Analytical modeling of stress-induced leakage currents in 5.1–9.6-nm-thick silicon-dioxide films based on two-step inelastic trap-assisted tunneling

2000 ◽  
Vol 88 (9) ◽  
pp. 5238-5245 ◽  
Author(s):  
Markus Lenski ◽  
Tetsuo Endoh ◽  
Fujio Masuoka
2011 ◽  
Vol 20 (03) ◽  
pp. 557-564
Author(s):  
G. R. SAVICH ◽  
J. R. PEDRAZZANI ◽  
S. MAIMON ◽  
G. W. WICKS

Tunneling currents and surface leakage currents are both contributors to the overall dark current which limits many semiconductor devices. Surface leakage current is generally controlled by applying a post-epitaxial passivation layer; however, surface passivation is often expensive and ineffective. Band-to-band and trap assisted tunneling currents cannot be controlled through surface passivants, thus an alternative means of control is necessary. Unipolar barriers, when appropriately applied to standard electronic device structures, can reduce the effects of both surface leakage and tunneling currents more easily and cost effectively than other methods, including surface passivation. Unipolar barriers are applied to the p -type region of a conventional, MBE grown, InAs based pn junction structures resulting in a reduction of surface leakage current. Placing the unipolar barrier in the n -type region of the device, has the added benefit of reducing trap assisted tunneling current as well as surface leakage currents. Conventional, InAs pn junctions are shown to exhibit surface leakage current while unipolar barrier photodiodes show no detectable surface currents.


1999 ◽  
Author(s):  
Shiro Kamohara ◽  
Yutaka Okuyama ◽  
Yukiko Manabe ◽  
Kosuke Okuyama ◽  
Katsuhiko Kubota ◽  
...  

2000 ◽  
Vol 147 (12) ◽  
pp. 4676
Author(s):  
C. H. Ang ◽  
C. H. Ling ◽  
Z. Y. Cheng ◽  
S. J. Kim ◽  
B. J. Cho

1999 ◽  
Vol 86 (4) ◽  
pp. 2095-2099 ◽  
Author(s):  
Tetsuo Endoh ◽  
Takao Chiba ◽  
Hiroshi Sakuraba ◽  
Markus Lenski ◽  
Fujio Masuoka

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