Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

2012 ◽  
Vol 52 (3) ◽  
pp. 530-533 ◽  
Author(s):  
A.S. Budiman ◽  
H.-A.-S. Shin ◽  
B.-J. Kim ◽  
S.-H. Hwang ◽  
H.-Y. Son ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Through Silicon Via ◽  
X Ray ◽  
3 Dimensional

The 3-Dimensional Molecular Structure of the Actin Filament Revisited

1985 ◽  
Vol 43 ◽  
pp. 480-481
Author(s):  
U. Aebi ◽  
R. Millonig ◽  
H. Salvo
Keyword(s):  
Actin Filament ◽  
Supramolecular Assembly ◽  
Specimen Preparation ◽  
X Ray Diffraction ◽  
Single Filament ◽  
X Ray ◽  
3 Dimensional ◽  
Filament Diameter ◽  
Preparation Conditions ◽  
Apparent Diameter

To date, most 3-D reconstructions of undecorated actin filaments have been obtained from actin filament paracrystal data (for refs, see 1,2). However, due to the fact that (a) the paracrystals may be several filament layers thick, and (b) adjacent filaments may sustantially interdigitate, these reconstructions may be subject to significant artifacts. None of these reconstructions has permitted unambiguous tracing or orientation of the actin subunits within the filament. Furthermore, measured values for the maximal filament diameter both determined by EM and by X-ray diffraction analysis, vary between 6 and 10 nm. Obviously, the apparent diameter of the actin filament revealed in the EM will critically depend on specimen preparation, since it is a rather flexible supramolecular assembly which can easily be bent or distorted. To resolve some of these ambiguities, we have explored specimen preparation conditions which may preserve single filaments sufficiently straight and helically ordered to be suitable for single filament 3-D reconstructions, possibly revealing molecular detail.

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

scholarly journals Visualization Ability of Phase-Contrast Synchrotron-Based X-Ray Imaging Using an X-Ray Interferometer in Soft Tissue Tumors

2021 ◽  
Vol 20 ◽  
pp. 153303382110101
Author(s):  
Thet-Thet Lwin ◽  
Akio Yoneyama ◽  
Hiroko Maruyama ◽  
Tohoru Takeda
Keyword(s):  
Computed Tomography ◽  
Soft Tissue ◽  
Spatial Resolution ◽  
Phase Contrast ◽  
Soft Tissue Tumors ◽  
X Ray ◽  
3 Dimensional ◽  
Computed Tomography Images ◽  
X Ray Imaging ◽  
X Ray Computed

Phase-contrast synchrotron-based X-ray imaging using an X-ray interferometer provides high sensitivity and high spatial resolution, and it has the ability to depict the fine morphological structures of biological soft tissues, including tumors. In this study, we quantitatively compared phase-contrast synchrotron-based X-ray computed tomography images and images of histopathological hematoxylin-eosin-stained sections of spontaneously occurring rat testicular tumors that contained different types of cells. The absolute densities measured on the phase-contrast synchrotron-based X-ray computed tomography images correlated well with the densities of the nuclear chromatin in the histological images, thereby demonstrating the ability of phase-contrast synchrotron-based X-ray imaging using an X-ray interferometer to reliably identify the characteristics of cancer cells within solid soft tissue tumors. In addition, 3-dimensional synchrotron-based phase-contrast X-ray computed tomography enables screening for different structures within tumors, such as solid, cystic, and fibrous tissues, and blood clots, from any direction and with a spatial resolution down to 26 μm. Thus, phase-contrast synchrotron-based X-ray imaging using an X-ray interferometer shows potential for being useful in preclinical cancer research by providing the ability to depict the characteristics of tumor cells and by offering 3-dimensional information capabilities.

scholarly journals Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2017 ◽  
Vol 17 (1) ◽  
pp. 59-68 ◽  
Author(s):  
Mahbub Alam ◽  
Haoting Shen ◽  
Navid Asadizanjani ◽  
Mark Tehranipoor ◽  
Domenic Forte
Keyword(s):  
Integrated Circuits ◽  
X Ray

scholarly journals X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via

2016 ◽  
Vol 49 (1) ◽  
pp. 182-187 ◽  
Author(s):  
J. Todt ◽  
H. Hammer ◽  
B. Sartory ◽  
M. Burghammer ◽  
J. Kraft ◽  
...  
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Finite Element ◽  
Diffraction Data ◽  
Element Model ◽  
Stress Distributions ◽  
Through Silicon Via ◽  
X Ray ◽  
Tangential Stresses ◽  
Stress Components

Synchrotron X-ray nanodiffraction is used to analyse residual stress distributions in a 200 nm-thick W film deposited on the scalloped inner wall of a through-silicon via. The diffraction data are evaluated using a novel dedicated methodology which allows the quantification of axial and tangential stress components under the condition that radial stresses are negligible. The results reveal oscillatory axial stresses in the range of ∼445–885 MPa, with a distribution that correlates well with the scallop wavelength and morphology, as well as nearly constant tangential stresses of ∼800 MPa. The discrepancy with larger stress values obtained from a finite-element model, as well as from a blanket W film, is attributed to the morphology and microstructural nature of the W film in the via.

scholarly journals Method for integrated circuits total ionizing dose hardness testing based on combined gamma- and x-ray irradiation facilities

2014 ◽  
Vol 27 (3) ◽  
pp. 329-338 ◽  
Author(s):  
Armen Sogoyan ◽  
Alexey Artamonov ◽  
Alexander Nikiforov ◽  
Dmitry Boychenko
Keyword(s):  
Integrated Circuits ◽  
Hardness Testing ◽  
Total Ionizing Dose ◽  
X Ray ◽  
Step Algorithm ◽  
Irradiation Facilities

A method is proposed to test microelectronic parts total ionizing dose hardness based on a rationally balanced combination of gamma- and X-ray irradiation facilities. The scope of this method is identified, and a step-by-step algorithm of combined testing is provided, along with a test example of the method application.

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