Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

2020 ◽  
Vol 12 (4) ◽  
pp. 525-530
Author(s):  
Haksan Jeong ◽  
Woo-Ram Myung ◽  
Kyung-Yeol Kim ◽  
Kyung Deuk Min ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Aging Time ◽  
Composite Solder ◽  
Solder Paste ◽  
Mechanical Reliability ◽  
Surface Finishes ◽  
Osp Surface Finish ◽  
Drop Number ◽  
Point Bend ◽  
Board Level

The microstructures and mechanical reliability of Sn–58Bi solder and epoxy Sn–58Bi composite solder joint were investigated with organic solderability preservative surface finishes. The mechanical reliabilities of Sn58Bi and epoxy Sn58Bi solder were evaluated by the board-level drop test and the 3-point bend test after temperature-humidity storage testing. The microstructure and chemical composition of the solder joints were characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy, respectively. The addition of epoxy in solder paste did not affect the morphology of the intermetallic compound. The thickness of the scalloped-shaped Cu6Sn5 intermetallic compound of solder/OSP joint increased with aging time. The drop number until fail for the epoxy Sn58Bi/OSP joint was higher than that for the Sn–58Bi/OSP joint; the average numbers of drops withstood by the Sn–58Bi/OSP joint and epoxy Sn–58Bi/OSP joint following the reflow process were fewer than 10 drops and 180 drops, respectively. The drop number of solder/OSP joints decreased with increasing aging time. The result of the 3-point bend tests shows that the number of bend cycles for the epoxy Sn–58Bi/OSP joint was 30 times higher than that for the Sn–58Bi/OSP joint. The number of bend cycles for solder/OSP joints was decreased with increasing aging time.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Effect of Aging Time towards Intermetallic Compound (IMC) Growth Kinetics Formation for Sn-0.7Cu-Si3N4 Composite Solder on Copper Substrate

2013 ◽  
Vol 795 ◽  
pp. 505-508 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Diffusion Coefficient ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Growth Kinetics ◽  
Aging Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Intermetallic Growth ◽  
Reliability Of Solder Joints ◽  
Electronic Assemblies

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s.

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Contact Angle ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Solder Paste ◽  
X Ray Diffraction ◽  
Free Solder ◽  
Sic Particle

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

Electrical resistance of Sn–Ag–Cu ball grid array packages with Sn–Zn–Bi addition jointed at 240 °C

2007 ◽  
Vol 22 (1) ◽  
pp. 113-123
Author(s):  
Po-Cheng Shih ◽  
Kwang-Lung Lin
Keyword(s):  
Control System ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Electrical Resistance ◽  
Ball Grid Array ◽  
Solder Paste ◽  
Solder Balls ◽  
Solder Bulk ◽  
Ball Grid Array Packages

Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously at 240 °C on Cu/Ni/Au metallized ball grid array substrates. The joints without Sn–Zn–Bi addition (only Sn–Ag–Cu) were studied as a control system. Electrical resistance was measured after multiple reflows and aging. The electrical resistance of the joint (R1) consisted of three parts: the solder bulk (Rsolder bulk, upper solder highly beyond the mask), interfacial solder/intermetallic compound (Rsolder/IMC), and the substrate (Rsubstrate). R1 increased with reflows and aging time. Rsolder/IMC, rather than Rsolder bulk and Rsubstrate, seemed to increase with reflows and aging time. The increase of R1 was ascribed to the Rsolder/IMC rises. Rsubstrate was the major contribution to R1. However Rsolder/IMC dominated the increase of R1 with reflows and aging. R1 of Sn–Zn–Bi/Sn–Ag–Cu samples were higher than that of Sn–Ag–Cu samples in various tests.

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 551-555 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Activated Carbon ◽  
Intermetallic Compound ◽  
Melting Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Contact Angles ◽  
Solder Paste ◽  
Compound Formation ◽  
Carbon Particles ◽  
Intermetallic Compound Formation

This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste. The composite solder was prepared by mixing reinforcement particles (0, 0.25, 0.5, 0.75 and 1.0 wt. %) into SN100C solder paste. The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC). Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface. The intermetallic compound formation was studied after reflow soldering process.With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved. The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.

scholarly journals Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 733
Author(s):  
Lu Liu ◽  
Songbai Xue ◽  
Ruiyang Ni ◽  
Peng Zhang ◽  
Jie Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Paste ◽  
Epoxy System ◽  
Mechanical Reinforcement ◽  
Microstructure Observation ◽  
Temperature And Humidity ◽  
Thermosetting Epoxy

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.

scholarly journals Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1545
Author(s):  
Agata Skwarek ◽  
Olivér Krammer ◽  
Tamás Hurtony ◽  
Przemysław Ptak ◽  
Krzysztof Górecki ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Zno Nanoparticles ◽  
Composite Solder ◽  
Void Formation ◽  
Particle Sizes ◽  
Solder Paste ◽  
Solder Alloys ◽  
Ion Microscopy ◽  
Zno Ceramics ◽  
Thermoelectric Parameters

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag3Sn and Cu6Sn5 intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

2018 ◽  
Vol 47 (7) ◽  
pp. 4165-4169 ◽  
Author(s):  
Yong-Gue Sung ◽  
Woo-Ram Myung ◽  
Haksan Jeong ◽  
Min-Kwan Ko ◽  
Jeonghoon Moon ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Mechanical Reliability ◽  
Surface Finishes

scholarly journals Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 936 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Intermetallic Compound ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Solder Paste ◽  
Shear Tests ◽  
Sac305 Solder ◽  
Epoxy Solder ◽  
The Relationship ◽  
Bonding Characteristics ◽  
Preventive Effects

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.

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