Electron mobility and Si incorporation in InxGa1−xAs layers grown on GaAs by molecular beam epitaxy

1992 ◽  
Vol 61 (7) ◽  
pp. 789-791 ◽  
Author(s):  
M. J. Ekenstedt ◽  
P. Songpongs ◽  
T. G. Andersson
2004 ◽  
Vol 265 (1-2) ◽  
pp. 34-40 ◽  
Author(s):  
Kazuhiro Miyamoto ◽  
Michihiro Sano ◽  
Hiroyuki Kato ◽  
Takafumi Yao

1992 ◽  
Vol 117 (1-4) ◽  
pp. 218-221 ◽  
Author(s):  
S. Sone ◽  
N. Oda ◽  
T. Sasaki ◽  
M. Kawano

2013 ◽  
Vol 1561 ◽  
Author(s):  
Cheng-Ying Huang ◽  
Jeremy J. M. Law ◽  
Hong Lu ◽  
Mark J. W. Rodwell ◽  
Arthur C. Gossard

ABSTRACTWe investigated AlAs0.56Sb0.44 epitaxial layers lattice-matched to InP grown by molecular beam epitaxy (MBE). Silicon (Si) and tellurium (Te) were studied as n-type dopants in AlAs0.56Sb0.44 material. Similar to most Sb-based materials, AlAs0.56Sb0.44 demonstrates a maximum active carrier concentration around low-1018 cm-3 when using Te as a dopant. We propose the use of a heavily Si-doped InAlAs layer embedded in the AlAsSb barrier as a modulation-doped layer. The In0.53Ga0.47As/AlAs0.56Sb0.44 double heterostructures with a 10 nm InGaAs well show an electron mobility of about 9400 cm2/V・s at 295 K and 32000 cm2/V・s at 46 K. A thinner 5 nm InGaAs well has an electron mobility of about 4300 cm2/V・s at 295 K. This study demonstrates that AlAs0.56Sb0.44 is a promising barrier material for highly scaled InGaAs MOSFETs and HEMTs.


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