Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

2011 ◽  
Author(s):  
J. Tang ◽  
H. Ye ◽  
J.B.J. Schelen ◽  
C.I.M. Beenakker
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
Wire Bonds

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

2011 ◽  
Vol 51 (1) ◽  
pp. 157-165 ◽  
Author(s):  
Y.H. Tian ◽  
C.J. Hang ◽  
C.Q. Wang ◽  
G.Q. Ouyang ◽  
D.S. Yang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
Epoxy Molding Compound ◽  
Molding Compound ◽  
Wire Bonds ◽  
Fine Copper

Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Sungmo Jung
Keyword(s):  
High Temperature ◽  
High Reliability ◽  
Copper Wire ◽  
Planck Equation ◽  
Operating Conditions ◽  
Polarization Curves ◽  
Automotive Electronics ◽  
Wire Bonds ◽  
Chlorine Ions ◽  
Copper Aluminum

Abstract High reliability harsh environment applications necessitate a better understanding of the acceleration factors under operating stresses. Automotive electronics has transitioned to the use of copper wire for first level interconnects. A number of copper wire formulations have emerged including palladium coated copper and gold-flash palladium coated copper. The corrosion reliability of copper wire bonds in high temperature conditions is not yet fully understood. The EMC used to encapsulate chips and interconnects can vary widely in formulation, including pH, porosity, diffusion rate, composition of contaminants and contaminant concentration. To realistically represent the expected wirebond reliability, there is need for a predictive model that can account for environmental conditions, operating conditions, and exposure to EMCs. In this paper, different EMCs were studied in a high-temperature-current environment with temperature range of 60°C–100°C under current of 0.2A–1A. The diffusion kinetics based on the Nernst-Planck Equation for migration of the chlorine ions has been coupled with the Butler-Volmer equation for corrosion kinetics to create a Multiphysics model. Polarization curves have been measured for copper, aluminum and intermetallics under a number of pH values, and chlorine-ion concentrations. Tafel parameters have been extracted through measurements of the polarization curves.

Reliability of copper wire bonds on a novel over-pad metallization

2015 ◽  
Vol 54 (5S) ◽  
pp. 05EC01 ◽  
Author(s):  
Fumiyoshi Kawashiro ◽  
Satoshi Itoh ◽  
Takehiko Maeda ◽  
Tetsuya Hirose ◽  
Akira Yajima ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonds

Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application

2020 ◽  
Author(s):  
Pradeep Lall ◽  
Sungmo Jung
Keyword(s):  
High Temperature ◽  
High Voltage ◽  
Galvanic Corrosion ◽  
Copper Wire ◽  
Ionic Transport ◽  
Gold Wire ◽  
Process Window ◽  
Voltage Bias ◽  
Wire Bond ◽  
Wire Bonds

Abstract Electronics in automotive underhood environments may be subjected to high temperature in the range of 125–200°C. Transition to electric vehicles has resulted in need for electronics capable of operation under high voltage bias. Automotive electronics has simultaneously transitioned to copper wire-bond from gold wire-bond for first-level interconnections. Copper has a smaller process window and a higher propensity for corrosion in comparison with gold wire bonds. There is scarce information on the reliability of copper wire bonds in presence of high voltage bias under operation at high temperature. In this paper, a multiphysics model for micro galvanic corrosion in the presence of chlorine is introduced. The diffusion cell is used to measure the diffusivity of chlorine in different pH values and different temperatures. Diffusivity measurements are incorporated into the 3D ionic transport model to study the effect of different environmental factors on the transport rate of chlorine. The tafel parameters for copper, aluminum and intermetallics have been extracted through measurements of the polarization curves. The multiple physics of ionic transport in presence of concentration gradient, potential gradient is coupled with the galvanic corrosion.

Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)

2019 ◽  
Vol 99 ◽  
pp. 137-151 ◽  
Author(s):  
Subramani Manoharan ◽  
Chandradip Patel ◽  
Steven Dunford ◽  
John Beshears ◽  
Patrick McCluskey
Keyword(s):  
Principal Component Analysis ◽  
Life Prediction ◽  
Copper Wire ◽  
Principal Component ◽  
Component Analysis ◽  
Wire Bonds

Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization

2015 ◽  
Vol 5 (10) ◽  
pp. 1541-1545
Author(s):  
Roslina Ismail ◽  
Fuaida Harun ◽  
Muhammad Nubli Zulkifli ◽  
Azman Jalar ◽  
Maria Abu Bakar ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonds ◽  
Gold Silver

Mechanical Properties and Failure Analysis of 3D-Woven Copper Wire/Glass Fiber Hybrid Composites

2020 ◽  
Vol 7 (5) ◽  
pp. 17-24
Author(s):  
Fujun Xu ◽  
Liangang Zheng ◽  
Kun Zhang ◽  
Mohamed Amine Aouraghe ◽  
Sidra Saleemi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Failure Analysis ◽  
Glass Fiber ◽  
Structural Integrity ◽  
Bending Strength ◽  
Hybrid Composites ◽  
Copper Wire ◽  
Impact Resistance ◽  
Woven Fabrics ◽  
Woven Composites

Three-dimensional woven fabrics with excellent structural integrity are a very promising structure for multifunctional materials hybridized with various yarns. To systematically investigate mechanical properties and failure analysis of 3D-woven hybrid composites, copper wire/glass fiber composites with two hybrid structures, single-face copper wire (SF-CW) and double-face copper wire (DF-CW), were fabricated and tested. The SF-CW hybrid composites showed excellent tensile strength (1214 MPa) and bending strength (964 MP), which was greater than that of the DF-CW hybrid composites. Additionally, the compression strength and impact resistance of both composites exhibited comparable properties with traditional materials. Furthermore, all failure cross sections showed superior structural integrity and anti-delaminate properties, demonstrating that 3D-woven composites can be a good candidate platform by hybridization with various multifunctional yarns.

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