Electrical characterization method to study barrier integrity in 3D through-silicon vias

2012 ◽  
Author(s):  
Y.-L. Li ◽  
D. Velenis ◽  
T. Kauerauf ◽  
M. Stucchi ◽  
Y. Civale ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Barrier Integrity ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias
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