A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

2012 ◽  
Vol 52 (1) ◽  
pp. 90-99 ◽  
Author(s):  
Dhafer Abdulameer Shnawah ◽  
Mohd Faizul Mohd Sabri ◽  
Irfan Anjum Badruddin
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Drop Impact ◽  
Electronic Products ◽  
Impact Reliability ◽  
Sac Solder

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

2009 ◽  
Vol 49 (9-11) ◽  
pp. 1267-1272 ◽  
Author(s):  
M. Berthou ◽  
P. Retailleau ◽  
H. Frémont ◽  
A. Guédon-Gracia ◽  
C. Jéphos-Davennel
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Thermal Storage ◽  
Sac Solder

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

2012 ◽  
Vol 29 (1) ◽  
pp. 47-57 ◽  
Author(s):  
Dhafer Abdul Ameer Shnawah ◽  
Mohd Faizul Bin Mohd Sabri ◽  
Irfan Anjum Badruddin ◽  
Suhana Said
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Drop Impact ◽  
Alloying Elements ◽  
Impact Reliability

Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges

2009 ◽  
Author(s):  
Y. S. Chan ◽  
C. Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Relative Magnitude ◽  
Lead Free ◽  
Thermal Fatigue Life ◽  
Snpb Solder ◽  
Custom Made ◽  
Sac Solder

The present study evaluates the relative thermal fatigue life of tin-silver-copper (SnAgCu or SAC) lead-free and tin-lead (SnPb) solders with custom-made BGA assembly configurations generating various stress ranges under thermal cyclic loading. Although the SAC solder bears a lower creep strain rate compared with the SnPb solder in common thermal cycling conditions, it is found that there exits conditions at which the SnPb solder joint maintain a longer life than the SAC solder joint. The determination lies on the maximum normalized equivalent stress levels (σ/E) experienced by the two kinds of solder joint during the temperature cycles. Even under the same straining and thermal cycling condition, it is observed that the maximum σ/E induced in the two kinds of solder joint are normally different, as a result of their different rate of stress relaxation. The analysis shows that both the absolute and relative magnitude of σ/E experienced by the two kinds of solder joint affect the relative life. In general, the SAC solder joint sustain a longer life at low σ/E levels, while the SnPb solder joint outperform the SAC solder joint at high σ/E levels. There exists a critical σ/E level at which both solder joints acquire similar performance. However, this margin shifts with the relative magnitude of σ/E the two kinds of solder joint suffered. Having studied the variation of σ/E for the two kinds of solder joint under various loading conditions, this study uncovers the rationale for the difference in the relative thermal fatigue life of the two kinds of solder joint.

Drop impact reliability testing for lead-free and lead-based soldered IC packages

2006 ◽  
Vol 46 (7) ◽  
pp. 1160-1171 ◽  
Author(s):  
Desmond Y.R. Chong ◽  
F.X. Che ◽  
John H.L. Pang ◽  
Kellin Ng ◽  
Jane Y.N. Tan ◽  
...  
Keyword(s):  
Drop Impact ◽  
Lead Free ◽  
Reliability Testing ◽  
Impact Reliability

scholarly journals Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 733
Author(s):  
Lu Liu ◽  
Songbai Xue ◽  
Ruiyang Ni ◽  
Peng Zhang ◽  
Jie Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Paste ◽  
Epoxy System ◽  
Mechanical Reinforcement ◽  
Microstructure Observation ◽  
Temperature And Humidity ◽  
Thermosetting Epoxy

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.

Impact reliability estimation of lead free solder joint with IMC layer

2009 ◽  
Vol 517 (14) ◽  
pp. 4255-4259 ◽  
Author(s):  
Jong-Min Kim ◽  
Seung-Wan Woo ◽  
Yoon-Suk Chang ◽  
Young-Jin Kim ◽  
Jae-Boong Choi ◽  
...  
Keyword(s):  
Solder Joint ◽  
Reliability Estimation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability
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