Detailed investigation of the effects of La and Al content on the electrical characteristics and reliability properties of La–Al–O gate dielectrics

2010 ◽  
Vol 50 (12) ◽  
pp. 1920-1923
Author(s):  
Masamichi Suzuki ◽  
Masato Koyama ◽  
Atsuhiro Kinoshita
2014 ◽  
Vol 598 (1) ◽  
pp. 129-134 ◽  
Author(s):  
Sung Woo Lee ◽  
Dong Wook Kim ◽  
Hyunji Shin ◽  
Jong Sun Choi ◽  
Jin-Hyuk Bae ◽  
...  

2013 ◽  
Vol 8 (1) ◽  
pp. 18 ◽  
Author(s):  
Fa-Hsyang Chen ◽  
Jim-Long Her ◽  
Yu-Hsuan Shao ◽  
Yasuhiro H Matsuda ◽  
Tung-Ming Pan

2019 ◽  
Vol 25 (6) ◽  
pp. 265-270 ◽  
Author(s):  
Kiyohisa Funamizu ◽  
Yueh Chin Lin ◽  
Kuniyuki Kakushima ◽  
Parhat Ahmet ◽  
Kazuo Tsutsui ◽  
...  

2011 ◽  
Vol 257 (9) ◽  
pp. 3964-3968 ◽  
Author(s):  
Tung-Ming Pan ◽  
Wei-Tsung Chang ◽  
Fu-Chien Chiu

2009 ◽  
Vol 12 (6) ◽  
pp. G27 ◽  
Author(s):  
Tung-Ming Pan ◽  
Li-Chen Yen ◽  
Chun-Chin Huang ◽  
Wu-Ching Lin

2003 ◽  
Vol 786 ◽  
Author(s):  
Akira Toriumi ◽  
Toshihide Nabatame ◽  
Tsuyoshi Horikawa

ABSTRACTWe have investigated ternary metal oxide films for high-k gate dielectrics by using a layer-by-layer deposition & annealing method so as to keep the dielectric constant of the film high with no crystallization. HfAlOx films have been prepared by alternating deposition of HfO2 and Al2O3 layers, where it is a key for the improvement of the film quality to understand the intermixing process between two layers by thermal treatments. So, we first discuss the atomic diffusion and structural change of the HfO2/Al2O3 “superlattice” film as a function of the annealing temperature by changing the Hf/Al ratio. In a typical case of the film with HfOx/AlOx=3Å/9Å cycle, a clear superlattice peak is observed below 750 °C by XRD. Above 850 °C, a different type of crystalline structure with no superlattice peaks is observed. These results indicate that the intermixing in HfO2/Al2O3 (3Å/9Å) films occurs between 750 and 850 °C. The intermixing onset temperature increases with increasing Al content in Hf/Al ratio.To further increase the crystallization temperature, nitrogen incorporation into the film is considered, and effects of the nitrogen incorporation into HfAlOx films are studied from the structural and electrical viewpoints. The results indicate that there is a tradeoff between crystallization restriction and leakage current degradation for the nitrogen incorporation into HfAlOx films.


2006 ◽  
Vol 9 (11) ◽  
pp. F77 ◽  
Author(s):  
Musarrat Hasan ◽  
Min Seok Jo ◽  
Md. Shahriar Rahman ◽  
Hyejong Choi ◽  
Sungho Heo ◽  
...  

2015 ◽  
Vol 138 ◽  
pp. 97-101 ◽  
Author(s):  
Win-Der Lee ◽  
Mu-Chun Wang ◽  
Shea-Jue Wang ◽  
Wen-How Lan ◽  
Jie-Min Yang ◽  
...  

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