2019 International 3D Systems Integration Conference (3DIC)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781728148700

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

3D Test Wrapper Chain Optimization with I/O Cells Binding Considered

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058794 ◽

2019 ◽

Author(s):

Fan-Hsuan Tang ◽

Hsu-Yu Kao ◽

Shih-Hsu Huang ◽

Jin-Fu Li

Keyword(s):

Test Wrapper

Download Full-text

Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058775 ◽

2019 ◽

Author(s):

Takahiro Nagata ◽

Kazumichi Tsumura ◽

Kenro Nakamura ◽

Kengo Uchida ◽

Jin Kawakita ◽

...

Keyword(s):

Barrier Layer ◽

Wafer Bonding ◽

Bonding Process ◽

Si Wafer

Download Full-text

Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058860 ◽

2019 ◽

Author(s):

Takuji Miki ◽

Makoto Nagata ◽

Akihiro Tsukioka ◽

Noriyuki Miura ◽

Takaaki Okidono ◽

...

Keyword(s):

Power Supply ◽

Large Scale ◽

Over The Top

Download Full-text

Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058853 ◽

2019 ◽

Author(s):

Murugesan Mariappan ◽

Mitsumasa Koyanagi ◽

Takafumi Fukushima

Keyword(s):

Layer Graphene ◽

Growth Optimization

Download Full-text

Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058827 ◽

2019 ◽

Cited By ~ 1

Author(s):

Tadatomo Yamada ◽

Ken Takano ◽

Toshiaki Menjo ◽

Shinya Takyu

Keyword(s):

Strain Curve ◽

Stress Strain Curve ◽

Stress Strain

Download Full-text

3DIC 2019 Authors Index

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058781 ◽

2019 ◽

Download Full-text

Program-at-a-Glance

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058790 ◽

2019 ◽

Download Full-text

SiN used as a Stressor in Germanium-On-Insulator Substrate

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058896 ◽

2019 ◽

Author(s):

Sethavut Duangchan ◽

Keisuke Yamamoto ◽

Dong Wang ◽

Hiroshi Nakashima ◽

Akiyoshi Baba

Keyword(s):

Insulator Substrate

Download Full-text

Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058851 ◽

2019 ◽

Author(s):

Makoto Motoyoshi ◽

Koki Yanagimura ◽

Taiko Fushimi ◽

Shunta Endo

Keyword(s):

Detector Technology

Download Full-text

Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer

2019 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic48104.2019.9058873 ◽

2019 ◽

Author(s):

Demin Liu ◽

Po-Chih Chen ◽

Yi-Chieh Tsai ◽

Kuan-Neng Chen

Keyword(s):

Low Temperature ◽

Passivation Layer

Download Full-text

2019 International 3D Systems Integration Conference (3DIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

3D Test Wrapper Chain Optimization with I/O Cells Binding Considered

Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process

Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs

Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI

Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape

3DIC 2019 Authors Index

Program-at-a-Glance

SiN used as a Stressor in Germanium-On-Insulator Substrate

Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction

Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer

2019 International 3D Systems Integration Conference (3DIC)
Latest Publications