Intelligent Detection Methods of Electrical Connection Faults in RF Circuits

Printed circuit boards (PCBs) have a large number of electrical connection nodes. Exposure to harsh environments may lead to connection faults in these nodes. In the present work, intelligent detection methods for electrical connection faults were studied. Specifically, the fault characteristics of connectors, bonding wires and solder balls in the frequency domain were analyzed. The reflection and transmission parameters of an example filter circuit with electrical connection faults were calculated using the Simulation Program with Integrated Circuit Emphasis (SPICE). With these obtained electrical parameters, three machine learning algorithms were used to detect example electrical connection faults for the example circuit. Based upon the performance evaluations of the three algorithms, one can conclude that machine-learning-based intelligent fault detection is a promising technique in diagnosing circuit faults due to electrical connection issues with high accuracy and lower time cost as compared to current manual processes.

Numerical Study of the Coupling of Sub-Terahertz Radiation to n-Channel Strained-Silicon MODFETs

This paper reports on a study of the response of a T-gate strained-Si MODFETs (modulation-doped field-effect transistor) under continuous-wave sub-THz excitation. The sub-THz response was measured using a two-tones solid-state source at 0.15 and 0.30 THz. The device response in the photovoltaic mode was non-resonant, in agreement with the Dyakonov and Shur model for plasma waves detectors. The maximum of the photoresponse was clearly higher under THz illumination at 0.15 THz than at 0.3 THz. A numerical study was conducted using three-dimensional (3D) electromagnetic simulations to delve into the coupling of THz radiation to the channel of the transistor. 3D simulations solving the Maxwell equations using a time-domain solver were performed. Simulations considering the full transistor structure, but without taking into account the bonding wires used to contact the transistor pads in experiments, showed an irrelevant role of the gate length in the coupling of the radiation to the device channel. Simulations, in contradiction with measurements, pointed to a better response at 0.3 THz than under 0.15 THz excitation in terms of the normalized electric field inside the channel. When including four 0.25 mm long bonding wires connected to the contact pads on the transistor, the normalized internal electric field induced along the transistor channel by the 0.15 THz beam was increased in 25 dB, revealing, therefore, the important role played by the bonding wires at this frequency. As a result, the more intense response of the transistor at 0.15 THz than at 0.3 THz experimentally found, must be attributed to the bonding wires.

Effect of the Front and Back Illumination on Sub-Terahertz Detection Using n-Channel Strained-Silicon MODFETs

Plasma waves in semiconductor gated 2-D systems can be used to efficiently detect Terahertz (THz) electromagnetic radiation. This work reports on the response of a strained-Si Modulation-doped Field-Effect Transistor (MODFET) under front and back sub-THz illumination. The response of the MODFET has been characterized using a two-tones solid-state continuous wave source at 0.15 and 0.30 THz. The DC drain-to-source voltage of 500-nm gate length transistors transducing the sub-THz radiation (photovoltaic mode) exhibited a non-resonant response in agreement with literature results. Two configurations of the illumination were investigated: (i) front side illumination in which the transistor was shined on its top side, and (ii) back illumination side where the device received the sub-THz radiation on its bottom side, i.e., on the Si substrate. Under excitation at 0.15 THz clear evidence of the coupling of terahertz radiation by the bonding wires was found, this coupling leads to a stronger response under front illumination than under back illumination. When the radiation is shifted to 0.3 THz, as a result of a lesser efficient coupling of the EM radiation through the bonding wires, the response under front illumination was considerably weakened while it was strengthened under back illumination. Electromagnetic simulations explained this behavior as the magnitude of the induced electric field in the channel of the MODFET was considerably stronger under back illumination.