Dramatic reduction of gate leakage current in 1.61 nm HfO2 high-k dielectric poly-silicon gate with Al2O3 capping layer

2002 ◽  
Vol 38 (20) ◽  
pp. 1223 ◽  
Author(s):  
Chih-Wei Yang ◽  
Yean-Kuan Fang ◽  
Chien-Hao Chen ◽  
Wen-De Wang ◽  
Tin-Yu Lin ◽  
...  
2005 ◽  
Vol 86 (14) ◽  
pp. 143507 ◽  
Author(s):  
N. Umezawa ◽  
K. Shiraishi ◽  
T. Ohno ◽  
H. Watanabe ◽  
T. Chikyow ◽  
...  

2011 ◽  
Vol 88 (7) ◽  
pp. 1309-1311 ◽  
Author(s):  
C.H. Fu ◽  
K.S. Chang-Liao ◽  
Y.A. Chang ◽  
Y.Y. Hsu ◽  
T.H. Tzeng ◽  
...  

2010 ◽  
Author(s):  
G. Bersuker ◽  
D. Heh ◽  
J. Huang ◽  
C. S. Park ◽  
A. Padovani ◽  
...  

2012 ◽  
Vol 2012 ◽  
pp. 1-4
Author(s):  
Yi-Lin Yang ◽  
Wenqi Zhang ◽  
Chi-Yun Cheng ◽  
Wen-kuan Yeh

The oxygen and nitrogen were shown to diffuse through the TiN layer in the high-k/metal gate devices during PMA. Both the oxygen and nitrogen annealing will reduce the gate leakage current without increasing oxide thickness. The threshold voltages of the devices changed with various PMA conditions. The reliability of the devices, especially for the oxygen annealed devices, was improved after PMA treatments.


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