Low-cost Palladium coating process and its effect on free-air-ball softness and second bond strength of Cu bonding wires

2012 ◽  
Author(s):  
John Persic ◽  
Jairus L. Pisigan ◽  
Suresh Tanna ◽  
Yong Guo ◽  
W. H. Song ◽  
...  
Keyword(s):  
Bond Strength ◽  
Low Cost ◽  
Coating Process ◽  
Free Air ◽  
Palladium Coating ◽  
Bonding Wires ◽  
Cu Bonding

Critical Barriers Associated with Copper Wire

2015 ◽  
Vol 2015 (1) ◽  
pp. 000394-000398
Author(s):  
William G. Crockett
Keyword(s):  
High Reliability ◽  
Copper Wire ◽  
Automotive Electronics ◽  
Bonding Wire ◽  
Cu Alloy ◽  
Bonding Wires ◽  
Reducing Costs ◽  
Cu Bonding ◽  
Bonding Characteristics ◽  
Bare Copper

Since around 2008, the shift from Gold (Au) bonding wire to Copper (Cu) bonding wire has been taking place, full scale, with the aim of reducing costs. When compared with Au, Cu wire presents challenges in reliability and repeatable bonding characteristics in terms of chemical stability, which is required in high reliability applications. Therefore Cu wire adoption in automotive and industrial semiconductors has been limited. Conventionally the market for Cu bonding wires has been divided into two types: bare Cu wires (high purity) and Palladium coated copper (PCC) bonding wires. These wires have yet to satisfy the required characteristics for high reliability products such as industrial and automotive electronics. A new breed of alternative bonding wires has been developed to offer performance advantages for high reliability applications compared to bare copper wire and PCC wire. Cu alloy wire and Ag alloy wires continue their market introduction for advanced bonding applications, where bare Cu and PCC wires have known limitations.

scholarly journals Solvent-free dry powder coating process for low-cost manufacturing of LiNi1/3Mn1/3Co1/3O2 cathodes in lithium-ion batteries

2017 ◽  
Vol 352 ◽  
pp. 187-193 ◽  
Author(s):  
Mohanad Al-Shroofy ◽  
Qinglin Zhang ◽  
Jiagang Xu ◽  
Tao Chen ◽  
Aman Preet Kaur ◽  
...  
Keyword(s):  
Lithium Ion Batteries ◽  
Low Cost ◽  
Lithium Ion ◽  
Powder Coating ◽  
Solvent Free ◽  
Coating Process ◽  
Dry Powder ◽  
Low Cost Manufacturing ◽  
Dry Powder Coating

scholarly journals Preparation and characterization of gelatin/sericin/carboxymethyl chitosan medical tissue glue

2017 ◽  
Vol 16 (2) ◽  
pp. 97-106 ◽  
Author(s):  
Min Liang ◽  
Zhenzhu Li ◽  
Cengceng Gao ◽  
Fuping Wang ◽  
Zhongmin Chen
Keyword(s):  
Acute Toxicity ◽  
Bond Strength ◽  
Toxicity Test ◽  
Blood Compatibility ◽  
Low Cost ◽  
Skin Wound ◽  
Carboxymethyl Chitosan ◽  
Amide Bond ◽  
Acute Toxicity Test ◽  
Tissue Glue

Background: The development and application of medical glue has been continuously expanding and advancing. However, there are few glues that combine low-cost with excellent biocompatibility. Methods: We have prepared a medical tissue glue using a gelatin (Gel), sericin (SS) and carboxymethyl chitosan (CMCS) blend solution, cross-linked with 1-ethyl-3-(3-dimethylaminopropyl)-carbodiimide (EDC). The combination’s characteristics and microstructure morphology were observed by Fourier transform infrared spectroscopy (FT-IR) and scanning electron microscope (SEM). Bond strength tests were used to measure the bond strength of the glue. To assay blood compatibility, a hemolytic test, dynamic coagulation test and platelet adherence test were also investigated. Further, the cellular behavior of L-929 and a systemic acute toxicity test on the Gel/SS/CMCS tissue glue were also investigated by MTT and H&E staining. Results: Characterization analysis showed that there was stable binding between raw materials, forming an amide bond with homogeneous holes. The bond strength of the tissue glue reached 2.50 ± 0.04 N in 10 minutes, slightly higher than the alpha-cyanoacrylate biological glue (2.25 ± 0.05 N). Blood compatibility tests revealed that the glue had outstanding blood compatibility. Further, cytotoxicity test and systemic acute toxicity test both showed that the glue was without cytotoxicity and not toxic to the body. Conclusions: The Gel/SS/CMCS tissue glue we prepared at low cost had excellent biocompatibility and structural characteristics. It could be a better candidate for tissue engineering in biomedical applications applied in clinical practice to promote skin wound healing and to further reduce the formation of skin wound scars.

scholarly journals Choice of Endodontic Fiber Posts and its Influence on Dental Malpractice: An in vitro Evaluation

2017 ◽  
Vol 18 (6) ◽  
pp. 452-457
Author(s):  
Houssam Jassar ◽  
Hassan El Husseini
Keyword(s):  
Bond Strength ◽  
Low Cost ◽  
Fiber Post ◽  
Endodontically Treated Teeth ◽  
Fiber Posts ◽  
Significant Difference ◽  
Post Space ◽  
Adhesive Cement ◽  
Push Out

ABSTRACT Aims and objectives The fiber post type used in restoring endodontically treated teeth may affect the dental expert decision in the case of dental malpractice. The aim of this study was to evaluate the low-cost commercial fiber post in comparison with a higher cost or well-known documented fiber post system. Materials and methods A total of 20 premolars were selected for the study; following endodontic treatment, specimens were randomly divided into two groups of 10 specimens each according to the type of fiber post used: (1) Low-cost commercial fiber post (OYAPost, Taper Lucent, OYARICOM) and (2) higher cost well-known fiber post (Rely X Fiber post, 3M ESPE). Both fiber posts were cemented using self-adhesive cement (Rely X Unicem). Samples were subjected to push-out bond strength and to failure analysis. One-way analysis of variance was used (p < 0.005). Results There was no significant difference between the bond strength of the two tested groups (p > 0.05), while statistically significant difference (p < 0.05) was noted between the different post space regions (cervical, middle, and apical). Conclusion Based on the evidence from the study, it can be concluded that the type of fiber post should not affect the dental expert decision in the case of dental malpractice/lawsuit. Clinical significance All types of low-cost fiber posts may behave similarly to other higher cost or well-documented fiber posts. How to cite this article Ayoub F, Jassar H, El Husseini H, Salameh Z. Choice of Endodontic Fiber Posts and its Influence on Dental Malpractice: An in vitro Evaluation. J Contemp Dent Pract 2017;18(6):452-457.

scholarly journals Development of a High-Performance Adhesive with a Microphase, Separation Crosslinking Structure Using Wheat Flour and a Hydroxymethyl Melamine Prepolymer

Polymers ◽  
2019 ◽  
Vol 11 (5) ◽  
pp. 893 ◽  
Author(s):  
Jieyu Zhang ◽  
Yi Zhang ◽  
Jianzhang Li ◽  
Qiang Gao
Keyword(s):  
Shear Strength ◽  
Fracture Surface ◽  
Bond Strength ◽  
Wheat Flour ◽  
High Performance ◽  
Water Resistance ◽  
Microphase Separation ◽  
Low Cost ◽  
Bond Performance ◽  
Effective Manner

The objective of this study is to use wheat flour (WF) and hydroxymethyl melamine prepolymer (HMP) to develop a low cost, highly water-resistant, starch-based bio-adhesive for plywood fabrication. Three-layer plywood was fabricated using the resultant adhesive, and the wet shear strength of the plywood samples was measured under various conditions. After determining that water resistance was significantly improved with the addition of HMP, we evaluated the physical characteristics of the starch-based adhesive and functional groups and analyzed the thermal stability and fracture surface of the cured adhesive samples. Results showed that by adding 20 wt.% HMP into WF adhesive, the sedimentation volume in the resultant adhesive decreased by 11.3%, indicating that the increase of crosslinking in the structure of the adhesives increased the bond strength, and the wet shear strength of the resultant plywood in 63 °C water improved by 375% when compared with the WF adhesive. After increasing the addition of HMP to 40 wt.%, the wet shear strength of the resultant plywood in 100 °C water changed from 0 MPa to 0.71 MPa, which meets the exterior use plywood requirement. This water resistance and bond strength improvement resulted from (1) HMP reacting with functions in WF and forming a crosslinking structure to prevent moisture intrusion; and (2) HMP self-crosslinking and combining with crosslinked WF to form a microphase separation crosslinking structure, which improved both the crosslinking density and the toughness of the adhesive, and subsequently, the adhesive’s bond performance. In addition, the microphase separation crosslinking structure had better thermostability and created a compact ductile fracture surface, which further improved the bond performance of the adhesive. Thus, using a prepolymer to form a microphase separation crosslinking structure within the adhesive improves the rigidity, toughness, and water resistance of the material in a practical and cost-effective manner.

Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding Wires

2014 ◽  
Vol 2014 (1) ◽  
pp. 000272-000277
Author(s):  
Noritoshi Araki ◽  
Yasutomo Ichiyama ◽  
Ryo Oishi ◽  
Teruo Haibara ◽  
Takashi Yamada
Keyword(s):  
Process Parameters ◽  
Formation Process ◽  
High Speed ◽  
High Speed Camera ◽  
Formation Processes ◽  
Shielding Gas ◽  
Optimization Of Process Parameters ◽  
Free Air ◽  
Bonding Wires ◽  
High Density Packaging

The Free Air Ball (FAB) formation processes of fine diameter Cu wires were observed, and the effects of process parameters were studied on the basis of high-speed camera observation. It was revealed that the FAB formation process is characterized by preheating before melting, melting that accompanies ball rising, and solidification periods. The relationships between the electronic flame-off (EFO) condition and the FAB formation were summarized for both bare Cu and palladium-coated Cu wires. Further study was performed on the changes in FAB shape with different EFO conditions, wire types, and FAB sizes. Off-centered FABs were observed in the bare Cu wire whereas they were rarely observed in the Pd-coated Cu wire. The off-center tended to be affected by shielding gas condition, EFO torch gap, and FAB size. The mechanisms of the off-centered FAB formation were proposed through the high speed camera observations. The optimization of process parameters to achieve defect-free, consistent FAB is discussed based on these findings, which is useful for the next generation high density packaging.

Bare die connections via aerosol jet technology for millimeter wave applications

2019 ◽  
Vol 11 (5-6) ◽  
pp. 441-446
Author(s):  
Franz Xaver Röhrl ◽  
Johannes Jakob ◽  
Werner Bogner ◽  
Robert Weigel ◽  
Stefan Zorn
Keyword(s):  
Printed Circuit Board ◽  
Mechanical Stability ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Circuit Board ◽  
Silver Ink ◽  
Measurement Results ◽  
Bonding Wires ◽  
Technology Transitions ◽  
Rf Performance

AbstractThis paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

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