Embedded Passives On Multi-Layer Printed Wiring Board (PWB) for 5GHz Front-end Module

2006 ◽  
Author(s):  
U.-M. Jow ◽  
Chang-Lin Wei ◽  
Ying-Jiunn Lai ◽  
Chang-Sheng Chen ◽  
Chin-Sun Shyu
Keyword(s):  
Printed Wiring Board ◽  
Front End ◽  
Embedded Passives ◽  
Front End Module ◽  
Wiring Board

Manufacturing Substrates with Embedded Passives

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 002011-002050
Author(s):  
Rabindra N. Das ◽  
Konstantinos I. Papathomas ◽  
John M. Lauffer ◽  
Mark D. Poliks ◽  
Voya R. Markovich
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Electrical Characterization ◽  
Printed Wiring Board ◽  
Digital Products ◽  
Capacitance Density ◽  
Embedded Passives ◽  
Wiring Board ◽  
Electronic Assemblies

Passives account for a very large part of today's electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, computers and several critical defense devices. This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on organic multilayered substrates. A variety of thin film capacitor and resistors were utilized to manufacture high-performance embedded passives. The electrical properties of capacitors fabricated from polymer-ceramic nanocomposites showed a stable capacitance and low loss over a wide temperature range. We have designed and fabricated several printed wiring board (PWB) and flip-chip package test vehicles focusing on resistors and capacitors. Two basic capacitor cores were used for this study. One is a layer capacitor. The second capacitor in this case study was discrete capacitor. In both cases, capacitance values are defined by the feature size, thickness and dielectric constant of the polymer-ceramic compositions. Nanocomposite can be directly deposited either by liquid coating or screen printing. Alternatively, nanocomposite thin films can be laminated and capacitor laminate can be used as the base substrate for subsequent build-up processing. For example, Resin Coated Copper Capacitive (RC3) nanocomposites were used to fabricate 35 mm substrates with a two by two array of 15mm square isolated epoxy based regions; each having two to six RC3 based embedded capacitance layers. The capacitor fabrication is based on a sequential build-up technology employing a first patternable electrode. After patterning of the electrode, RC3 nanocomposite can be laminated within PCB. Embedded passive cores are showing high capacitance density ranging from 15 nF to 30nF depending on Cu area, composition and thickness of the capacitors. Reliability of the capacitors was ascertained by IR-reflow, thermal cycling, PCT (Pressure Cooker Test ) and solder shock. Embedded capacitors were stable after PCT and solder shock. Capacitance change was less than 5% after IR reflow (assembly) preconditioning (3X, 245 °C) and 1000 cycles DTC (Deep Thermal Cycle).

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

A 5 x 5 mm Highly Integrated Dual-band WLAN Front-End Module Simplifies 802.11 a/b/g and 802.11n Radio Designs

2007 ◽  
Author(s):  
Chun-Wen Paul Huang ◽  
William Vaillancourt ◽  
Christophe Masse ◽  
Joe Soricelli ◽  
Tony Quaglietta ◽  
...  
Keyword(s):  
Dual Band ◽  
Front End ◽  
Front End Module
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