Material characterization of a novel lead-free solder material — SACQ

2014 ◽  
Author(s):  
Tak-Sang Yeung ◽  
Henry Sze ◽  
Keith Tan ◽  
Javed Sandhu ◽  
Chong-Wei Neo ◽  
...  
Keyword(s):  
Material Characterization ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Material ◽  
Free Solder

Properties of new gold based multicomponent alloys as innovative lead-free solder material

2014 ◽  
Vol 19 (2) ◽  
pp. 145-149 ◽  
Author(s):  
L. Gomidželović ◽  
D. Živković ◽  
N. Talijan ◽  
V. Ćosović
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Multicomponent Alloys ◽  
Solder Material ◽  
Free Solder

Process characterization of PCB assembly using 0201 packages with lead‐free solder

2003 ◽  
Vol 15 (2) ◽  
pp. 22-27 ◽  
Author(s):  
David Geiger ◽  
Fredrik Mattsson ◽  
Dongkai Shangguan ◽  
MT Ong ◽  
Patrick Wong ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Pcb Assembly ◽  
Process Characterization ◽  
Free Solder

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

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