Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

Author(s):  
Yuji Nishimura ◽  
Qiang Yu

Recently, the downsizing of car components becomes a big trend for the development of car electronics, and it is becoming very difficult to achieve the reliability results target without managing controlling the dispersion of the fatigue lives. The authors proposed an isothermal fatigue test method using small size solder joints to get the fatigue properties. The Manson-Coffin’s law given by this method could improve the correspondence between the simulation results and experimental results. Based upon the Manson-Coffin’s law and Miner’s law, the authors proposed a fatigue crack propagation simulation approach. Furthermore, in order to consider the heterogeneity of PCB due to the distribution of fiber network, the authors made heterogeneous model considering the distribution of the fiber. And the authors evaluated the fatigue life of solder joints in chip components with considering dispersion of the material properties by using the heterogeneous model.

2010 ◽  
Vol 25 (2) ◽  
pp. 303-314 ◽  
Author(s):  
QingKe Zhang ◽  
HeFei Zou ◽  
Zhe-Feng Zhang

To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu–X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu–X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu–X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu–X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn–Bi solder widely used in the electronic interconnection in the future.


Author(s):  
Deng Yun Chen ◽  
Michael Osterman

Solder interconnects in electronic assemblies are susceptible to failures due to environmental high strain rate impact and cyclic stresses. To mitigate the failures, adhesive bonds can be added after the solder assembly process to provide additional mechanical support. For ball grid array (BGA) packages, the adhesive is normally applied to the corners of the package and referred to as corner staking. In addition to corner staking, underfill is also a strategy used to mitigate the stresses on the solder joints. While components with underfill has been widely studied, the study of the impact of corner staking on the reliability of packages remains limited. This paper presents a study of corner-staked BGA packages with tin-3.0 silver-0.5 copper (SAC305) solder subjected to temperature cycling. Experimental temperature cycling is conducted to examine impact of the selected corner staking material on the fatigue life of BGAs. Further, finite element analysis is conducted to understand the influence of material properties of staking material on the fatigue life of BGAs. The result of the study indicates that the presence of corner staking, with selected material properties, reduces the damage on the solder joints under thermal cycling, and thus increases its fatigue life by about 80%. This paper may serve as a guidance for staking material selection to improve the fatigue life of solder joints of BGAs under thermal cycling.


1992 ◽  
Vol 114 (2) ◽  
pp. 104-108 ◽  
Author(s):  
Z. Mei ◽  
J. W. Morris

This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with three different initial microstructures by quenching, air-cooling, and furnace-cooling. The test results show that the quench-solidified solder joints have isothermal fatigue lives of about twice long as those of the furnace cooled solder joints tested at 20°C and 65°C with the straining rates of about 10−4 per s. These results are ascribed to the refined grain size and less lamellar phase morphology that results on increasing the cooling rate.


Author(s):  
Haitao Zhang ◽  
Ke Li

Abstract Fatigue is one of the most frequently encountered failure modes of rotary shouldered connections (RSC) used in drill strings. Once initiated, a fatigue crack tends to grow and ultimately lead to a twist-off, which is catastrophic and often results in lengthy non-producing time and expensive fishing operations. The complexity of the fatigue mechanism, the variabilities of material properties, and the nonlinear contact interactions of the pin and the box elements of an RSC pose a substantial challenge to accurately predicting the fatigue life of the RSC. This would require considerable conservatism to be exercised to prevent a twist-off, which causes premature retirement of drilling assets. Using a statistical approach to predict the risk of twist-off (ROTO) of each RSC on the drill string could be a more economically viable solution as it would enable quantified risk assessment and scientifically calculated tradeoffs between performance, cost, and risk of failures. In this study, a methodology for statistical prediction of the ROTO of rotary shouldered threaded connections was developed. First, static material properties, including yield strength, tensile strength, elongation, and reduction in area, were extracted from a wealth of available material certificates. Feature engineering was carried out to arrive at two independent properties, tensile strength and reduction in area. Fatigue properties were then generated with the retrieved static material data and earlier established correlations between static and fatigue properties. Afterwards, elasto-plastic finite element analyses were performed on RSCs made of the same material but with different properties to determine critical fatigue indicators, stress and strain states as respective functions of the tensile strength. Finally, Monte-Carlo simulations were conducted with respect to statistical distributions of the two independent material variables to predict the ROTO as a function of fatigue life. The predictions were found to be favorable agreement with the available full-scale fatigue test data of an API connection type.


2015 ◽  
Vol 21 (6) ◽  
pp. 675-685 ◽  
Author(s):  
Jacob P. Moore ◽  
Christopher B. Williams

Purpose – This paper aims to seek to fill a gap in the literature by characterizing the fatigue life and microstructure of a printed elastomer material, the TangoBlackPlus material. Design/methodology/approach – Because the TangoBlackPlus material is marketed as “rubber-like”, the printed elastomer specimens were tested according to the ASTM D4482-11 “Test Method for Rubber Property Extension Cycling Fatigue”. The microstructure of the printed material and multi-material interface was examined by slicing specimens and examining them under an optical microscope. Findings – Findings are developed to show the relationship between elongation and expected fatigue life. Findings also indicate that the smoother, non-support encased “glossy” surface finish option for PolyJet parts improve the fatigue life of components and that there are a number of microscopic voids in the TangoBlackPlus material that seem to be concentrated at layer and print head boundaries. Research limitations/implications – This paper provides a glimpse into the fatigue properties and microstructure of printed elastomeric parts, a previously unstudied area. This work is limited in that it only looks at specimens created in a single orientation, on a single machine, with a single material. More work is needed to understand the general fatigue properties of printed elastomers and the factors that influence fatigue life in these materials. Practical implications – The authors provide several design guidelines based on the findings and previous work that can be used to increase the fatigue life of printed elastomer components. Originality/value – As additive manufacturing (AM) technology moves from a prototyping tool to a tool used to create end use products, it is important to examine the expected lifespan of AM components. This work adds to the understanding of the expected product lifecycle of printed elastomer components that will likely be expected to withstand large repeated loading conditions.


SPE Journal ◽  
2008 ◽  
Vol 13 (04) ◽  
pp. 480-486 ◽  
Author(s):  
Trent M.V. Kaiser ◽  
Victor Y.B. Yung ◽  
Russ M. Bacon

Summary This paper describes differences between actual material behavior and idealizations used for modeling purposes and discusses some of the implications for interpreting model predictions. Much of the design for well structures subjected to high-amplitude cyclic loading is based on material assumptions that extrapolate strength properties from uniaxial, tensile tests to conditions where multiaxial, cyclic stresses are imposed. This paper presents results from cyclic testing on a common oil-country-tubular-goods (OCTG) material and demonstrates differences between the physical behavior measured under cyclic loading conditions and theoretical behavior extrapolated by numerical modeling. Modeling theories for plastic deformation are discussed with their limitations and relevance in a cyclic-loading environment. The implications of these limitations for design choices in thermal wells also are discussed with example applications of cyclic material behavior and fatigue-life prediction. Material fatigue properties for the high-amplitude, low-cycle application of thermal operations have not been investigated in much depth previously, particularly for OCTG. Along with characterizing cyclic mechanical properties, the tests discussed here also assessed the low-cycle fatigue properties of the sample OCTG steel. The consistent fatigue measurements, combined with analysis results using representative cyclic mechanical properties, can provide a basis for estimating fatigue life. Depending on analysis-model assumptions, substantial variation in predicted fatigue life can occur; therefore, exact fatigue-life predictions are not anticipated. The primary value in such modeling is in evaluating the relative effectiveness of mitigation options for extending well life. Introduction Most thermal enhanced-oil-recovery (EOR) wells in western Canada operate using either the cyclic-steam-stimulation (CSS) or the steam-assisted-gravity-drainage (SAGD) method. In both methods, operational factors result in thermal cycles being imposed on the well structures, particularly in the intermediate casing (Placido et al. 1997). Thermal expansion is constrained by the formation and cement in CSS and SAGD wells, producing loads that exceed the yield strength of the tubulars when the well is heated. Localization mechanisms also might amplify the strain magnitude, imposing additional plastic fatigue load at discrete locations along the well structure. Thermal-well casing designs have evolved during more than 30 years of operating experience, and much of the computer modeling that describes casing performance is based on measured uniaxial tensile material properties that are extrapolated to multidimensional cyclic behavior through engineering models. Cyclic material-properties data are sparse, particularly in the temperature regime common in thermal-recovery wells. Furthermore, plastic fatigue-life information for materials commonly used in well construction is difficult to obtain. Such information, however, is required to make reliable predictions of certain deformation mechanisms and the associated fatigue life for wells exposed to cyclic, thermally imposed loading. A test program for characterizing cyclic material properties was implemented to evaluate both cyclic mechanical properties and low-cycle fatigue life. Test-result consistency indicates a reliable material characterization that can be applied in constitutive analysis models and component-life assessments. The observed cyclic-stress-strain material behavior also demonstrates different characteristics from those predicted through engineering models using uniaxial monotonic material properties for input. This has important implications for thermal-well design and operations.


2004 ◽  
Vol 127 (3) ◽  
pp. 237-244 ◽  
Author(s):  
Tae-Sang Park ◽  
Soon-Bok Lee

To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63Sn∕37Pb and Sn∕3.5Ag∕0.75Cu solder joints in room temperature. The mechanical low cycle fatigue tests were performed under several loading angles. The loading angle is controlled by several grips which have specific surface angle to the loading direction. Constant displacement controlled tests are performed using a micro-mechanical test apparatus. It was found that the normal deformation significantly affects the fatigue life of the solder joint. Throughout the whole test conditions at room temperature, Sn∕3.5Ag∕0.75Cu solder alloy had longer fatigue life than 63Sn∕37Pb alloy. Failure patterns of the fatigue tests were observed and discussed. A morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints under mixed mode loading condition.


1999 ◽  
Vol 122 (3) ◽  
pp. 200-206 ◽  
Author(s):  
Xiaowu Zhang ◽  
S-W. Ricky Lee ◽  
Yi-Hsin Pao

Thermal fatigue of solder joints is critical to the performance and reliability of electronic components. It is well known that the fatigue life of solder joints is rather difficult to be estimated because of the complicated material behaviors and solder joint geometry. Conventional life prediction methods such as Coffin-Manson equation or its modifications usually over-estimate the thermal fatigue life. The main reason for this phenomenon is that the material properties are assumed constant during thermal cycling. In this paper, a damage evolution model is introduced for predicting the thermal fatigue life of solder joints. This method not only considers the degradation of material properties in the solder, but also saves substantial computational effort. In the present study, a damage function is determined by the hysteresis loops of creep shear stress-strain of solder joints in a double-beam specimen. The proposed model is then applied to investigate the solder joint reliability of a 272 PBGA package and a bottom-leaded plastic (BLP) package for model verification. The results from the present analysis seem to be encouraging. [S1043-7398(00)01003-3]


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