scholarly journals Copper-diamond composite substrates for electronic components

2002 ◽  
Author(s):  
H.L. Davidson ◽  
N.J. Colella ◽  
J.A. Kerns ◽  
D. Makowiecki
Keyword(s):  
Electronic Components ◽  
Diamond Composite ◽  
Composite Substrates

scholarly journals Soldering of Electronics Components on 3D-Printed Conductive Substrates

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3850
Author(s):  
Bartłomiej Podsiadły ◽  
Andrzej Skalski ◽  
Marcin Słoma
Keyword(s):  
Additive Manufacturing ◽  
Solder Joints ◽  
Rapid Development ◽  
Surface Preparation ◽  
Contact Angles ◽  
Electronic Components ◽  
Optimal Method ◽  
Structural Electronics ◽  
3D Printed ◽  
Composite Substrates

Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One way to produce complex structural electronic circuits is to merge 3D-printed elements with standard electronic components. Here, different soldering and surface preparation methods before soldering are tested to find the optimal method for soldering typical electronic components on conductive, 3D-printed, composite substrates. To determine the optimal soldering condition, the contact angles of solder joints fabricated in different conditions were measured. Additionally, the mechanical strength of the joints was measured using the shear force test. The research shows a possibility of fabricating strong, conductive solder joints on composites substrates prepared by additive manufacturing. The results show that mechanical cleaning and using additional flux on the composite substrates are necessary to obtain high-quality solder joints. The most repeatable joints with the highest shear strength values were obtained using reflow soldering together with low-temperature SnBiAg solder alloy. A fabricated demonstrator is a sample of the successful merging of 3D-printed structural electronics with standard electronic components.

Phonon conduction in GaN-diamond composite substrates

2017 ◽  
Vol 121 (5) ◽  
pp. 055105 ◽  
Author(s):  
Jungwan Cho ◽  
Daniel Francis ◽  
David H. Altman ◽  
Mehdi Asheghi ◽  
Kenneth E. Goodson
Keyword(s):  
Diamond Composite ◽  
Phonon Conduction ◽  
Composite Substrates

Multilayer Composite Diamond Heat Spreaders for Electronic Packaging

1996 ◽  
Vol 445 ◽  
Author(s):  
K. Jagannadham ◽  
W. D. Fan ◽  
R. B. Dinwidde ◽  
J. Narayan
Keyword(s):  
Electronic Device ◽  
Single Layer ◽  
Heat Spreader ◽  
Microscopy Imaging ◽  
Diamond Composite ◽  
Heat Spreaders ◽  
Composite Diamond ◽  
Composite Substrates ◽  
Composite Heat ◽  
Heat Spreading

AbstractHeat spreader characteristics of single layer and multilayer diamond composite substrates are determined by bonding to electronic device wafers. Preparation of diamond substrates, metallization and bonding procedures to device wafers are described. Infrared microscopy imaging of the bonded device wafers is used to determine the heat spreading characteristics. Advantages associated with multilayer diamond composite heat spreaders are discussed.

Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT Applications

2013 ◽  
Vol 3 (1) ◽  
pp. 79-85 ◽  
Author(s):  
Jungwan Cho ◽  
Zijian Li ◽  
Elah Bozorg-Grayeli ◽  
Takashi Kodama ◽  
Daniel Francis ◽  
...  
Keyword(s):  
Diamond Composite ◽  
Thermal Interfaces ◽  
Composite Substrates
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