scholarly journals Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards

2008 ◽  
Author(s):  
Yuqi Wang
Keyword(s):  
Impact Analysis ◽  
Drop Impact ◽  
Circuit Boards ◽  
Electronic Products ◽  
Multilayer Circuit Boards

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

2006 ◽  
Vol 46 (2-4) ◽  
pp. 558-573 ◽  
Author(s):  
Yuqi Wang ◽  
K.H. Low ◽  
H.L.J. Pang ◽  
K.H. Hoon ◽  
F.X. Che ◽  
...  
Keyword(s):  
Modeling And Simulation ◽  
Printed Circuit Boards ◽  
Impact Analysis ◽  
Drop Impact ◽  
Circuit Boards ◽  
Printed Circuit

Mechanical Event Simulation of Drop Testing for Toy Product

2006 ◽  
Vol 532-533 ◽  
pp. 993-996
Author(s):  
Anthony Yee Kai Yam ◽  
Kai Leung Yung ◽  
Chi Wo Lam
Keyword(s):  
Material Properties ◽  
Impact Analysis ◽  
Plastic Material ◽  
Free Fall ◽  
Drop Impact ◽  
Local Analysis ◽  
Element Analysis ◽  
Event Simulation ◽  
Long Time ◽  
The Impact

Toys that are free from drop failures normally take a long time to develop. It is often time and cost consuming after the production tooling is built to detect drop test failure. This paper introduces a new drop testing analysis method for Toys. The method uses a simple approach with a local analysis that based on the linear and non linear finite element analysis. Modeling and transient drop analysis of a pre-school toy is used as a case study to demonstrate the method. The impact analysis of the product hitting the solid concrete floor after a free fall is presented. The analysis focuses on the deformation of the housing for a product with electronic circuit and mechanical mechanism inside. Experimental data has been obtained for drop simulation of the housing and its correlation with the plastic material properties. The stress and strain of the housing during drop impact tests are noted. The effects of the material properties to the housing deflection under drop/impact shock have been investigated. Numerical results are compared with experimental results to validate the method.

Power Inductors in Ceramic Multilayer Circuit Boards

2008 ◽  
Vol 5 (4) ◽  
pp. 161-168 ◽  
Author(s):  
Richard Matz ◽  
Dieter Götsch ◽  
Thomas Goßner ◽  
Roman Karmazin ◽  
Ruth Männer ◽  
...  
Keyword(s):  
Magnetic Coupling ◽  
Power Supplies ◽  
Circuit Boards ◽  
Mnzn Ferrite ◽  
Small Signal Analysis ◽  
Switched Mode Power Supplies ◽  
Power Inductors ◽  
Generic Design ◽  
Ring Core ◽  
Multilayer Circuit Boards

Power electronic inductors, with values of several μH, have been integrated into thermally stable ceramic multilayer circuit boards by the use of NiZnCu and MnZn ferrite tapes in low temperature cofired ceramic (LTCC) technology. These ferrites are particularly attractive for switched mode power supplies in automation, drives, and consumer applications, where the miniaturization of modules is triggered by advances in transistor technology and switching frequencies. The small signal analysis of embedded individual inductors and coupled transformer coils reveals the generic design rules for these components and additional materials properties beyond those accessible by ring core measurements. In the process of adapting the materials to LTCC, the distinct differences between the two materials become blurred, for example, they can be engineered to exhibit similar cutoff frequencies. NiZnCu ferrite, which is sinterable in air, may even achieve higher permeability than MnZn ferrite. The latter, however, shows higher saturation flux density and current capacity of buried inductors for power line filters. The coupled inductor design in a transformer is particularly ruled by the shunt capacitance inside the coils and by the fact that Maxwell equations preclude strong magnetic coupling between ferrite-embedded conductor lines. While parasitic capacitances remain tolerable for standard dielectric layer material up to several MHz, the need for magnetic coupling requires a fabrication process for magnetic vias.

A coupled thermal-drop impact analysis-based safety assessment of radioactive material cask

2018 ◽  
Vol 9 (2) ◽  
pp. 185-195 ◽  
Author(s):  
Qiang Liu ◽  
Shun-Peng Zhu ◽  
Zheng-Yong Yu ◽  
Ran Ding
Keyword(s):  
High Altitude ◽  
Nuclear Fuel ◽  
Safety Assessment ◽  
Impact Analysis ◽  
Fuel Cycle ◽  
Drop Impact ◽  
Radioactive Material ◽  
Assessment Procedure ◽  
Content Type ◽  
Fire Accidents

Purpose Transport is an integral part of the nuclear fuel cycle. The procedures employed are designed and conducted to ensure the public and environment protection both routinely and when transport accidents occur. According to this, the purpose of this paper is to focus on a coupled thermal-drop impact analysis-based safety assessment of a nuclear fuel cask. Design/methodology/approach For the cask, high altitude falling and fire accidents are the two most serious accidents during its transportation. In this paper, a sequentially coupled thermal-drop impact analysis is performed by using a nuclear fuel cask model for safety assessment. High altitude falling and fire accidents of the nuclear fuel cask were conducted by using finite element simulations for coupled thermal-drop impact analysis. Findings Results showed that the cask can withstand a drop test and survive a fire of 800°C for 30 minutes. In addition, an improved design is explored and evaluated, which provides a reference for structural design and safety assessment of nuclear fuel casks. Originality/value A coupled thermal-drop impact analysis-based safety assessment procedure is developed for the nuclear fuel cask.

An Surplus Asset Management Model for Environmental Impact Analysis of EOL Electronic Products

2009 ◽  
Author(s):  
Xueqing Qian ◽  
Hong-Chao Zhang ◽  
Bingbing Li
Keyword(s):  
Environmental Impact ◽  
Asset Management ◽  
Impact Analysis ◽  
Primary Objective ◽  
Prototype System ◽  
Environmentally Conscious ◽  
Electronic Products ◽  
Environmental Impact Analysis ◽  
Corporate Office ◽  
Environmentally Conscious Design

With increasing environmental regulations and waste management costs, environmentally conscious design and manufacturing (ECDM) and surplus asset recovery are becoming a more attractive approach to solve environmental problems. Any company that owns a collection of PCs, printers and other electronic accessories probably needs to manage these assets more effectively, but currently there is a lack of tools for effective management. Therefore, this paper discusses, from the viewpoint of an enterprise dealing with end-of-life electronic products, the recycling processes according to literature, and derives an integrated model on surplus asset management and environmental impact analysis. The primary objective of the model is to develop a certain tool for managing surplus asset within a corporate office and generate a decision making tool for those who are concerned with the environmental issues in the design or recycling phase. Based on this model, a prototype system is introduced in detail in this paper.

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