Modeling Board-Level Four-Point Bend Fatigue and Impact Drop Tests

2006 ◽  
Author(s):  
F.X. Che ◽  
J.H.L. Pang
Keyword(s):  
Drop Tests ◽  
Point Bend ◽  
Board Level

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

2009 ◽  
Vol 38 (6) ◽  
pp. 884-895 ◽  
Author(s):  
E.H. Wong ◽  
S.K.W. Seah ◽  
C.S. Selvanayagam ◽  
R. Rajoo ◽  
W.D. van Driel ◽  
...  
Keyword(s):  
High Speed ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Printed Circuit ◽  
Drop Tests ◽  
Bend Tests ◽  
Board Level

Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages

2007 ◽  
Vol 30 (1) ◽  
pp. 54-62 ◽  
Author(s):  
Tsung-Yueh Tsai ◽  
Chang-Lin Yeh ◽  
Yi-Shao Lai ◽  
Rong-Sheng Chen
Keyword(s):  
Electronic Packages ◽  
Drop Tests ◽  
Board Level

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

2017 ◽  
Vol 139 (3) ◽  
Author(s):  
Jingshi Meng ◽  
Abhijit Dasgupta
Keyword(s):  
Failure Modes ◽  
Test Methods ◽  
Design Guidelines ◽  
Printed Wiring Boards ◽  
Secondary Impact ◽  
Surface Mount ◽  
External Impact ◽  
Drop Tests ◽  
Board Level ◽  
Printed Wiring Assemblies

Portable electronic devices are commonly exposed to shock and impact loading due to accidental drops. After external impact, internal collisions (termed “secondary impacts” in this study) between vibrating adjacent subassemblies of a product may occur if design guidelines fail to prevent such events. Secondary impacts can result in short acceleration pulses with much higher amplitudes and higher frequencies than those in conventional board-level drop tests. Thus, such pulses are likely to excite the high-frequency resonances of printed wiring boards (PWBs) (including through-thickness “breathing” modes) and also of miniature structures in assembled surface mount technology (SMT) components. Such resonant effects have a strong potential to damage the component, and therefore should be avoided. When the resonant frequency of a miniature structure (e.g., elements of an SMT microelectromechanical system (MEMS) component) in an SMT assembly is close to a natural frequency of the PWB, an amplified response is expected in the miniature structure. Components which are regarded as reliable under conventional qualification test methods may still pose a failure risk when secondary impact is considered. This paper is the second part of a two-part series exploring the effect of secondary impacts in a printed wiring assembly (PWA). The first paper is this series focused on the breathing mode of vibration generated in a PWB under secondary impact, and this paper focuses on analyzing the effect of such breathing modes on typical failure modes with different resonant frequencies in SMT applications. The results demonstrate distinctly different sensitivity of each failure mode to the impacts.

Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

2020 ◽  
Vol 12 (4) ◽  
pp. 525-530
Author(s):  
Haksan Jeong ◽  
Woo-Ram Myung ◽  
Kyung-Yeol Kim ◽  
Kyung Deuk Min ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Aging Time ◽  
Composite Solder ◽  
Solder Paste ◽  
Mechanical Reliability ◽  
Surface Finishes ◽  
Osp Surface Finish ◽  
Drop Number ◽  
Point Bend ◽  
Board Level

The microstructures and mechanical reliability of Sn–58Bi solder and epoxy Sn–58Bi composite solder joint were investigated with organic solderability preservative surface finishes. The mechanical reliabilities of Sn58Bi and epoxy Sn58Bi solder were evaluated by the board-level drop test and the 3-point bend test after temperature-humidity storage testing. The microstructure and chemical composition of the solder joints were characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy, respectively. The addition of epoxy in solder paste did not affect the morphology of the intermetallic compound. The thickness of the scalloped-shaped Cu6Sn5 intermetallic compound of solder/OSP joint increased with aging time. The drop number until fail for the epoxy Sn58Bi/OSP joint was higher than that for the Sn–58Bi/OSP joint; the average numbers of drops withstood by the Sn–58Bi/OSP joint and epoxy Sn–58Bi/OSP joint following the reflow process were fewer than 10 drops and 180 drops, respectively. The drop number of solder/OSP joints decreased with increasing aging time. The result of the 3-point bend tests shows that the number of bend cycles for the epoxy Sn–58Bi/OSP joint was 30 times higher than that for the Sn–58Bi/OSP joint. The number of bend cycles for solder/OSP joints was decreased with increasing aging time.

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