High mobility tri-layer a-Si:H thin-film transistors with ultrathin active layer

1997 ◽  
Vol 18 (8) ◽  
pp. 397-399 ◽  
Author(s):  
D.B. Thomasson ◽  
T.N. Jackson
2012 ◽  
Vol 100 (17) ◽  
pp. 173501 ◽  
Author(s):  
Hyun-Sik Choi ◽  
Sanghun Jeon ◽  
Hojung Kim ◽  
Jaikwang Shin ◽  
Changjung Kim ◽  
...  

2018 ◽  
Vol 30 (2) ◽  
pp. 1496-1499 ◽  
Author(s):  
Ye Wang ◽  
Jinbao Su ◽  
Shiqian Dai ◽  
Ran Li ◽  
Yaobin Ma ◽  
...  

Electronics ◽  
2021 ◽  
Vol 10 (11) ◽  
pp. 1295
Author(s):  
Dae-Hwan Kim ◽  
Hyun-Seok Cha ◽  
Hwan-Seok Jeong ◽  
Seong-Hyun Hwang ◽  
Hyuck-In Kwon

Herein, we investigated the effects of active layer thickness (tS) on the electrical characteristics and stability of high-mobility indium–gallium–tin oxide (IGTO) thin-film transistors (TFTs). IGTO TFTs, with tS values of 7 nm, 15 nm, 25 nm, 35 nm, and 50 nm, were prepared for this analysis. The drain current was only slightly modulated by the gate-to-source voltage, in the case of the IGTO TFT with tS = 50 nm. Under positive bias stress (PBS), the electrical stability of the IGTO TFTs with a tS less than 35 nm improved as the tS increased. However, the negative bias illumination stress (NBIS) stability of these IGTO TFTs deteriorated as the tS increased. To explain these phenomena, we compared the O1s spectra of IGTO thin films with different tS values, acquired using X-ray photoelectron spectroscopy. The characterization results revealed that the better PBS stability, and the low NBIS stability, of the IGTO TFTs with thicker active layers were mainly due to a decrease in the number of hydroxyl groups and an increase in the number of oxygen vacancies in the IGTO thin films with an increase in tS, respectively. Among the IGTO TFTs with different tS, the IGTO TFT with a 15-nm thick active layer exhibited the best electrical characteristics with a field-effect mobility (µFE) of 26.5 cm2/V·s, a subthreshold swing (SS) of 0.16 V/dec, and a threshold voltage (VTH) of 0.3 V. Moreover, the device exhibited robust stability under PBS (ΔVTH = 0.9 V) and NBIS (ΔVTH = −1.87 V).


2015 ◽  
Vol 15 (10) ◽  
pp. 7508-7512 ◽  
Author(s):  
Soon Kon Kim ◽  
Pyung Ho Choi ◽  
Sang Sub Kim ◽  
Hyun Woo Kim ◽  
Na Young Lee ◽  
...  

In this study, we prepared solution-based In–Ga–ZnO thin film transistors (IGZO TFTs) having a multistacked active layer. The solution was prepared using an In:Zn = 1:1 mole ratio with variation in Ga content, and the TFTs were fabricated by stacking layers from the prepared solutions. After we measured the mobility of each stacked layer, the saturation mobility showed values of 0.8, 0.6 and 0.4 (cm2/Vs), with an overall decrease in electrical properties. The interface formed between the each layers affected the current path, resulting in reduced electrical performance. However, when the gate bias VG = 10 V was applied for 1500 s, the threshold voltage shift decreased in the stack. The uniformity of the active layer was improved in the stacked active layer by filling the hole formed during pre-baking, resulting in improved device stability. Also, the indium ratio was increased to enhance the mobility from 0.86 to 3.47. These results suggest high mobility and high stability devices can be produced with multistacked active layers.


2015 ◽  
Vol 107 (11) ◽  
pp. 112108 ◽  
Author(s):  
Zhenguo Lin ◽  
Peng Xiao ◽  
Sheng Sun ◽  
Yuzhi Li ◽  
Wei Song ◽  
...  

2021 ◽  
Vol 52 (S1) ◽  
pp. 7-7
Author(s):  
Weihua Wu ◽  
Yi Zhuo ◽  
Fangmei Liu ◽  
Yuanpeng Chen ◽  
Jiangbo Yao ◽  
...  

2011 ◽  
Vol 1315 ◽  
Author(s):  
D. K. Ngwashi ◽  
R. B. M. Cross ◽  
S. Paul ◽  
Andrian P. Milanov ◽  
Anjana Devi

ABSTRACTIn order to investigate the performance of ZnO-based thin film transistors (ZnO-TFTs), we fabricate devices using amorphous hafnium dioxide (HfO2) high-k dielectrics. Sputtered ZnO was used as the active channel layer, and aluminium source/drain electrodes were deposited by thermal evaporation, and the HfO2 high-k dielectrics are deposited by metal-organic chemical vapour deposition (MOCVD). The ZnO-TFTs with high-k HfO2 gate insulators exhibit good performance metrics and effective channel mobility which is appreciably higher in comparison to SiO2-based ZnO TFTs fabricated under similar conditions. The average channel mobility, turn-on voltage, on-off current ratio and subthreshold swing of the high-k TFTs are 31.2 cm2V-1s-1, -4.7 V, ~103, and 2.4 V/dec respectively. We compared the characteristics of a typical device consisting of HfO2 to those of a device consisting of thermally grown SiO2 to examine their potential for use as high-k dielectrics in future TFT devices.


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