Effect of material properties on the fatigue life of dual solder (DS) ceramic ball grid array (CBGA) solder joints

2002 ◽  
Author(s):  
K.J. Puttlitz ◽  
T. Caulfield ◽  
M. Cole
Keyword(s):  
Fatigue Life ◽  
Material Properties ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Ceramic Ball

Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability

1994 ◽  
Vol 116 (4) ◽  
pp. 242-248 ◽  
Author(s):  
Teh-Hua Ju ◽  
Wei Lin ◽  
Y. C. Lee ◽  
Jay J. Liu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Printed Wiring Board ◽  
Ceramic Ball ◽  
Solder Volume ◽  
Bga Package ◽  
Reliability Of Solder Joints ◽  
Wiring Board

The effects of manufacturing variations on the reliability of solder joints between a ceramic ball grid array (BGA) package and a printed wiring board (PWB) are investigated. Two cases are studied, namely, with and without spacers between the BGA package and the PWB to maintain the solder joint height. Manufacturing variations considered include changes in solder volume, joint height, and pad size. To evaluate the effect of manufacturing variations on reliability, every possible solder joint profile is first derived. The maximum strain is calculated next. Finally, the fatigue life is predicted. The calculations show that these manufacturing variations change the joint profile, and subsequently affect the fatigue life. Since the package is heavy, the use of spacers is necessary to control the solder joint height for reliable connections, and to maintain a large gap for cleaning. The solder joints formed with the use of spacers, may have convex, cylindrical or concave profiles. The concave solder joints are preferred, since they have long fatigue lives and are less sensitive to the manufacturing variations. For the convex solder joints, their fatigue lives are strongly affected by the joint height variation caused by package warpage and by the combined effects of solder volume and pad size.

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

2021 ◽  
Author(s):  
Tae-Yong Park ◽  
Hyun-Ung Oh
Keyword(s):  
Fatigue Life ◽  
Random Vibration ◽  
Critical Strain ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Mechanical Design ◽  
Ball Grid Array ◽  
Primary Objective ◽  
Circuit Board ◽  
Analytical Approaches

Abstract To overcome the theoretical limitations of Steinberg's theory for evaluating the mechanical safety of the solder joints of spaceborne electronics in a launch random vibration environment, a critical strain-based methodology was proposed and validated in a previous study. However, for the critical strain-based methodology to be used reliably in the mechanical design of spaceborne electronics, its effectiveness must be validated under various conditions of the package mounting locations and the first eigenfrequencies of a printed circuit board (PCB); achieving this validation is the primary objective of this study. For the experimental validation, PCB specimens with ball grid array packages mounted on various board locations were fabricated and exposed to a random vibration environment to assess the fatigue life of the solder joint. The effectiveness of the critical strain-based methodology was validated through a comparison of the fatigue life of the tested packages and their margin of safety, which was estimated using various analytical approaches.

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

2017 ◽  
Author(s):  
Deng Yun Chen ◽  
Michael Osterman
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Material Properties ◽  
Solder Joints ◽  
Material Selection ◽  
Temperature Cycling ◽  
Sac305 Solder ◽  
Element Analysis ◽  
Bga Packages ◽  
The Impact

Solder interconnects in electronic assemblies are susceptible to failures due to environmental high strain rate impact and cyclic stresses. To mitigate the failures, adhesive bonds can be added after the solder assembly process to provide additional mechanical support. For ball grid array (BGA) packages, the adhesive is normally applied to the corners of the package and referred to as corner staking. In addition to corner staking, underfill is also a strategy used to mitigate the stresses on the solder joints. While components with underfill has been widely studied, the study of the impact of corner staking on the reliability of packages remains limited. This paper presents a study of corner-staked BGA packages with tin-3.0 silver-0.5 copper (SAC305) solder subjected to temperature cycling. Experimental temperature cycling is conducted to examine impact of the selected corner staking material on the fatigue life of BGAs. Further, finite element analysis is conducted to understand the influence of material properties of staking material on the fatigue life of BGAs. The result of the study indicates that the presence of corner staking, with selected material properties, reduces the damage on the solder joints under thermal cycling, and thus increases its fatigue life by about 80%. This paper may serve as a guidance for staking material selection to improve the fatigue life of solder joints of BGAs under thermal cycling.

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

1998 ◽  
Vol 120 (1) ◽  
pp. 54-60 ◽  
Author(s):  
Y. Li ◽  
R. L. Mahajan ◽  
G. Subbarayan
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Maximum Strain ◽  
Stencil Printing ◽  
Eutectic Solder ◽  
Printing Process ◽  
Ceramic Ball ◽  
Ball Grid Arrays ◽  
Solder Volume ◽  
Plastic Ball

As a follow-up and conclusion to previous work in stencil printing process modeling and optimization (Li et al., 1996), we investigate the effect of stencil printing optimization on the reliability of the ceramic and plastic ball grid arrays. For ceramic ball grid arrays, the eutectic solder fillet shape is calculated using a series of simple mathematical equations. The thermal strain distributions within the solder joints after two cycles of accelerated thermal cycling test are estimated using three-dimensional finite element models. The modified Coffin-Manson relationship is applied to calculate the mean fatigue lives of the solder joints. The results reveal that an optimized stencil printing process significantly reduces variation in the fatigue life of ceramic ball grid arrays. The results also show that the fatigue life of ceramic ball grid arrays is very sensitive to the card-side solder volume. The maximum strain region shifts from the card-side eutectic solder to the module side as the card-side eutectic solder volume increases. This shift in maximum strain suggests that there exists an optimum ratio between the card-side solder volume and the module-side solder volume for the reliability of a given ceramic ball grid array design. The implications of this for the package developers and users are discussed. The calculations indicate that the fatigue life of plastic ball grid arrays is almost insensitive to the card-side solder volume.

Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests

2002 ◽  
Author(s):  
T. E. Wong ◽  
C. Y. Lau ◽  
L. A. Kachatorian ◽  
H. S. Fenger ◽  
I. C. Chen
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Design Parameters ◽  
Physical Analysis ◽  
Printed Wiring Board ◽  
Thermal Fatigue Life ◽  
The Impact

The objective of the present study is to evaluate the impact of electronic packaging design/manufacturing process parameters on the thermal fatigue life of ball grid array (BGA) solder joints. The four selected parameters are BGA under-fill materials, conformal coating, solder pad sizes on printed wiring board, and BGA rework, with each having either two or three levels of variation. A test vehicle (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed and fabricated, and then subjected to temperature cycling (−55°C to +125°C) with continuous monitoring of solder joint integrity. The total of 15 experimental cases is used in the present study. Based on monitored results, a destructive physical analysis is conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Test results indicate that the influence of these design parameters on fatigue life is dependent on the particular package, in some instances improving the fatigue life tenfold.

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

2011 ◽  
Author(s):  
Yuji Nishimura ◽  
Qiang Yu
Keyword(s):  
Fatigue Life ◽  
Material Properties ◽  
Solder Joints ◽  
Test Method ◽  
Fatigue Properties ◽  
Simulation Approach ◽  
Fiber Network ◽  
Heterogeneous Model ◽  
Isothermal Fatigue ◽  
Simulation Results

Recently, the downsizing of car components becomes a big trend for the development of car electronics, and it is becoming very difficult to achieve the reliability results target without managing controlling the dispersion of the fatigue lives. The authors proposed an isothermal fatigue test method using small size solder joints to get the fatigue properties. The Manson-Coffin’s law given by this method could improve the correspondence between the simulation results and experimental results. Based upon the Manson-Coffin’s law and Miner’s law, the authors proposed a fatigue crack propagation simulation approach. Furthermore, in order to consider the heterogeneity of PCB due to the distribution of fiber network, the authors made heterogeneous model considering the distribution of the fiber. And the authors evaluated the fatigue life of solder joints in chip components with considering dispersion of the material properties by using the heterogeneous model.

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