scholarly journals Dependence of carrier mobility on grain mosaic spread in ⟨001⟩-oriented Si films grown on polycrystalline substrates

2005 ◽  
Vol 87 (15) ◽  
pp. 152104 ◽  
Author(s):  
Woong Choi ◽  
Vladimir Matias ◽  
Jung-Kun Lee ◽  
Alp T. Findikoglu
Keyword(s):  
Carrier Mobility ◽  
Mosaic Spread ◽  
Si Films

A high carrier-mobility crystalline silicon film directly grown on polyimide using SiCl4/H2 microwave plasma for flexible thin film transistors

2015 ◽  
Vol 3 (28) ◽  
pp. 7513-7522 ◽  
Author(s):  
Ping-Yen Hsieh ◽  
Chi-Young Lee ◽  
Nyan-Hwa Tai
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
Carrier Mobility ◽  
Microwave Plasma ◽  
Crystalline Silicon ◽  
Silicon Film ◽  
High Carrier Mobility ◽  
High Carrier ◽  
Si Films

Flexible Si-TFTs with a high carrier mobility of 106 cm2 V−1 s−1 are fabricated using SiCl4/H2 microwave plasma for the preparation of crystalline Si films.

Pulsed Laser-Induced Crystallization and Amorphization of SiGe Films.

1992 ◽  
Vol 258 ◽  
Author(s):  
T. Sameshima ◽  
S. Usui
Keyword(s):  
Electrical Conductivity ◽  
Band Gap ◽  
Silicon Germanium ◽  
Carrier Mobility ◽  
Pulsed Laser ◽  
Nucleation Density ◽  
High Electrical Conductivity ◽  
Germanium Alloy ◽  
Si Films ◽  
Induced Crystallization

ABSTRACTPulsed laser-induced melting followed by crystallization and amorphization were studied on silicon-germanium alloy (SiGe) films. Although amorphization was achieved on SiGe films, it was not observed in pure Ge films. Crystalline nucleation density in homogeneous solidification increased as Ge concentration increased. It was 1×1024m-3for Si0.22Ge0.78 films, while it was 4×1022m-3 for pUre si films. Electrical conductivity of laser polycrystallized films increased as Ge concentration increased. It had a maximum of 1 S/cm when Ge concentration was 0.78. This high electrical conductivity would be brought about by the increase of carrier mobility as well as the reduction of the band gap.

Silicon-On-Insulator Mosfets Fabricated in Zone-Melting-Recrystallized Poly-Si Films on SiO2

1981 ◽  
Vol 4 ◽  
Author(s):  
B­Y. Tsaur ◽  
M. W. Gels ◽  
John C. C. Fan ◽  
D. J. Silversmith ◽  
R. W. Mountain
Keyword(s):  
Carrier Mobility ◽  
High Surface ◽  
Zone Melting ◽  
Silicon On Insulator ◽  
Surface Electron ◽  
Leakage Currents ◽  
Si Substrates ◽  
Enhancement Mode ◽  
Low Leakage ◽  
Si Films

ABSTRACTN- and p-channel enhancement-mode MOSFETs have been fabricated in Si films prepared by zone-melting recrystallization of poly-Si deposited on SiO2-coated Si substrates. The transistors exhibit high surface mobilities, in the range of 560–620 cm2/V−s for electrons and 200–240 cm2/V−s for holes, and low leakage currents of the order of 0.1 pA/μm (channel width). Uniform device performance with a yield exceeding 90% has been measured in tests of more than 100 devices. The interface between the Si film and the SiO2 layer on the substrate is characterized by an oxide charge density of 1–2 × 1011 cm−2 and a high surface carrier mobility. N-channel MOSFETs fabricated inSi films recrystallized on SiO2-coated fused quartz subtrates exhibit surface electron mobilities substantially higher than those of single-crystal Si devices because the films are under a large tensile stress.

Low-Temperature Formation of Device-Quality Polysilicon Films by cat-CVD Method

1996 ◽  
Vol 452 ◽  
Author(s):  
Hideki Matsumura ◽  
Akira Heya ◽  
Ritsuko Iizuka ◽  
Akira Izumi ◽  
An-Qiang He ◽  
...  
Keyword(s):  
Thin Film ◽  
Catalytic Cracking ◽  
Polycrystalline Silicon ◽  
Carrier Mobility ◽  
Carrier Transport ◽  
Thin Film Solar Cells ◽  
Cvd Method ◽  
Polysilicon Films ◽  
Si Films ◽  
Deposition Conditions

AbstractPolycrystalline silicon (poly-Si) films are deposited at temperatures lower than 300–400°C by the cat-CVD method. In the method, a SiH4 and H2 gas-mixture is decomposed by catalytic cracking reactions with a heated tungsten catalyzer placed near substrates. Carrier transport, optical and structural properties are investigated for this cat-CVD poly-Si. The films show both large carrier mobility and large optical absorption for particular deposition conditions. The cat-CVD poly-Si films are found to be one of the useful materials for thin film transistors and thin film solar cells.

Theoretical investigation of the phonon-limited carrier mobility in (001) Si films

2016 ◽  
Vol 120 (17) ◽  
pp. 174301 ◽  
Author(s):  
Jing Li ◽  
Evelyne Lampin ◽  
Christophe Delerue ◽  
Yann-Michel Niquet
Keyword(s):  
Theoretical Investigation ◽  
Carrier Mobility ◽  
Si Films

Solution Grown Polysilicon for Flat Panel Displays

1996 ◽  
Vol 424 ◽  
Author(s):  
R. L. Wallace ◽  
W. A. Anderson
Keyword(s):  
Thin Film ◽  
Grain Size ◽  
Carrier Mobility ◽  
Carrier Lifetime ◽  
Electron Cyclotron Resonance ◽  
Low Cost ◽  
Flat Panel Displays ◽  
Flat Panel ◽  
Resonance Properties ◽  
Si Films

AbstractThin-film poly-Si on low-cost substrates is useful for thin-film transistors in flat panel displays or for photovoltaics. The films reported herein were formed at 600°C by d.c. magnetron sputtering from a Si-target onto a SiO2/Mo substrate, pre-coated with Sn or In/Ti to give a liquid phase growth. Poly-Si films have given a preferred (111) orientation, grain size up to 20μm, a carrier mobility exceeding 100cm2/Vs and carrier lifetime of 8μs when using the Sn pre-layer. The Sn pre-layer typically gave smaller grain size than did the In/Ti solvent but the latter gave lower carrier lifetime from Ti incorporation in the film. The film from the Sn pre-layer gave carrier mobility of 140cm2/V-s after hydrogenation by microwave electron cyclotron resonance. Properties of the Si thin-film can be controlled by type of pre-layer, doping of the target, substrate temperature and deposition environment.

Electron Energy Analysis of Germanium and Silica Layers on Silicon Substrates

1975 ◽  
Vol 33 ◽  
pp. 96-97
Author(s):  
R. W. Ditchfield ◽  
A. G. Cullis
Keyword(s):  
Epitaxial Growth ◽  
Electron Energy ◽  
Silicon Substrates ◽  
Secondary Phases ◽  
Si Substrates ◽  
Transmission Electron ◽  
Layer Structures ◽  
Si Films ◽  
Electron Energy Loss ◽  
Growth Centres

An energy analyzing transmission electron microscope of the Möllenstedt type was used to measure the electron energy loss spectra given by various layer structures to a spatial resolution of 100Å. The technique is an important, method of microanalysis and has been used to identify secondary phases in alloys and impurity particles incorporated into epitaxial Si films.Layers Formed by the Epitaxial Growth of Ge on Si Substrates Following studies of the epitaxial growth of Ge on (111) Si substrates by vacuum evaporation, it was important to investigate the possible mixing of these two elements in the grown layers. These layers consisted of separate growth centres which were often triangular and oriented in the same sense, as shown in Fig. 1.

Growth of near noble metal Pd and Pt thin film silicides morphology and structure

1984 ◽  
Vol 42 ◽  
pp. 498-499
Author(s):  
E. I. Alessandrini ◽  
M. O. Aboelfotoh
Keyword(s):  
Noble Metals ◽  
Annealing Temperature ◽  
Chemical Compounds ◽  
Barrier Properties ◽  
Solid State Reactions ◽  
Transmission Electron ◽  
Stable Chemical ◽  
Metal Thickness ◽  
Amorphous Si ◽  
Si Films

Considerable interest has been generated in solid state reactions between thin films of near noble metals and silicon. These metals deposited on Si form numerous stable chemical compounds at low temperatures and have found applications as Schottky barrier contacts to silicon in VLSI devices. Since the very first phase that nucleates in contact with Si determines the barrier properties, the purpose of our study was to investigate the silicide formation of the near noble metals, Pd and Pt, at very thin thickness of the metal films on amorphous silicon.Films of Pd and Pt in the thickness range of 0.5nm to 20nm were made by room temperature evaporation on 40nm thick amorphous Si films, which were first deposited on 30nm thick amorphous Si3N4 membranes in a window configuration. The deposition rate was 0.1 to 0.5nm/sec and the pressure during deposition was 3 x 10 -7 Torr. The samples were annealed at temperatures in the range from 200° to 650°C in a furnace with helium purified by hot (950°C) Ti particles. Transmission electron microscopy and diffraction techniques were used to evaluate changes in structure and morphology of the phases formed as a function of metal thickness and annealing temperature.

MICROELECTRONICS APPLICATIONS OF DEPOSITED Si FILMS RECRYSTALLIZED FROM THE MELT

1982 ◽  
Vol 43 (C1) ◽  
pp. C1-353-C1-362
Author(s):  
G. K. Celler ◽  
L. E. Trimble
Keyword(s):  
Si Films
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