Stress‐enhanced carrier mobility in zone melting recrystallized polycrystalline Si films on SiO2‐coated substrates

1982 ◽  
Vol 40 (4) ◽  
pp. 322-324 ◽  
Author(s):  
B‐Y. Tsaur ◽  
John C. C. Fan ◽  
M. W. Geis
Keyword(s):  
Carrier Mobility ◽  
Zone Melting ◽  
Si Films

Silicon-On-Insulator Mosfets Fabricated in Zone-Melting-Recrystallized Poly-Si Films on SiO2

1981 ◽  
Vol 4 ◽  
Author(s):  
B­Y. Tsaur ◽  
M. W. Gels ◽  
John C. C. Fan ◽  
D. J. Silversmith ◽  
R. W. Mountain
Keyword(s):  
Carrier Mobility ◽  
High Surface ◽  
Zone Melting ◽  
Silicon On Insulator ◽  
Surface Electron ◽  
Leakage Currents ◽  
Si Substrates ◽  
Enhancement Mode ◽  
Low Leakage ◽  
Si Films

ABSTRACTN- and p-channel enhancement-mode MOSFETs have been fabricated in Si films prepared by zone-melting recrystallization of poly-Si deposited on SiO2-coated Si substrates. The transistors exhibit high surface mobilities, in the range of 560–620 cm2/V−s for electrons and 200–240 cm2/V−s for holes, and low leakage currents of the order of 0.1 pA/μm (channel width). Uniform device performance with a yield exceeding 90% has been measured in tests of more than 100 devices. The interface between the Si film and the SiO2 layer on the substrate is characterized by an oxide charge density of 1–2 × 1011 cm−2 and a high surface carrier mobility. N-channel MOSFETs fabricated inSi films recrystallized on SiO2-coated fused quartz subtrates exhibit surface electron mobilities substantially higher than those of single-crystal Si devices because the films are under a large tensile stress.

Electrical Characteristics and Device Applications of Zone-Melting-Recrystallized Si Films on SiO2

1982 ◽  
Vol 13 ◽  
Author(s):  
B-Y. Tsaur ◽  
John C. C. Fan ◽  
M. W. Geis ◽  
R. L. Chapman ◽  
S. R. J. Brueck ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Zone Melting ◽  
Dimensional Structure ◽  
Electrical Characteristics ◽  
Mos Capacitors ◽  
Test Circuit ◽  
Speed Performance ◽  
Thin Film Resistors ◽  
High Yields ◽  
Si Films

ABSTRACTDevice-quality Si films have been prepared by using graphite strip heaters for zone melting poly-Si films deposited on SiO2-coated substrates. The electrical characteristics of these films have been studied by the fabrication and evaluation of thin-film resistors, Mosfets and MOS capacitors. High yields of functional transistor arrays and ring oscillators with promising speed performance have been obtained for CMOS test circuit chips fabricated in recrystallized Si films on 2-inch-diameter Si wafers. Dualgate Mosfets with a three-dimensional structure have been fabricated by using the zone-melting recrystallization technique.

Arc lamp zone melting and recrystallization of Si films on oxidized silicon substrates

1982 ◽  
Vol 41 (9) ◽  
pp. 824-826 ◽  
Author(s):  
T. J. Stultz ◽  
J. F. Gibbons
Keyword(s):  
Zone Melting ◽  
Silicon Substrates ◽  
Si Films

Zone‐melting recrystallization of 3‐in.‐diam Si films on SiO2‐coated Si substrates

1982 ◽  
Vol 41 (2) ◽  
pp. 186-188 ◽  
Author(s):  
John C. C. Fan ◽  
B‐Y. Tsaur ◽  
R. L. Chapman ◽  
M. W. Geis
Keyword(s):  
Zone Melting ◽  
Si Substrates ◽  
Si Films

A high carrier-mobility crystalline silicon film directly grown on polyimide using SiCl4/H2 microwave plasma for flexible thin film transistors

2015 ◽  
Vol 3 (28) ◽  
pp. 7513-7522 ◽  
Author(s):  
Ping-Yen Hsieh ◽  
Chi-Young Lee ◽  
Nyan-Hwa Tai
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
Carrier Mobility ◽  
Microwave Plasma ◽  
Crystalline Silicon ◽  
Silicon Film ◽  
High Carrier Mobility ◽  
High Carrier ◽  
Si Films

Flexible Si-TFTs with a high carrier mobility of 106 cm2 V−1 s−1 are fabricated using SiCl4/H2 microwave plasma for the preparation of crystalline Si films.

Pulsed Laser-Induced Crystallization and Amorphization of SiGe Films.

1992 ◽  
Vol 258 ◽  
Author(s):  
T. Sameshima ◽  
S. Usui
Keyword(s):  
Electrical Conductivity ◽  
Band Gap ◽  
Silicon Germanium ◽  
Carrier Mobility ◽  
Pulsed Laser ◽  
Nucleation Density ◽  
High Electrical Conductivity ◽  
Germanium Alloy ◽  
Si Films ◽  
Induced Crystallization

ABSTRACTPulsed laser-induced melting followed by crystallization and amorphization were studied on silicon-germanium alloy (SiGe) films. Although amorphization was achieved on SiGe films, it was not observed in pure Ge films. Crystalline nucleation density in homogeneous solidification increased as Ge concentration increased. It was 1×1024m-3for Si0.22Ge0.78 films, while it was 4×1022m-3 for pUre si films. Electrical conductivity of laser polycrystallized films increased as Ge concentration increased. It had a maximum of 1 S/cm when Ge concentration was 0.78. This high electrical conductivity would be brought about by the increase of carrier mobility as well as the reduction of the band gap.

Characterization of defects in Si films on SiO2 layer

1990 ◽  
Vol 48 (4) ◽  
pp. 582-583
Author(s):  
Ansheng Liu ◽  
Beiling Shao ◽  
Jianming Yuan
Keyword(s):  
Integrated Circuits ◽  
Cross Section ◽  
Silicon Film ◽  
Scanning Speed ◽  
Zone Melting ◽  
Switching Speed ◽  
Process Region ◽  
Interior Stress ◽  
Si Films

SOI (Silicon-on-lnsulator) offers many advantages for integrated circuits including faster switching speed, high packing density, radiation resistance, and latch-up free. It can also be used in the integration of high voltage devices and/ or sensors. Defect-free Si films with a small interior stress are required for the application mentioned above. Therefore a heat-sink and a valley entrainment structure (Fig. 1) were made in order to confine defects to predetermined locations and to leave the other areas of the recrystallized silicon film defect-free.Using a cross—section specimen electron microscopy we have observed some kinds of defects in unseeded rapid zone-melting-recrystallized (RZMR) Si films which were prepared with a RF-induced graphite strip heater system. The scanning speed of the graphite strip heater is 11 mm / sec. Fig.2 shows a cross-section image of a valley structure specimen. Not any defect has been found in region A, which means that about 10μm wide defect-free Si film can be obtained by the process. Region C is an unpatterned normal area with a uniform thickness.The subgrain boundaries (SGBs) with an interval less than 6μm were observed in the region C.

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