Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

078037682x

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Reliability of the SnBi lead finished Pb-free produet

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188829 ◽

2005 ◽

Author(s):

Ki-Hwan Park ◽

Nam-Seog Kim ◽

Se-Yong Oh

Download Full-text

Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188848 ◽

2003 ◽

Cited By ~ 1

Author(s):

S.F. Tai ◽

A. Ourdjini ◽

Y.L. Khong ◽

V.C. Venkatesh ◽

M.N. Tamin

Keyword(s):

Solid State ◽

Phosphorus Content ◽

Electroless Nickel ◽

Lead Free ◽

Intermetallic Formation ◽

Electroless Nickel Immersion Gold

Download Full-text

Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188876 ◽

2003 ◽

Author(s):

Hsiang-Chen Hsu ◽

Lih-Shan Chen ◽

Lee-Wei Chu

Keyword(s):

Thermal Design ◽

Multichip Module

Download Full-text

Board-level reliability of lead-free SnAgCu solder joint

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188851 ◽

2003 ◽

Author(s):

Jian-Shu Wu ◽

Shan-Pu Yu ◽

I-Hsuan Peng ◽

Jong-Lih Wang ◽

B. Chung

Keyword(s):

Solder Joint ◽

Lead Free ◽

Snagcu Solder ◽

Board Level ◽

Board Level Reliability

Download Full-text

Characterisation of crystallisation behaviour of electroless Ni-P plating during heating

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188881 ◽

2003 ◽

Cited By ~ 1

Author(s):

Z. Guo ◽

K.G. Keong ◽

W. Sha

Keyword(s):

Crystallisation Behaviour ◽

Electroless Ni

Download Full-text

Thin GaAs film on GaAs/Si substrate

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188867 ◽

2003 ◽

Author(s):

Yung Sheng Chang ◽

Chih Yuan Huang

Keyword(s):

Gaas Film ◽

Si Substrate

Download Full-text

A study on the adhesion performance of copper to polyimide for microelectronic packaging-flex substrates

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188835 ◽

2003 ◽

Author(s):

Yung-Sen Lin ◽

Huang-Ming Liu

Keyword(s):

Microelectronic Packaging ◽

Adhesion Performance

Download Full-text

Current-mode BIST structure for mixed-signal circuits

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188839 ◽

2003 ◽

Author(s):

Chun-Lung Hsu ◽

Keh-Chang Huang

Keyword(s):

Current Mode ◽

Mixed Signal ◽

Mixed Signal Circuits

Download Full-text

Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188836 ◽

2003 ◽

Author(s):

Chia-Tai Kuo ◽

Ming-Chuen Yip ◽

Kuo-Ning Chiang ◽

Yi-Ming Jen

Keyword(s):

Electronic Packaging ◽

Mechanical Characterization ◽

Temperature Dependent

Download Full-text

Wire bondability of Au/Ni bond pads: effects of metallisation schemes and processing conditions

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188815 ◽

2003 ◽

Author(s):

Yu Hin Chan ◽

Jang-kyo Kim ◽

D. Liu ◽

C.K. Liu ◽

Yiu Ming Cheung ◽

...

Keyword(s):

Processing Conditions ◽

Bond Pads

Download Full-text

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Reliability of the SnBi lead finished Pb-free produet

Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates

Board-level reliability of lead-free SnAgCu solder joint

Characterisation of crystallisation behaviour of electroless Ni-P plating during heating

Thin GaAs film on GaAs/Si substrate

A study on the adhesion performance of copper to polyimide for microelectronic packaging-flex substrates

Current-mode BIST structure for mixed-signal circuits

Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application

Wire bondability of Au/Ni bond pads: effects of metallisation schemes and processing conditions

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.
Latest Publications