Comparison of SOI and junction isolation for substrate crosstalk suppression in mixed mode integrated circuits

1995 ◽  
Vol 31 (15) ◽  
pp. 1230-1231 ◽  
Author(s):  
K. Joardar
Keyword(s):  
Integrated Circuits ◽  
Mixed Mode

Combine Micro-Probing and OBIRCH to Catch Non-Recognizable Fault in RF and Mixed-Mode Integrated Circuits

2007 ◽  
Author(s):  
Cha-Ming Shen ◽  
Yen-Long Chang ◽  
Lian-Fon Wen ◽  
Tan-Chen Chuang ◽  
Shi-Chen Lin ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Radio Frequency ◽  
Failure Analysis ◽  
Case Studies ◽  
Mixed Mode ◽  
Failure Mechanisms ◽  
Deep Submicron ◽  
Digital Logic ◽  
Successful Approach ◽  
Cmos Processes

Abstract Highly-integrated radio frequency and mixed-mode devices that are manufactured in deep-submicron or more advanced CMOS processes are becoming more complex to analyze. The increased complexity presents us with many eccentric failure mechanisms that are uniquely different from traditional failure mechanisms found during failure analysis on digital logic applications. This paper presents a novel methodology to overcome the difficulties and discusses two case studies which demonstrate the application of the methodology. Through the case studies, the methodology was proven to be a successful approach. It is also proved how this methodology would work for such non-recognizable failures.

SINGLE CFA-BASED NICs WITH IMPEDANCE SCALING PROPERTIES

2005 ◽  
Vol 14 (02) ◽  
pp. 195-203 ◽  
Author(s):  
ALI ÜMIT KESKIN
Keyword(s):  
Integrated Circuits ◽  
Mixed Mode ◽  
Building Blocks ◽  
Current Feedback ◽  
Scaling Properties ◽  
Feedback Amplifier ◽  
Current Feedback Amplifier ◽  
Design And Manufacturing ◽  
Impedance Scaling ◽  
Impedance Converter

Negative impedance converter circuits (NICs) are important building blocks in design and manufacturing of analog and mixed mode integrated circuits. In this paper, a catalogue of single-current feedback amplifier-based negative impedance converter circuits having impedance scaling properties is proposed. Various examples are presented to illustrate the versatility of the proposed NIC circuits.

scholarly journals Behavioral Modeling of Mixed-Mode Integrated Circuits

10.5772/15864 ◽  
2011 ◽  
Author(s):  
Esteban Tlelo-Cuautle ◽  
Elyoenai Martnez-Romero ◽  
Carlos Snchez-Lpez ◽  
Francisco V. ◽  
Sheldon X.-D. ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Mixed Mode ◽  
Behavioral Modeling

Mixed mode integrated circuits

2005 ◽  
Vol 24 (1) ◽  
pp. 6-11
Author(s):  
P.R. Bhadri ◽  
R. Srinivasan ◽  
P. Mal ◽  
F.R. Beyette ◽  
H.W. Carter
Keyword(s):  
Integrated Circuits ◽  
Mixed Mode

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

2002 ◽  
Vol 124 (4) ◽  
pp. 318-322 ◽  
Author(s):  
J. Auersperg ◽  
E. Kieselstein ◽  
A. Schubert ◽  
B. Michel
Keyword(s):  
Integrated Circuits ◽  
Mixed Mode ◽  
Industrial Applications ◽  
Experimental Investigations ◽  
Mixed Mode Fracture ◽  
Electronic Packages ◽  
Mechanical Reliability ◽  
Material Interfaces ◽  
Young’S Moduli ◽  
Thermal Expansion Coefficients

The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young’s moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking, and fatigue of solder interconnects. This paper intends to investigate mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents. Both numerical and experimental investigations provide the basis for understanding and evaluating failure mechanisms especially in solder joints, as well as several polymer material interfaces, and should support further applications for raising the thermo-mechanical reliability of advanced electronic packages.

Sign in / Sign up

Export Citation Format

Share Document