maintained at increasing temperatures their absorbance slightly decreased. As the temperature increased the percent change decreased reaching a plateau. Films kept at low temperatures of 3.24 °C and below freezing (-9.02 °C) had a small increase in absorbance. Finally, we monitored the absorbance of films kept at room temperature over a long time (128 days) and found that the films showed decreased absorbance by 19%.

Electroluminescence from GalnN Quantum Wells Grown on Non-(0001) Facets of Selectively Grown GaN Stripes

2004 ◽  
Vol 831 ◽  
Author(s):  
Barbara Neubert ◽  
Frank Habel ◽  
Peter Bruckner ◽  
Ferdinand Scholz ◽  
Till Riemann ◽  
...  
Keyword(s):  
Low Temperature ◽  
Electric Field ◽  
Quantum Wells ◽  
Room Temperature ◽  
Light Emission ◽  
Low Pressure ◽  
Lower Efficiency ◽  
Strong Light ◽  
The Common ◽  
Piezo Electric

ABSTRACTNon (0001) GalnN QWs have been grown by low pressure MOVPE on side facets of triangular shaped selectively grown GaN stripes. By analysing low temperature photo- and cathodoluminescence and room temperature electroluminescence, we found strong indications, that both, In and Mg are less efficiently incorporated on these side facets compared to the common (0001) plane with even lower efficiency for stripes running along (1–100) compared to (11–20). Nevertheless, we observed strong light emission from these quantum wells, supposed to be at least partly caused by the reduced piezo-electric field.

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