Low-Temperature Formation of Device-Quality Polysilicon Films by cat-CVD Method
Keyword(s):
Si Films
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AbstractPolycrystalline silicon (poly-Si) films are deposited at temperatures lower than 300–400°C by the cat-CVD method. In the method, a SiH4 and H2 gas-mixture is decomposed by catalytic cracking reactions with a heated tungsten catalyzer placed near substrates. Carrier transport, optical and structural properties are investigated for this cat-CVD poly-Si. The films show both large carrier mobility and large optical absorption for particular deposition conditions. The cat-CVD poly-Si films are found to be one of the useful materials for thin film transistors and thin film solar cells.
2004 ◽
Vol 43
(9A)
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pp. 5955-5959
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Keyword(s):
2010 ◽
Vol 312
(8)
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pp. 1277-1281
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Keyword(s):
Keyword(s):
2020 ◽
Vol 1481
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pp. 012005