Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

2002 ◽  
Vol 124 (4) ◽  
pp. 318-322 ◽  
Author(s):  
J. Auersperg ◽  
E. Kieselstein ◽  
A. Schubert ◽  
B. Michel
Keyword(s):  
Integrated Circuits ◽  
Mixed Mode ◽  
Industrial Applications ◽  
Experimental Investigations ◽  
Mixed Mode Fracture ◽  
Electronic Packages ◽  
Mechanical Reliability ◽  
Material Interfaces ◽  
Young’S Moduli ◽  
Thermal Expansion Coefficients

The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young’s moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking, and fatigue of solder interconnects. This paper intends to investigate mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents. Both numerical and experimental investigations provide the basis for understanding and evaluating failure mechanisms especially in solder joints, as well as several polymer material interfaces, and should support further applications for raising the thermo-mechanical reliability of advanced electronic packages.

Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches

2001 ◽  
Author(s):  
Jürgen Auersperg ◽  
Eva Kieselstein ◽  
Andreas Schubert ◽  
Bernd Michel
Keyword(s):  
Fracture Mechanics ◽  
Integrated Circuits ◽  
Flip Chip ◽  
Correlation Method ◽  
Industrial Applications ◽  
Experimental Investigations ◽  
Electronic Packages ◽  
Mechanical Reliability ◽  
Material Interfaces ◽  
Mechanics Concepts

Abstract The increasing use of advanced electronic packages like Flip Chips and CSP under harsh environmental conditions, extreme temperatures is often a reason for damage, fatigue and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young’s moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking and fatigue of solder interconnects. This paper intends to describe the investigation of damage and interface delamination phenomena in micro components by numerical investigations by means of fracture mechanics concepts based on nonlinear FEA and experimental investigations. Consequently, the contribution shows the use of non-linear finite element simulations with respect to the nonlinear, temperature and rate dependent behavior of different materials used, the application of fracture mechanics concepts (energy release rate, integral fracture approaches, mode-mixity examinations) in combination with experimental investigations. For these purpose, bending specimens consisting of several materials interfaces widely used in FC ssemblies and CSP have been investigated in particular. In order to evaluate the different approaches used some results have been compared to micrographs from growing interface delaminations by using micro deformation measurements on the basis of a gray scale correlation method applied to micrographs, in particular. The methodology explained is a helpful basis for understanding and evaluating failure mechanisms especially of several polymer material interfaces as well as of solder joints in a more consistent manner. It should support further applications for raising the thermo-mechanical reliability of advanced electronic packages.

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

1999 ◽  
Vol 122 (1) ◽  
pp. 67-72 ◽  
Author(s):  
Dickson T. S. Yeung ◽  
David C. C. Lam ◽  
Matthew M. F. Yuen
Keyword(s):  
Mixed Mode ◽  
Interfacial Fracture ◽  
Mixed Mode Fracture ◽  
Electronic Packages ◽  
Cracked Beam ◽  
Fracture Properties ◽  
Four Point Bending ◽  
Data Yield ◽  
Bending Loading

A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along the second and third layers of the CCB specimen is carried out analytically. For a given test specimen, a stable test window (material combination and thickness ratio) has been identified using the analytical expression. Data yield from interfacial mixed mode fracture properties experimental measurement can be enhanced by testing within the testing window. [S1043-7398(00)00101-8]

Mixed Mode Fracture in Electronic Packages

1996 ◽  
Vol 445 ◽  
Author(s):  
W. O. Soboyejo ◽  
V. Sinha ◽  
V. Kenner
Keyword(s):  
Fracture Toughness ◽  
Mixed Mode ◽  
Mode I ◽  
Mode Ii ◽  
Mixed Mode Fracture ◽  
Electronic Packages ◽  
Mixed Mode Loading ◽  
Molding Compound ◽  
Mode Fracture ◽  
Mode Ii Fracture Toughness

AbstractIn this paper, mixedmode (mode I + mode II) fracture toughness data are presented for the prediction of molding compound (silica filled epoxy resin) failure. The stresses necessary to cause the package cracking under mixed mode loading are experimentally determined. Measured toughness values are presented as a function of modemixity and temperature

Combine Micro-Probing and OBIRCH to Catch Non-Recognizable Fault in RF and Mixed-Mode Integrated Circuits

2007 ◽  
Author(s):  
Cha-Ming Shen ◽  
Yen-Long Chang ◽  
Lian-Fon Wen ◽  
Tan-Chen Chuang ◽  
Shi-Chen Lin ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Radio Frequency ◽  
Failure Analysis ◽  
Case Studies ◽  
Mixed Mode ◽  
Failure Mechanisms ◽  
Deep Submicron ◽  
Digital Logic ◽  
Successful Approach ◽  
Cmos Processes

Abstract Highly-integrated radio frequency and mixed-mode devices that are manufactured in deep-submicron or more advanced CMOS processes are becoming more complex to analyze. The increased complexity presents us with many eccentric failure mechanisms that are uniquely different from traditional failure mechanisms found during failure analysis on digital logic applications. This paper presents a novel methodology to overcome the difficulties and discusses two case studies which demonstrate the application of the methodology. Through the case studies, the methodology was proven to be a successful approach. It is also proved how this methodology would work for such non-recognizable failures.

scholarly journals An Improved Cohesive Zone Model for Interface Mixed-Mode Fractures of Railway Slab Tracks

2021 ◽  
Vol 11 (1) ◽  
pp. 456
Author(s):  
Yanglong Zhong ◽  
Liang Gao ◽  
Xiaopei Cai ◽  
Bolun An ◽  
Zhihan Zhang ◽  
...  
Keyword(s):  
Interface Crack ◽  
Cohesive Zone ◽  
Mixed Mode ◽  
Cohesive Zone Model ◽  
Complex Loading ◽  
Bending Test ◽  
Mixed Mode Fracture ◽  
Zone Model ◽  
Slab Track ◽  
Interfacial Cracks

The interface crack of a slab track is a fracture of mixed-mode that experiences a complex loading–unloading–reloading process. A reasonable simulation of the interaction between the layers of slab tracks is the key to studying the interface crack. However, the existing models of interface disease of slab track have problems, such as the stress oscillation of the crack tip and self-repairing, which do not simulate the mixed mode of interface cracks accurately. Aiming at these shortcomings, we propose an improved cohesive zone model combined with an unloading/reloading relationship based on the original Park–Paulino–Roesler (PPR) model in this paper. It is shown that the improved model guaranteed the consistency of the cohesive constitutive model and described the mixed-mode fracture better. This conclusion is based on the assessment of work-of-separation and the simulation of the mixed-mode bending test. Through the test of loading, unloading, and reloading, we observed that the improved unloading/reloading relationship effectively eliminated the issue of self-repairing and preserved all essential features. The proposed model provides a tool for the study of interface cracking mechanism of ballastless tracks and theoretical guidance for the monitoring, maintenance, and repair of layer defects, such as interfacial cracks and slab arches.

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