Meta-lens design with low permittivity dielectric materials through smart transformation optics

2015 ◽  
Vol 107 (10) ◽  
pp. 101906 ◽  
Author(s):  
Junhyun Kim ◽  
Dongheok Shin ◽  
Seungjae Choi ◽  
Do-Sik Yoo ◽  
Ilsung Seo ◽  
...  
Keyword(s):  
Dielectric Materials ◽  
Transformation Optics ◽  
Lens Design ◽  
Low Permittivity

scholarly journals Transformation optics relay lens design for imaging from a curved to a flat surface

2016 ◽  
Author(s):  
Julia Wetherill ◽  
Richard Lepkowicz ◽  
Ramzi Zahreddine ◽  
Mark Neifeld
Keyword(s):  
Flat Surface ◽  
Transformation Optics ◽  
Lens Design

Integration Challenges for Chemical Mechanical Polishing of Cu/Low-κ Interconnects

2003 ◽  
Vol 767 ◽  
Author(s):  
Jeffrey A. Lee ◽  
Mansour Moinpour ◽  
Huey-Chiang Liou ◽  
Thomas Abell
Keyword(s):  
Chemical Mechanical Polishing ◽  
Structural Reliability ◽  
Dielectric Materials ◽  
Mechanical Polishing ◽  
Copper Metallization ◽  
Metal Line ◽  
Significant Challenge ◽  
Microelectronic Devices ◽  
Improved Performance ◽  
Low Permittivity

AbstractThe drive for improved performance of microelectronic devices has led to the prevalence of copper metallization and the aggressive development of low-permittivity (low-κ) dielectric materials for use as interlayer dielectrics in BEOL interconnect structures. Progressive scaling of metal line widths coupled with the need to incorporate ultra low-κ (ULK) dielectrics, with κ<2.2, presents numerous challenges for integration and reliability. Perhaps the most significant challenge for the 90nm technology node and beyond is successful planarization of Cuinterconnect structures by chemical mechanical polishing (CMP). The present paper will discuss the general integration challenges and key structural reliability issues for chemical mechanical polishing of Cu-interconnects incorporating ULK dielectric materials.

Gradient-index lens design with quasi-conformal transformation optics for energy concentration

2013 ◽  
Author(s):  
Douglas H. Werner ◽  
Jeremiah P. Turpin ◽  
Donovan Brocker ◽  
Xiande Wang ◽  
Zhi Hao Jiang ◽  
...  
Keyword(s):  
Conformal Transformation ◽  
Transformation Optics ◽  
Energy Concentration ◽  
Lens Design ◽  
Gradient Index ◽  
Gradient Index Lens

scholarly journals Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure

Materials ◽  
2021 ◽  
Vol 14 (21) ◽  
pp. 6266
Author(s):  
Xiaodi Dong ◽  
Mingsheng Zheng ◽  
Baoquan Wan ◽  
Xuejie Liu ◽  
Haiping Xu ◽  
...  
Keyword(s):  
In Situ Polymerization ◽  
Signal Propagation ◽  
Dielectric Materials ◽  
Propagation Delay ◽  
Decomposition Temperature ◽  
Thermal Decomposition Temperature ◽  
Molecular Weights ◽  
Low Permittivity ◽  
Crosstalk Signal

As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “fluorene” rigid conjugated structure was prepared successfully. By introducing 9,9-Bis(3-fluoro-4-aminophenyl) fluorene as the rigid conjugated structure monomer, a series of CPI films with different molecular weights were fabricated by in situ polymerization, which not only achieved the reduction of permittivity but also maintained excellent thermodynamic stability. Moreover, the hydrophobicity of the CPI film was also improved with the increasing conjugated structure fraction. The lowest permittivity reached 2.53 at 106 Hz, while the thermal decomposition temperature (Td5%) was up to 530 °C, and the tensile strength was ≥ 96 MPa. Thus, the CPI films are potential dielectric materials for microelectronic and insulation applications.

All-carbocycle hydrocarbon thermosets with high thermal stability and robust mechanical strength for low-k interlayer dielectrics

2021 ◽  
Author(s):  
Yudi Feng ◽  
Ke Jin ◽  
Jia Guo ◽  
Changchun Wang
Keyword(s):  
Thermal Stability ◽  
Mechanical Strength ◽  
Dielectric Materials ◽  
High Thermal Stability ◽  
Thermal Stabilities ◽  
Interlayer Dielectric ◽  
Interlayer Dielectrics ◽  
Low Permittivity ◽  
Low K

The development of modern microelectronic industry calls for low permittivity interlayer dielectric materials with excellent thermal stabilities, robust mechanical strength and matching processability. Traditionally, it is difficult to fabricate materials...

Electrostriction measurements on low permittivity dielectric materials

1999 ◽  
Vol 19 (6-7) ◽  
pp. 1269-1273 ◽  
Author(s):  
Rattikorn Yimnirun ◽  
Sylvie M.-L. Eury ◽  
V. Sundar ◽  
Paul J. Moses ◽  
Sei-Joo Jang ◽  
...  
Keyword(s):  
Dielectric Materials ◽  
Low Permittivity

Mechanical and Dielectric Properties of Low Permittivity Dielectric Materials

1996 ◽  
Vol 443 ◽  
Author(s):  
A. Alptekin ◽  
G. Czeremuszkin ◽  
L. Martinu ◽  
M. Meunier ◽  
E. Sacher ◽  
...  
Keyword(s):  
Dielectric Materials ◽  
Substantial Improvement ◽  
Dielectric Constants ◽  
Thermal Treatments ◽  
Metal System ◽  
Treatment Techniques ◽  
Peel Tests ◽  
Low Permittivity ◽  
Dielectric And Mechanical Properties ◽  
Poor Adhesion

AbstractThe dielectric and mechanical properties of low permittivity dielectric/metal system consisting of fluoropolymers and copper were studied. The types of polymers in this study include sputtered Teflon, plasma-deposited fluoropolymers and the soluble Teflon AF1600. All these fluoropolymers have dielectric constants below 2.0 and dissipation factors below 0.001. Copper was either evaporated or sputtered. Adhesion of copper to fluoropolymers was studied using scratch and peel tests. Different thermal treatment techniques were applied to enhance adhesion, including preannealing in vacuum or in atmosphere, as well as postannealing in vacuum. The results show generally poor adhesion for evaporated copper, with substantial improvement for sputtered copper; however thermal treatments enhance adhesion in some cases. FTIR, surface tension and XPS experiments were carried out in an effort to understand these effects. Our findings will be discussed in terms of the various effects contributing to copper/fluoropolymer adhesion.

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