Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

2002 ◽  
Author(s):  
J.N. Sweet ◽  
D.W. Peterson ◽  
J.A. Emerson
Keyword(s):  
Mechanical Stress ◽  
Stress Measurement ◽  
Test Chip

Instabilities in the Mechanical Stress in Deposited SiO2 Films Caused by Thermal Treatments

1990 ◽  
Vol 181 ◽  
Author(s):  
Bharat Bhushan ◽  
S.P. Murarka
Keyword(s):  
Heat Treatment ◽  
Mechanical Stress ◽  
Stress Measurement ◽  
In Situ Stress ◽  
Thermal Treatments ◽  
Heat Treated ◽  
Large Hysteresis ◽  
In Situ Stress Measurement ◽  
Deposited Films

ABSTRACTUsing an in-situ stress measurement technique that measures stress as a function of annealing temperature, instabilities in mechanical stress induced by heat treatment in a variety of doped/undoped SiO2 films deposited by APCVD, LPCVD and PECVD techniques have been investigated. A large hysteresis in mechanical stress, caused by first heat treatment to which the as-deposited films are subjected, has been observed in films deposited by APCVD/LPCVD techniques. No such hysteresis is obsesrved in films deposited by PECVD technique. Hysteresis in APCVD/LPCVD films is found to vanish once the films are heat treated at or above 800°C. The results are discussed in terms of oxide densification, the presence of hydrogenous species, and phosphorous.

scholarly journals Microwave Sensor for Mechanical Stress Measurement Based on Ferroelectric Graphene Nanosheet Composites

2014 ◽  
Vol 87 ◽  
pp. 124-127 ◽  
Author(s):  
Alexander Aman ◽  
Soeren Majcherek ◽  
Marc-Peter Schmidt ◽  
Soeren Hirsch
Keyword(s):  
Mechanical Stress ◽  
Stress Measurement ◽  
Graphene Nanosheet ◽  
Microwave Sensor

An Approach for Characterizing Residual Mechanical Stress Caused by Packaging Processes

2006 ◽  
Vol 969 ◽  
Author(s):  
Soeren Hirsch ◽  
Bertram Schmidt
Keyword(s):  
Finite Element Method ◽  
Mechanical Stress ◽  
Flip Chip ◽  
Finite Element Method Simulation ◽  
Stress Profile ◽  
Test Chip ◽  
Resistor Network ◽  
Mems Sensor ◽  
Chip Technology ◽  
Residual Mechanical Stress

Abstractthis paper reports on a method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon membranes was fabricated. Finite element method simulation was calculate the stress profile and to determine the optimum positions for placing the resistor network.

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