Solder joint reliability of surface mount chip resistors/capacitors on insulated metal substrates

2002 ◽  
Author(s):  
J.C. Suhling ◽  
R.W. Johnson ◽  
J.D. White ◽  
K.W. Matthai ◽  
R.W. Knight ◽  
...  
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Metal Substrates ◽  
Surface Mount ◽  
Joint Reliability

Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components

1993 ◽  
Vol 115 (2) ◽  
pp. 195-200 ◽  
Author(s):  
D. B. Barker ◽  
Y. S. Chen ◽  
A. Dasgupta
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Finite Element Modeling ◽  
Stress Analysis ◽  
Empirical Equation ◽  
Solder Joint Reliability ◽  
Surface Mount ◽  
Joint Reliability ◽  
Vibration Fatigue

This paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. A simple approximate stress analysis is presented that does not require complex finite element modeling, nor does it reduce the problem to a simple empirical equation or rule of thumb. The goal of the new method is to make PWB vibration solder joint reliability information available to the designer as early as possible and in an easily understood and implemented manner.

Surface Mount Technology (SMT) Substrate Material Requirements - A Brief Review

1987 ◽  
Vol 108 ◽  
Author(s):  
A. Mahammad Ibrahim
Keyword(s):  
Dielectric Constant ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Substrate Material ◽  
Surface Mount Technology ◽  
Solder Joint Reliability ◽  
Surface Mount ◽  
Printed Circuit ◽  
Joint Reliability ◽  
Out Of Plane

ABSTRACTThe state of the art for the printed circuit (pc) industry is the Surface Mount Technology (SMT) using leadless ceramic chip carriers (LCCCs). The SMT technique is used to design, fabricate, and assemble affordable high-speed, high-density electronic modules with reduced size and weight. However, to take full advantage of the SMT, new high-performance printed circuit board (PCB) substrate materials must be developed, especially if the goal is to satisfy the high reliability required in military applications. The most critical requirement is matching the in-plane coefficient of thermal expansion (CTE) with the SMT-PCB's and the chip carriers (LCCCs) to reduce the solderjoint stresses during thermal cycling. Solder-joint reliability can be improved significantly by tailoring the in-plane CTE to approximately 6–7 ppm/°C (of the alumina chip carrier) using Kevlar and/or quartz fabric-reinforced polymer composites, instead of conventional glass composites. Less attention has been focussed on other important requirements, e.g., out-of-plane (Z-axis) expansion, glass transition temperature (Tg), dielectric constant, and resin microcracking, which also play important roles in the overall performance of the substrate materials. For example, high Z-expansion puts additional strain on the plated through holes (PTH), thereby affecting PTR reliability. A low Tg significantly increases the amount of thermal stress imposed during thermal cycling on solder joints and PTH, and leads to failures. This paper contains a brief review of the requirements of a SMT-PCB substrate material, including such critical parameters as: in-plane CTE, out-of-plane CTE, Tg, dielectric constant, fiber-to-resin ratio, and resin microcracking, and their effects on solder joint reliability, PTH reliability, dimensional stability, and electrical performance.

Solder Joint Reliability of Surface Mount Connectors

1993 ◽  
Vol 115 (2) ◽  
pp. 180-188 ◽  
Author(s):  
J. Lau ◽  
T. Marcotte ◽  
J. Severine ◽  
A. Lee ◽  
S. Erasmus ◽  
...  
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Experimental Methods ◽  
Test Methods ◽  
Solder Joint Reliability ◽  
Surface Mount ◽  
Joint Reliability

The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the reliability of the solder joints of surface mount connectors has been recommended.

Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

2011 ◽  
Author(s):  
Siddharth Bhopte ◽  
Parthiban Arunasalam ◽  
Fadi Alsaleem ◽  
Arvind Rao ◽  
Nataraj Hariharan
Keyword(s):  
Solder Joint ◽  
Power Allocation ◽  
Thermal Stresses ◽  
Pressure Sensors ◽  
Test Method ◽  
Solder Joint Reliability ◽  
Metal Substrates ◽  
Joint Reliability ◽  
Wide Range ◽  
Significant Difference

Solders have been utilized extensively in the MEMS packaging industry to create vacuum or hermetic seals in a variety of applications. MEMS technology is finding applications in wide range of products like pressure sensors, actuators, flow control devices etc. For many harsh low temperature environment applications, like commercial refrigeration systems, MEMS based pressure sensors and flow actuators are directly mounted on to metal substrates using solders to create hermetic sealing. Solders attaching silicon devices directly to metal substrates may be subjected to very high thermal stresses due to significant difference in thermal expansion coefficients during chip operation or environment temperatures. In this paper, case study of a high powered MEMS chip (referred in the paper as die) operating in a commercial refrigeration system is presented. Accelerated test method for qualifying solder joint for high pressure applications is briefly discussed. Lab experiments showing typical refrigeration cycle thermal load on solder joint are presented. Based on the study, concepts of die power toggling and power allocation towards enhancing hermetic solder joint reliability are discussed. Detailed numerical case studies are presented to quantify the improvement in solder joint reliability due to the proposed concept.

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