Contact Angle Variation on a Copper Surface Treated With Self-Assembled Monolayer (SAM) of N-octadecyl Mercaptan

2011 ◽  
Vol 133 (8) ◽  
Author(s):  
Yulong Ji ◽  
Hsiu-hung Chen ◽  
Qingsong Yu ◽  
Xuehu Ma ◽  
H. B. Ma
Keyword(s):  
Contact Angle ◽  
Copper Surface ◽  
Self Assembled Monolayer ◽  
Angle Variation ◽  
Self Assembled

Copper to Copper Direct Bonding Assisted by Self-Assembled Monolayer

2010 ◽  
Author(s):  
D. F. Lim ◽  
X. F. Ang ◽  
J. Wei ◽  
C. M. Ng ◽  
C. S. Tan
Keyword(s):  
Contact Angle ◽  
Water Contact Angle ◽  
Bonding Temperature ◽  
Contact Angle Measurement ◽  
Copper Surface ◽  
Angle Measurement ◽  
Self Assembled Monolayer ◽  
Water Contact ◽  
Water Contact Angle Measurement ◽  
Self Assembled

In this article, a self-assembled monolayer (SAM) is applied onto the copper surface in an attempt to lower the required bonding temperature. Alkane-thiol with 6-carbon chain length is used and tested for bonding experiment. The adsorption of SAM is confirmed by the sharp rise of the water contact angle measurement and the reduced in the surface roughness. Next, the desorption of SAM is done at a high temperature anneal (<300°C) in an inert ambient and its properties are characterized by the water contact angle measurement and XPS. It is found that the water contact angle measurement decreases sharply close back to the contact angle of the pure blanket copper surface after annealing of SAM. The XPS results also show the ability of SAM in protecting Copper surface from oxidation. Finally, shear test is performed on Cu-Cu structures bonded at low temperature (250°C) in order to verify the SAM behavior in protecting the copper surface from oxidation and enhancement for bonding. The wafer pairs with and without SAM are intentionally exposed in clean room environment for few days. The bonded pieces are diced and subject to shear stress and results show that with SAM protection, shear strength is improved due to the enhancement in grain growth as a result of cleaner surface.

scholarly journals An Easy Route to Wettability Changes of Polyethylene Terephthalate–Silicon Oxide Substrate Films for High Barrier Applications, Surface-Modified with a Self-Assembled Monolayer of Fluoroalkylsilanes

Polymers ◽  
2019 ◽  
Vol 11 (2) ◽  
pp. 257 ◽  
Author(s):  
Paola Scarfato ◽  
Nicola Schiavone ◽  
Gabriella Rossi ◽  
Loredana Incarnato
Keyword(s):  
Contact Angle ◽  
Polyethylene Terephthalate ◽  
Silicon Oxide ◽  
Film Surface ◽  
Water Vapor Permeability ◽  
Vapor Permeability ◽  
Self Assembled Monolayer ◽  
Water Contact ◽  
Oxide Substrate ◽  
Self Assembled

Inorganic–organic multilayer films consisting of polymers coated with thin inorganic oxidic layers (e.g., SiOx) ensure very high barrier performances against gas and vapor permeation, what makes them packaging materials suitable for sophisticated technical applications, including the encapsulation of photovoltaic devices or quantum dots, barrier films for optical displays, and transparent greenhouse screens. In these fields, surface coating or texturing of the multilayer protective films are effective technologies to improve their self-clean ability, thus reducing the required maintenance and ensuring longer durability and better performances. In this work, we used the self-assembled monolayer (SAM) technique to modify the surface and wetting properties of commercial polyethylene terephthalate-silicon oxide substrate (PET-SiOx) films developed for technical applications requiring a combined high barrier and transparency. The selected surface modifier was the 1H,1H,2H,2H-per-fluorodecyltrichlorosilane (FDTS). The reagent mixture composition was optimized for the lowest water and oil wettability, as well as the highest self-cleaning capacity and performance stability. In particular, for the used PET-SiOx film the best FDTS/film surface for both the lowest water and oil wettability was found to be equal to 26.5 mM/dm2, which changes the surface behavior from very hydrophilic (static water contact angle (CAw) = 21.5°) to hydrophobic (CAw = 101°), and gives a significant increment of the static oil contact angle (CAo) from 27° to 60°. Interestingly, the results demonstrated that the SAM reaction occurred also on the uncoated the PET side. After the SAM treatment, a small increase of the water vapor permeability is observed, probably due to a crack or defect onset of the SiOx coating of the SAM modified films. On this point, atomic force measurements demonstrated an increment of the SiOx coating layer roughness after the SAM treatment execution. Finally, the transparency changes of the SAM treated films, measured in the wavelength range 400–800 nm, were always small, so that the results were acceptable for the films’ use in applications where high transparency is required.

scholarly journals Inhibition Effect of Three-Dimensional (3D) Nanostructures on the Corrosion Resistance of 1-Dodecanethiol Self-Assembled Monolayer on Copper in NaCl Solution

Materials ◽  
2018 ◽  
Vol 11 (7) ◽  
pp. 1225 ◽  
Author(s):  
Shuai Hu ◽  
Zhenyu Chen ◽  
Xingpeng Guo
Keyword(s):  
Corrosion Resistance ◽  
Three Dimensional ◽  
Copper Surface ◽  
Nacl Solution ◽  
Self Assembled Monolayer ◽  
Simple Method ◽  
Self Assembled ◽  
Bare Copper ◽  
3D Nanostructure ◽  
Anticorrosion Properties

A novel and simple method to improve the corrosion resistance of copper by constructing a three-dimensional (3D) 1-dodecanethiol self-assembled monolayer (SAM) in 3.5% NaCl solution is reported in this study. Several drops of 1% H3PO4 solution are thinly and uniformly distributed on copper surface to form a 3D nanostructure constituted by Cu3(PO4)2 nanoflowers. The anticorrosion properties of 1-dodecanethiol SAM on copper surface and on copper surface that is treated with H3PO4 solution were evaluated. Results demonstrated that 1-dodecanethiol SAM on bare copper surface exhibits good protection capacity, whereas a copper surface that is pretreated with H3PO4 solution can substantially enhance the corrosion resistance of 1-dodecanethiol SAM.

Ambient Copper-Copper Thermocompression Bonding using Self Assembled Monolayers

2008 ◽  
Vol 1112 ◽  
Author(s):  
Xiaofang Ang ◽  
Jun Wei ◽  
Zhong Chen ◽  
Chee Cheong Wong
Keyword(s):  
Bonding Temperature ◽  
Three Dimensional ◽  
Copper Surface ◽  
Physical Contact ◽  
Ambient Conditions ◽  
Thermal Dependence ◽  
Self Assembled Monolayer ◽  
Assembled Monolayers ◽  
Thermocompression Bonding ◽  
Self Assembled

AbstractA typical copper-copper thermocompression bonding process is carried out in an ultrahigh vacuum (UHV) or inert environment at a bonding temperature >300°C. The ultraclean environment serves a single purpose – to maintain oxide-free copper surfaces, allowing intimate physical contact between copper atoms. This study investigates the temperature dependence of direct copper bonding from room temperature to 300°C under ambient condition. An anomalous thermal dependence of bond strength occurs between 80°C to 140°C where an increase in bonding temperature within this regime is in fact, detrimental to joint strength. This is interpreted as a thermal competition between oxidation and bond formation. This study also demonstrates that by simply coating the copper surface with a self assembled monolayer of 1-undecanethiol prior to bonding, Cu joints can be successfully formed at close to ambient temperature without a vacuum, yielding joint shear strengths on the order of 70MPa. The densely packed monolayer serves to passivate the copper surface against oxidation under ambient conditions. The ultrathin organic monolayer structure, as compared to a bulk oxide layer, could be easily displaced during the mechanical deformation at the bonding interface which accompanies thermocompression. This method could be an effective simple bonding solution for three-dimensional integrated chips.

Self-Assembled Fluid Phase Floating Membranes with Tuneable Water Interlayers

2019 ◽  
Author(s):  
Luke Clifton ◽  
Nicoló Paracini ◽  
Arwel V. Hughes ◽  
Jeremy H. Lakey ◽  
Nina-Juliane Seinke ◽  
...  
Keyword(s):  
Fluid Phase ◽  
Interlayer Thickness ◽  
Supported Bilayers ◽  
Self Assembled Monolayer ◽  
High Coverage ◽  
Nano Technology ◽  
Surface Distance ◽  
Potential Applications ◽  
Self Assembled ◽  
Coated Surfaces

<p>We present a reliable method for the fabrication of fluid phase unsaturated bilayers which are readily self-assembled on charged self-assembled monolayer (SAM) surfaces producing high coverage floating supported bilayers where the membrane to surface distance could be controlled with nanometer precision. Vesicle fusion was used to deposit the bilayers onto anionic SAM coated surfaces. Upon assembly the bilayer to SAM solution interlayer thickness was 7-10 Å with evidence suggesting that this layer was present due to SAM hydration repulsion of the bilayer from the surface. This distance could be increased using low concentrations of salts which caused the interlayer thickness to enlarge to ~33 Å. Reducing the salt concentration resulted in a return to a shorter bilayer to surface distance. These accessible and controllable membrane models are well suited to a range of potential applications in biophysical studies, bio-sensors and Nano-technology.</p><br>

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