2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)
Latest Publications

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Published By IEEE

9781509042784

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936754 ◽

2017 ◽

Cited By ~ 2

Author(s):

Tung Ching Lui

Keyword(s):

Lead Free ◽

Lifetime Prediction ◽

Lead Free Solder ◽

Solder Material ◽

Free Solder

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Suppression of electromagnetic interference using screening and shielding techniques within the switching cells

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936762 ◽

2017 ◽

Cited By ~ 1

Author(s):

Zhe Zhang ◽

C. Mark Johnson

Keyword(s):

Electromagnetic Interference

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Technique for embedding current measurement and ringing suppression within multichip modules

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936766 ◽

2017 ◽

Cited By ~ 1

Author(s):

Andrew N. Lemmon ◽

Ali Shahabi

Keyword(s):

Current Measurement ◽

Multichip Modules

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Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936745 ◽

2017 ◽

Author(s):

Q. Xie ◽

Y. Ohki ◽

N. Hirai ◽

Y-H Cheng

Keyword(s):

High Temperature ◽

Dielectric Property ◽

Epoxy Resin ◽

Resin Composites ◽

Epoxy Resin Composites

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Thermal management for GaN power devices mounted on PCB substrates

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936752 ◽

2017 ◽

Cited By ~ 4

Author(s):

Shuangfeng Zhang ◽

Eric Laboure ◽

Denis Labrousse ◽

Stephane Lefebvre

Keyword(s):

Thermal Management ◽

Power Devices

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Stacked power module with integrated thermal management

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936764 ◽

2017 ◽

Cited By ~ 6

Author(s):

Lauren M. Boteler ◽

Valerie A. Niemann ◽

Damian P. Urciuoli ◽

Steven M. Miner

Keyword(s):

Thermal Management ◽

Power Module

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Commereializing medium voltage VFD that utilizes high voltage SiC technology

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936759 ◽

2017 ◽

Cited By ~ 1

Author(s):

Pana Shenoy ◽

Octavio Solis ◽

Liping Zheng

Keyword(s):

High Voltage ◽

Medium Voltage

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Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936753 ◽

2017 ◽

Author(s):

Zsolt Toth-Pal ◽

Yafan Zhang ◽

Tag Hammam ◽

Hans-Peter Nee ◽

Mietek Bakowski

Keyword(s):

Silicon Carbide ◽

Contact Resistance ◽

Thermal Contact Resistance ◽

Thermal Contact ◽

Molybdenum Substrate ◽

Thermal Improvement

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Epoxy/h-BN composites based on oriented boron nitride platelets with high thermally conductivity for electronic encapsulation

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936751 ◽

2017 ◽

Cited By ~ 1

Author(s):

Zhengdong Wang ◽

Jialiang Huang ◽

Siyu Chen ◽

Mengmeng Yang ◽

Jingya Liu ◽

...

Keyword(s):

Boron Nitride

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High accuracy partial discharge location in power module using multiple loop sensors

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936749 ◽

2017 ◽

Cited By ~ 6

Author(s):

Hiroshi Mitsudome ◽

Yuuya Akinaga ◽

Masahiro Kozako ◽

Masayuki Hikita ◽

Yoshinari Ikeda ◽

...

Keyword(s):

Partial Discharge ◽

High Accuracy ◽

Power Module ◽

Discharge Location

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2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ

Suppression of electromagnetic interference using screening and shielding techniques within the switching cells

Technique for embedding current measurement and ringing suppression within multichip modules

Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers

Thermal management for GaN power devices mounted on PCB substrates

Stacked power module with integrated thermal management

Commereializing medium voltage VFD that utilizes high voltage SiC technology

Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip

Epoxy/h-BN composites based on oriented boron nitride platelets with high thermally conductivity for electronic encapsulation

High accuracy partial discharge location in power module using multiple loop sensors

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)
Latest Publications