scholarly journals High accuracy die mechanical stress measurement with the ATC04 Assembly Test Chip

1993 ◽  
Author(s):  
J.N. Sweet ◽  
D.W. Peterson
Keyword(s):  
Mechanical Stress ◽  
Stress Measurement ◽  
High Accuracy ◽  
Test Chip

Instabilities in the Mechanical Stress in Deposited SiO2 Films Caused by Thermal Treatments

1990 ◽  
Vol 181 ◽  
Author(s):  
Bharat Bhushan ◽  
S.P. Murarka
Keyword(s):  
Heat Treatment ◽  
Mechanical Stress ◽  
Stress Measurement ◽  
In Situ Stress ◽  
Thermal Treatments ◽  
Heat Treated ◽  
Large Hysteresis ◽  
In Situ Stress Measurement ◽  
Deposited Films

ABSTRACTUsing an in-situ stress measurement technique that measures stress as a function of annealing temperature, instabilities in mechanical stress induced by heat treatment in a variety of doped/undoped SiO2 films deposited by APCVD, LPCVD and PECVD techniques have been investigated. A large hysteresis in mechanical stress, caused by first heat treatment to which the as-deposited films are subjected, has been observed in films deposited by APCVD/LPCVD techniques. No such hysteresis is obsesrved in films deposited by PECVD technique. Hysteresis in APCVD/LPCVD films is found to vanish once the films are heat treated at or above 800°C. The results are discussed in terms of oxide densification, the presence of hydrogenous species, and phosphorous.

scholarly journals Improvement of the Conical-ended Borehole Technique for Rock Stress Measurement with a High Accuracy.

1997 ◽  
Vol 113 (11) ◽  
pp. 825-831 ◽  
Author(s):  
Yuzo OBARA ◽  
Keita IMAI ◽  
Naoaki NAKAMURA ◽  
Katsuhiko SUGAWARA
Keyword(s):  
Stress Measurement ◽  
High Accuracy ◽  
Rock Stress

scholarly journals Microwave Sensor for Mechanical Stress Measurement Based on Ferroelectric Graphene Nanosheet Composites

2014 ◽  
Vol 87 ◽  
pp. 124-127 ◽  
Author(s):  
Alexander Aman ◽  
Soeren Majcherek ◽  
Marc-Peter Schmidt ◽  
Soeren Hirsch
Keyword(s):  
Mechanical Stress ◽  
Stress Measurement ◽  
Graphene Nanosheet ◽  
Microwave Sensor

An Approach for Characterizing Residual Mechanical Stress Caused by Packaging Processes

2006 ◽  
Vol 969 ◽  
Author(s):  
Soeren Hirsch ◽  
Bertram Schmidt
Keyword(s):  
Finite Element Method ◽  
Mechanical Stress ◽  
Flip Chip ◽  
Finite Element Method Simulation ◽  
Stress Profile ◽  
Test Chip ◽  
Resistor Network ◽  
Mems Sensor ◽  
Chip Technology ◽  
Residual Mechanical Stress

Abstractthis paper reports on a method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon membranes was fabricated. Finite element method simulation was calculate the stress profile and to determine the optimum positions for placing the resistor network.

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