Phonon conduction in GaN-diamond composite substrates

2017 ◽  
Vol 121 (5) ◽  
pp. 055105 ◽  
Author(s):  
Jungwan Cho ◽  
Daniel Francis ◽  
David H. Altman ◽  
Mehdi Asheghi ◽  
Kenneth E. Goodson
Keyword(s):  
Diamond Composite ◽  
Phonon Conduction ◽  
Composite Substrates

Multilayer Composite Diamond Heat Spreaders for Electronic Packaging

1996 ◽  
Vol 445 ◽  
Author(s):  
K. Jagannadham ◽  
W. D. Fan ◽  
R. B. Dinwidde ◽  
J. Narayan
Keyword(s):  
Electronic Device ◽  
Single Layer ◽  
Heat Spreader ◽  
Microscopy Imaging ◽  
Diamond Composite ◽  
Heat Spreaders ◽  
Composite Diamond ◽  
Composite Substrates ◽  
Composite Heat ◽  
Heat Spreading

AbstractHeat spreader characteristics of single layer and multilayer diamond composite substrates are determined by bonding to electronic device wafers. Preparation of diamond substrates, metallization and bonding procedures to device wafers are described. Infrared microscopy imaging of the bonded device wafers is used to determine the heat spreading characteristics. Advantages associated with multilayer diamond composite heat spreaders are discussed.

Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT Applications

2013 ◽  
Vol 3 (1) ◽  
pp. 79-85 ◽  
Author(s):  
Jungwan Cho ◽  
Zijian Li ◽  
Elah Bozorg-Grayeli ◽  
Takashi Kodama ◽  
Daniel Francis ◽  
...  
Keyword(s):  
Diamond Composite ◽  
Thermal Interfaces ◽  
Composite Substrates

Affordable PbO2 anode on conductive polymer‑carbon composite substrates for non-heavy duty use

2020 ◽  
Vol 877 ◽  
pp. 114610
Author(s):  
Likun Zhao ◽  
Boxue Lv ◽  
Zhicheng Wang ◽  
Dingding Tang ◽  
Jiaxin Cui ◽  
...  
Keyword(s):  
Conductive Polymer ◽  
Carbon Composite ◽  
Heavy Duty ◽  
Composite Substrates ◽  
Pbo2 Anode
Sign in / Sign up

Export Citation Format

Share Document