Effects of Epoxy Molding Compound on Electrical Resistance Degradation of Pd-Coated Cu Wire Bonds in the 175 °C to 225 °C Range

2018 ◽  
Author(s):  
Michael David Hook ◽  
Michael Mayer ◽  
Stevan Hunter
Keyword(s):  
Electrical Resistance ◽  
Epoxy Molding Compound ◽  
Molding Compound ◽  
Wire Bonds ◽  
Resistance Degradation

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

2011 ◽  
Vol 51 (1) ◽  
pp. 157-165 ◽  
Author(s):  
Y.H. Tian ◽  
C.J. Hang ◽  
C.Q. Wang ◽  
G.Q. Ouyang ◽  
D.S. Yang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
Epoxy Molding Compound ◽  
Molding Compound ◽  
Wire Bonds ◽  
Fine Copper

Warpage Control Method in Epoxy Molding Compound

2020 ◽  
Author(s):  
Wei Tan ◽  
Cheng Cheng ◽  
Hongjie Liu ◽  
Yangyang Duan ◽  
Linlin Liu ◽  
...  
Keyword(s):  
Control Method ◽  
Epoxy Molding Compound ◽  
Molding Compound

Characterization of the rheological properties of a fast-curing epoxy-molding compound

1997 ◽  
Vol 41 (2) ◽  
pp. 177-195 ◽  
Author(s):  
Sejin Han ◽  
K. K. Wang ◽  
C. A. Hieber ◽  
C. Cohen
Keyword(s):  
Rheological Properties ◽  
Epoxy Molding Compound ◽  
Molding Compound

scholarly journals Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

ACS Omega ◽  
2021 ◽  
Author(s):  
Naoaki Tsurumi ◽  
Yuta Tsuji ◽  
Noriyuki Masago ◽  
Kazunari Yoshizawa
Keyword(s):  
Adhesive Interaction ◽  
Epoxy Molding Compound ◽  
Molding Compound
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