Investigating the drop impact of portable electronic products

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008269 ◽

2003 ◽

Cited By ~ 40

Author(s):

Lim CT ◽

Y.J. Low

Keyword(s):

Drop Impact ◽

Electronic Products

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Drop impact survey of portable electronic products

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216265 ◽

2004 ◽

Cited By ~ 57

Author(s):

C.T. Lim ◽

C.W. Ang ◽

L.B. Tan ◽

S.K.W. Seah ◽

E.H. Wong

Keyword(s):

Drop Impact ◽

Electronic Products

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Mechanical response of PCBs in portable electronic products during drop impact

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185609 ◽

2003 ◽

Cited By ~ 27

Author(s):

S.K.W. Seah ◽

C.T. Lim ◽

E.H. Wong ◽

V.B.C. Tan ◽

V.P.W. Shim

Keyword(s):

Mechanical Response ◽

Drop Impact ◽

Electronic Products

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A virtual boundary model for a quick drop-impact analysis of PCB in electronic products

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271528 ◽

2004 ◽

Author(s):

K.H. Low ◽

Yuqi Wang ◽

K.H. Hoon ◽

W.K. Wai

Keyword(s):

Impact Analysis ◽

Drop Impact ◽

Electronic Products ◽

Virtual Boundary ◽

Boundary Model

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Digital image correlation for analyzing portable electronic products during drop impact tests

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564683 ◽

2006 ◽

Cited By ~ 13

Author(s):

P.L.W. Scheijgrond ◽

D.X.Q. Shi ◽

W.D. van Driel ◽

G.Q. Zhang ◽

H. Nijmeijer

Keyword(s):

Digital Image Correlation ◽

Digital Image ◽

Drop Impact ◽

Image Correlation ◽

Electronic Products ◽

Impact Tests

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A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

Microelectronics Reliability ◽

10.1016/j.microrel.2011.07.093 ◽

2012 ◽

Vol 52 (1) ◽

pp. 90-99 ◽

Cited By ~ 151

Author(s):

Dhafer Abdulameer Shnawah ◽

Mohd Faizul Mohd Sabri ◽

Irfan Anjum Badruddin

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Drop Impact ◽

Electronic Products ◽

Impact Reliability ◽

Sac Solder

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Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards

10.32657/10356/5368 ◽

2008 ◽

Author(s):

Yuqi Wang

Keyword(s):

Impact Analysis ◽

Drop Impact ◽

Circuit Boards ◽

Electronic Products ◽

Multilayer Circuit Boards

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A Study of Factors Affecting Customer’s Attitude Toward Intention to Purchase Green Electronic Products at AN IT Mall in Beijing, China

International Conference on Business, Law and Corporate Social Responsibility (ICBLCSR'14) Oct 1-2, 2014 Phuket (Thailand) ◽

10.15242/icehm.ed1014041 ◽

2014 ◽

Keyword(s):

Electronic Products ◽

Factors Affecting ◽

Intention To Purchase ◽

Beijing China

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Guidance for evaluation of products with respect to substance-use restrictions in electrical and electronic products

10.3403/30177767 ◽

2010 ◽

Keyword(s):

Substance Use ◽

Electronic Products

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Environmental standardization for electrical and electronic products and systems. Glossary of terms

10.3403/30192174 ◽

2013 ◽

Keyword(s):

Electronic Products ◽

Environmental Standardization

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Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances

10.3403/30261478 ◽

2012 ◽

Keyword(s):

Hazardous Substances ◽

Technical Documentation ◽

Electronic Products

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