Soldering of Electronics Components on 3D-Printed Conductive Substrates

Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One way to produce complex structural electronic circuits is to merge 3D-printed elements with standard electronic components. Here, different soldering and surface preparation methods before soldering are tested to find the optimal method for soldering typical electronic components on conductive, 3D-printed, composite substrates. To determine the optimal soldering condition, the contact angles of solder joints fabricated in different conditions were measured. Additionally, the mechanical strength of the joints was measured using the shear force test. The research shows a possibility of fabricating strong, conductive solder joints on composites substrates prepared by additive manufacturing. The results show that mechanical cleaning and using additional flux on the composite substrates are necessary to obtain high-quality solder joints. The most repeatable joints with the highest shear strength values were obtained using reflow soldering together with low-temperature SnBiAg solder alloy. A fabricated demonstrator is a sample of the successful merging of 3D-printed structural electronics with standard electronic components.

Printed Graphene, Nanotubes and Silver Electrodes Comparison for Textile and Structural Electronics Applications

Due to the appearance of smart textiles and wearable electronics, the need for electro-conductive textiles and electro-conductive paths on textiles has become clear. In this article the results of a test of developed textile electro-conductive paths obtained by applying the method of screen printing pastes containing silver nanoparticles and carbon (graphene, nanotubes, graphite) are presented. Conducted research included analysis of the adhesion test, as well as evaluation of the surface resistance before and after the washing and bending cycles. Obtained results indicated that the samples with the content of carbon nanotubes 3% by weight in PMMA on substrate made of aramid fibers (surface mass of 260 g/m2) were characterized by the best adhesion and the best resistance to washing and bending cycles. Such electro-conductive paths have potential to be used in smart clothing applications.

Carbon Nanotube-Based Composite Filaments for 3D Printing of Structural and Conductive Elements

In this publication, we describe the process of fabrication and the analysis of the properties of nanocomposite filaments based on carbon nanotubes and acrylonitrile butadiene styrene (ABS) polymer for fused deposition modeling (FDM) additive manufacturing. Polymer granulate was mixed and extruded with a filling fraction of 0.99, 1.96, 4.76, 9.09 wt.% of CNTs (carbon nanotubes) to fabricate composite filaments with a diameter of 1.75 mm. Detailed mechanical and electrical investigations of printed test samples were performed. The results demonstrate that CNT content has a significant influence on mechanical properties and electrical conductivity of printed samples. Printed samples obtained from high CNT content composites exhibited an improvement in the tensile strength by 12.6%. Measurements of nanocomposites’ electrical properties exhibited non-linear relation between the supply voltage and measured sample resistivity. This effect can be attributed to the semiconductor nature of the CNT functional phase and the occurrence of a tunnelling effect in percolation network. Detailed I–V characteristics related to the amount of CNTs in the composite and the supply voltage influence are also presented. At a constant voltage value, the average resistivity of the printed elements is 2.5 Ωm for 4.76 wt.% CNT and 0.15 Ωm for 9.09 wt.% CNT, respectively. These results demonstrate that ABS/CNT composites are a promising functional material for FDM additive fabrication of structural elements, but also structural electronics and sensors.