5nm ruthenium thin film as a directly plateable copper diffusion barrier

2005 ◽  
Vol 86 (8) ◽  
pp. 083104 ◽  
Author(s):  
T. N. Arunagiri ◽  
Y. Zhang ◽  
O. Chyan ◽  
M. El-Bouanani ◽  
M. J. Kim ◽  
...  
Keyword(s):  
Thin Film ◽  
Diffusion Barrier ◽  
Copper Diffusion

Tantalum Nitride for Copper Diffusion Blocking on Thin Film (BiSb)2Te3

2012 ◽  
Vol 1490 ◽  
pp. 145-150
Author(s):  
H. H. Hsu ◽  
C. H. Cheng ◽  
C. K. Lin ◽  
K. Y. Chen ◽  
Y. L. Lin
Keyword(s):  
Thin Film ◽  
Diffusion Barrier ◽  
Energy Dispersive Spectrometry ◽  
Deep Understanding ◽  
Tantalum Nitride ◽  
Copper Diffusion ◽  
Thermal Budget ◽  
Transmission Electron ◽  
Diffusion Effects ◽  
Diffusion Behaviors

ABSTRACTThis study demonstrates the feasibility of introducing a TaN thin film as a copper diffusion barrier for p-type (BiSb)2Te3 thermoelectric material. Compared to conventional Ni diffusion barrier, remarkably little void generation in Cu bulk or near Cu/TaN interface originated from Cu penetration is observed for TaN barrier after suffering the thermal budget of close to soldering. Diffusion behaviors of the barriers were analyzed by transmission electron microscopy (TEM) and energy dispersive spectrometry (EDS) to make a deep understanding in clarifying interface diffusion effects among the Cu electrode, the barrier layer, and the (BiSb)2Te3thermoelectric layer.

Tungsten-Doped Indium Oxide Thin Film as an Effective High-Temperature Copper Diffusion Barrier

2014 ◽  
Vol 3 (6) ◽  
pp. N15-N17 ◽  
Author(s):  
J. Yu ◽  
J. Bian ◽  
L. Jiang ◽  
Y. Qiu ◽  
W. Duan ◽  
...  
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Indium Oxide ◽  
Diffusion Barrier ◽  
Oxide Thin Film ◽  
Copper Diffusion ◽  
Indium Oxide Thin Film

Thermal stability of PECVD W-B-N thin film as a diffusion barrier

1997 ◽  
Author(s):  
YongTae Kim ◽  
Dong J. Kim ◽  
Chang W. Lee ◽  
Jong-Wan Park
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Diffusion Barrier ◽  
Thermal Stability Of

scholarly journals Diffusion Barrier Effect against Cu due to Interlayer between Cu Thin Film and Polyimide Substrate.

Shinku ◽  
1996 ◽  
Vol 39 (3) ◽  
pp. 103-110 ◽  
Author(s):  
Satoru IWAMORI ◽  
Takehiro MIYASHITA ◽  
Shin FUKUDA ◽  
Nobuhiro FUKUDA ◽  
Kazufuyu SUDOH
Keyword(s):  
Thin Film ◽  
Diffusion Barrier ◽  
Barrier Effect ◽  
Polyimide Substrate ◽  
Cu Thin Film

Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier

2004 ◽  
Vol 449-452 ◽  
pp. 681-684
Author(s):  
Jung Sik Kim
Keyword(s):  
Thin Film ◽  
Diffusion Barrier ◽  
Annealing Temperature ◽  
Intermediate Compound ◽  
Multilayered Structure ◽  
Good Adhesion ◽  
Post Heat Treatment ◽  
Cu Film ◽  
Cu Thin Film ◽  
Thermal Stability Of

In the present study, thermal properties of the electroless-deposited Cu thin film were investigated. The Cu thin film of good adhesion was successfully deposited on the TaN barrier layer by a electroless deposition method. The multilayered structure of Cu/TaN/Si was prepared by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. In order to investigate the effect of post-heat treatment the specimen was annealed in H2 reduction atmosphere. Crystallization and agglomeration of the electroless-deposited Cu film occurred through annealing at H2 atmosphere and resulted in the decrease of film resistance. Thermal stability of Cu/TaN/Si system was maintained up to the annealing temperature of 600°C in H2 atmosphere above which the intermediate compound of Cu-Si was formed through diffusion into the TaN layer

scholarly journals Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

APL Materials ◽  
2019 ◽  
Vol 7 (1) ◽  
pp. 013001 ◽  
Author(s):  
Chia-Chi Yu ◽  
Hsin-jay Wu ◽  
Matthias T. Agne ◽  
Ian T. Witting ◽  
Ping-Yuan Deng ◽  
...  
Keyword(s):  
Thin Film ◽  
Metallic Glass ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Thermoelectric Modules ◽  
Diffusion Barrier Layer

Property comparison of flexible Cu(InGa)Se2 thin film solar cells on Ti and Ni foils without diffusion barrier

2019 ◽  
Vol 30 (12) ◽  
pp. 11754-11763
Author(s):  
Jieyi Chen ◽  
Honglie Shen ◽  
Zihao Zhai ◽  
Yufang Li ◽  
Yuxing Lin
Keyword(s):  
Thin Film ◽  
Solar Cells ◽  
Diffusion Barrier ◽  
Thin Film Solar Cells

Characterization of a Ru-based ternary-oxide thin film for a diffusion barrier

2012 ◽  
Vol 61 (6) ◽  
pp. 984-987 ◽  
Author(s):  
Tae Eun Hong ◽  
E. D. Jeong ◽  
M. R. Byeon ◽  
Y. B. Kang ◽  
Ho-Soon Yang ◽  
...  
Keyword(s):  
Thin Film ◽  
Diffusion Barrier ◽  
Oxide Thin Film ◽  
Ternary Oxide
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