Solder Joint Reliability of Surface Mount Connectors

1993 ◽  
Vol 115 (2) ◽  
pp. 180-188 ◽  
Author(s):  
J. Lau ◽  
T. Marcotte ◽  
J. Severine ◽  
A. Lee ◽  
S. Erasmus ◽  
...  
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Experimental Methods ◽  
Test Methods ◽  
Solder Joint Reliability ◽  
Surface Mount ◽  
Joint Reliability

The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the reliability of the solder joints of surface mount connectors has been recommended.

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly Under Mechanical Drop Test

2002 ◽  
Author(s):  
Shi-Wei Ricky Lee ◽  
Yin-Lai Tracy Li ◽  
Hoi-Wai Ben Lui
Keyword(s):  
Solder Joint ◽  
Failure Modes ◽  
Solder Joints ◽  
Drop Test ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Free Solder ◽  
Board Level ◽  
Better Than ◽  
Mechanical Drop Test

The present study is intended to investigate the board level solder joint reliability of PBGA assemblies under mechanical drop test. During the course of this study, a five-leg experiment was designed to investigate various combinations of solder materials and peak reflow temperatures. Two major failure modes, namely, solder cracking and copper trace breakage, were identified. In addition, the critical location of solder joints was characterized. It was found that Sn-Pb eutectic solder joints performed better than Pb-free solder joints under mechanical impact loading.

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

2003 ◽  
Vol 125 (4) ◽  
pp. 498-505 ◽  
Author(s):  
Bart Vandevelde ◽  
Eric Beyne ◽  
Kouchi (G.Q.) Zhang ◽  
Jo Caers ◽  
Dirk Vandepitte ◽  
...  
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Empirical Model ◽  
Prediction Models ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Solder Joint Reliability ◽  
Joint Geometry ◽  
Joint Reliability ◽  
Area Array

Finite element modeling is widely used for estimating the solder joint reliability of electronic packages. In this study, the electronic package is a CSP mounted on a printed circuit board (PCB) using an area array of solder joints varying from 5×4 up to 7×7. An empirical model for estimating the reliability of CSP solder joints is derived by correlating the simulated strains to thermal cycling results for 20 different sample configurations. This empirical model translates the inelastic strains calculated by nonlinear three-dimensional (3D) finite element simulations into a reliability estimation (N50% or N100 ppm). By comparing with the results of reliability tests, it can be concluded that this model is accurate and consistent for analyzing the effect of solder joint geometry. Afterwards, parameter sensitivity analysis was conducted by integrating a design of experiment (DOE) analysis with the reliable solder fatigue prediction models, following the method of simulation-based optimization. Several parameters are analyzed: the PCB parameters (elastic modulus, coefficient of thermal expansion, thickness), the chip dimensions (area array configuration), and the parameters defining the solder joint geometry (substrate and chip pad diameter, solder volume). The first study analyzes how the solder joint geometry influences the CSP reliability. A second study is a tolerance analysis for six parameters. These parameters can have a tolerance (=accuracy) of their nominal value, and it is shown that these small tolerances can have a significant influence on the solder joint reliability.

Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components

1993 ◽  
Vol 115 (2) ◽  
pp. 195-200 ◽  
Author(s):  
D. B. Barker ◽  
Y. S. Chen ◽  
A. Dasgupta
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Finite Element Modeling ◽  
Stress Analysis ◽  
Empirical Equation ◽  
Solder Joint Reliability ◽  
Surface Mount ◽  
Joint Reliability ◽  
Vibration Fatigue

This paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. A simple approximate stress analysis is presented that does not require complex finite element modeling, nor does it reduce the problem to a simple empirical equation or rule of thumb. The goal of the new method is to make PWB vibration solder joint reliability information available to the designer as early as possible and in an easily understood and implemented manner.

Surface Mount Technology (SMT) Substrate Material Requirements - A Brief Review

1987 ◽  
Vol 108 ◽  
Author(s):  
A. Mahammad Ibrahim
Keyword(s):  
Dielectric Constant ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Substrate Material ◽  
Surface Mount Technology ◽  
Solder Joint Reliability ◽  
Surface Mount ◽  
Printed Circuit ◽  
Joint Reliability ◽  
Out Of Plane

ABSTRACTThe state of the art for the printed circuit (pc) industry is the Surface Mount Technology (SMT) using leadless ceramic chip carriers (LCCCs). The SMT technique is used to design, fabricate, and assemble affordable high-speed, high-density electronic modules with reduced size and weight. However, to take full advantage of the SMT, new high-performance printed circuit board (PCB) substrate materials must be developed, especially if the goal is to satisfy the high reliability required in military applications. The most critical requirement is matching the in-plane coefficient of thermal expansion (CTE) with the SMT-PCB's and the chip carriers (LCCCs) to reduce the solderjoint stresses during thermal cycling. Solder-joint reliability can be improved significantly by tailoring the in-plane CTE to approximately 6–7 ppm/°C (of the alumina chip carrier) using Kevlar and/or quartz fabric-reinforced polymer composites, instead of conventional glass composites. Less attention has been focussed on other important requirements, e.g., out-of-plane (Z-axis) expansion, glass transition temperature (Tg), dielectric constant, and resin microcracking, which also play important roles in the overall performance of the substrate materials. For example, high Z-expansion puts additional strain on the plated through holes (PTH), thereby affecting PTR reliability. A low Tg significantly increases the amount of thermal stress imposed during thermal cycling on solder joints and PTH, and leads to failures. This paper contains a brief review of the requirements of a SMT-PCB substrate material, including such critical parameters as: in-plane CTE, out-of-plane CTE, Tg, dielectric constant, fiber-to-resin ratio, and resin microcracking, and their effects on solder joint reliability, PTH reliability, dimensional stability, and electrical performance.

A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates

2007 ◽  
Vol 353-358 ◽  
pp. 2932-2935
Author(s):  
Yong Cheng Lin ◽  
Xu Chen ◽  
Xing Shen Liu ◽  
Guo Quan Lu
Keyword(s):  
Solder Joint ◽  
Fatigue Failure ◽  
Flip Chip ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Failure Behavior ◽  
Stress Strain ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Failure Life

The reliability of solder joints in flip chip assemblies with both compliant (flex) and rigid (PCB) substrates was studied by accelerated temperature cycling tests and finite element modeling (FEM). In-process electrical resistance measurements and nondestructive evaluations were conducted to monitor solder joint failure behavior, hence the fatigue failure life. Meanwhile, the predicted fatigue failure life of solder joints was obtained by Darveaux’s crack initiation and growth models. It can be concluded that the solder joints in flip chip on flex assembly (FCOF) have longer fatigue life than those in flip chip on rigid board assembly (FCOB); the maximum von Mises stress/strain and the maximum shear stress/strain of FCOB solder joints are much higher than those of FCOF solder joints; the thermal strain and stress in solder joints is reduced by flex buckling or bending and flex substrate could dissipate energy that otherwise would be absorbed by solder joint. Therefore, the substrate flexibility has a great effect on solder joint reliability and the reliability improvement was attributed to flex buckling or bending during temperature cycling.

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