High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed

2007 ◽  
Author(s):  
Fubin Song ◽  
S. W. Ricky Lee ◽  
Keith Newman ◽  
Bob Sykes ◽  
Stephen Clark
Keyword(s):  
Failure Mode ◽  
High Speed ◽  
Solder Ball ◽  
Ball Shear ◽  
Drop Tests ◽  
Pull Tests ◽  
Board Level

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

2009 ◽  
Vol 38 (6) ◽  
pp. 884-895 ◽  
Author(s):  
E.H. Wong ◽  
S.K.W. Seah ◽  
C.S. Selvanayagam ◽  
R. Rajoo ◽  
W.D. van Driel ◽  
...  
Keyword(s):  
High Speed ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Printed Circuit ◽  
Drop Tests ◽  
Bend Tests ◽  
Board Level

scholarly journals Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability

2009 ◽  
Author(s):  
Nikhil Lakhkar ◽  
Puligandla Viswanadham ◽  
Dereje Agonafer
Keyword(s):  
Thermal Cycling ◽  
Shear Test ◽  
Solder Ball ◽  
Wafer Level ◽  
Ball Shear ◽  
Ball Size ◽  
Ball Shear Test ◽  
Accelerated Thermal Cycling ◽  
Ball Shear Strength ◽  
Board Level

Ball shear testing is typically conducted in Wafer level chip scale package (WLCSP) fabrication to estimate the strength of the solder ball attachment. Generally, the solder ball shear strength is dependent on the solder ball size, pad size, solder/pad interface treatment, reflow temperature and time. Solder ball strength is also a function of ram speed and height at which the ball is sheared with respect to the wafer. Recent investigations suggest that ball shear test is being used as an indicator for board level reliability of assemblies. In current market lead time for launching a new product is very short. Unfortunately, it takes several weeks to qualify a new product by board level qualification process. If there is a methodology through which one can predict the board level performance by extrapolating the wafer level test, it will save great amount of resources in testing and millions of dollars worth of testing time. In the first part of this study, we conducted a wafer level ball shear test. A DOE was created for varying wafer level structural parameters like solder ball size and type. Ball shear tests and Accelerated thermal cycling have similar failure signatures of compression on inner side and tension on outer side. Thus, for specific cases there is a possibility of correlating the two failure methodologies based on their failure signatures. Strain rate for ball shear test was determined based on shear speed and solder pad diameter. Strain rate for accelerated thermal cycling was determined based on difference in CTE between board and package. In this paper, results from ball shear test and accelerated thermal cycling are compared to find correlations for specific cases. The correlations derived from this study are statistical and empirical.

Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability

2007 ◽  
Vol 4 (4) ◽  
pp. 186-194 ◽  
Author(s):  
C.I. Chen ◽  
S.C. Wu ◽  
D.S. Liu ◽  
C.Y. Ni ◽  
T. D. Yuan
Keyword(s):  
Solder Joint ◽  
High Speed ◽  
Solder Ball ◽  
Flip Chip ◽  
Global Model ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Local Modeling ◽  
Formidable Challenge ◽  
Board Level

Due to the high speed and high I/O count requirements for semiconductor packages, thousands of soldered interconnections are indispensable, and this situation renders traditional finite element method (FEM) analysis a formidable challenge. This paper presents a 3D-equivalent global model and local submodeling technique to investigate board-level solder joint reliability under cyclic temperature loading. The equivalent global model is capable of addressing critical solder failure locations. An individual local solder ball is used to predict the number of cycles to failure. The high performance flip-chip ball grid array (HFCBGA) package case was studied with the provided experimental data. According to FEM results, the predicted solder ball life is close to that observed experimentally. Therefore, the global-to-local modeling technique can be concluded to provide an efficient methodology for evaluating very high pin count HFCBGA package reliability.

Sign in / Sign up

Export Citation Format

Share Document