Effect of elastic uniaxial strain on the electrical resistance of In2Bi single‐crystal whiskers

1975 ◽  
Vol 46 (6) ◽  
pp. 2806-2807
Author(s):  
William S. Key ◽  
Jack Hayne Davis
Author(s):  
Timothy S. English ◽  
Leslie M. Phinney ◽  
Patrick E. Hopkins ◽  
Justin R. Serrano

Accurate thermal conductivity values are essential to the modeling, design, and thermal management of microelectromechanical systems (MEMS) and devices. However, the experimental technique best suited to measure thermal conductivity, as well as thermal conductivity itself, varies with the device materials, fabrication conditions, geometry, and operating conditions. In this study, the thermal conductivity of boron doped single-crystal silicon-on-insulator (SOI) microbridges is measured over the temperature range from 77 to 350 K. The microbridges are 4.6 mm long, 125 μm tall, and two widths, 50 or 85 μm. Measurements on the 85 μm wide microbridges are made using both steady-state electrical resistance thermometry and optical time-domain thermoreflectance. A thermal conductivity of ∼ 77 W/mK is measured for both microbridge widths at room temperature, where both experimental techniques agree. However, a discrepancy at lower temperatures is attributed to differences in the interaction volumes and in turn, material properties, probed by each technique. This finding is qualitatively explained through Boltzmann transport equation modeling under the relaxation time approximation.


2016 ◽  
Vol 119 (13) ◽  
pp. 135903 ◽  
Author(s):  
Takaki Muramatsu ◽  
Lev V. Gasparov ◽  
Helmuth Berger ◽  
Russell J. Hemley ◽  
Viktor V. Struzhkin

2015 ◽  
Vol 86 (10) ◽  
pp. 103904 ◽  
Author(s):  
L. Gannon ◽  
A. Bosak ◽  
R. G. Burkovsky ◽  
G. Nisbet ◽  
A. P. Petrović ◽  
...  

Pramana ◽  
2003 ◽  
Vol 61 (1) ◽  
pp. 183-186 ◽  
Author(s):  
Rajiv Vaidya ◽  
Neha Bhatt ◽  
S. G. Patel ◽  
A. R. Jani ◽  
Alka B. Garg ◽  
...  

2006 ◽  
Vol 17 (11) ◽  
pp. 1551-1561 ◽  
Author(s):  
SHENG-NIAN LUO ◽  
LIANQING ZHENG ◽  
QI AN ◽  
SHIJIN ZHAO

We investigate using molecular dynamics, the tensile failure of single-crystal and nanocrystalline Lennard-Jones solids under uniaxial strain. Stresses are relaxed by plasticity and tensile failure, which are induced via stacking faults, twin planes, void nucleation and growth, and their interactions. Stacking faults and twin planes as well as multiple nanovoids are nucleated at grain boundaries in a nanocrystalline solid. Void formation is characterized by under-coordinated atoms with coordination number ≤ 7, and the critical void size is comparable to a vacancy. For a single crystal, the number of stacking faults and twin planes decreases during failure mostly due to the absorption by nanovoids. In contrast, it increases with strain monotonically for a nanocrystalline solid, where abundant grain boundaries help the nucleation and deter the propagation and absorption of the stacking faults and twin planes, inducing effective dislocation pile-ups at grain boundaries even in the presence of nanovoids.


2013 ◽  
Vol 15 (21) ◽  
pp. 8222 ◽  
Author(s):  
Chaolong Tang ◽  
Chengming Jiang ◽  
Wenqiang Lu ◽  
Jinhui Song

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