Novel simulation approach for transient analysis and reliable thermal management of power devices

2008 ◽  
Vol 48 (8-9) ◽  
pp. 1500-1504 ◽  
Author(s):  
A. Castellazzi ◽  
M. Ciappa
Keyword(s):  
Thermal Management ◽  
Transient Analysis ◽  
Simulation Approach ◽  
Power Devices

Transient Vapor Compression Refrigeration Cycle for Electronics Cooling: Part 2—Multi-Evaporator Dynamics and Control

2011 ◽  
Author(s):  
TieJun Zhang ◽  
John T. Wen ◽  
Michael K. Jensen
Keyword(s):  
Thermal Management ◽  
Energy Efficient ◽  
Transient Analysis ◽  
Electronics Cooling ◽  
Refrigeration Cycle ◽  
Vapor Compression ◽  
Cooling Systems ◽  
Computation Efficiency ◽  
Vapor Compression Refrigeration Cycle ◽  
Vapor Compression Refrigeration

For next-generation sustainable electronic systems, such as high-concentration photovoltaics arrays and high-density super-computers, two-phase cooling technologies are being explored to significantly reduce heat resistance from electronics’ surface to the ambient. Lower electronics operating temperatures lead to higher energy conversion or computation efficiency; therefore, thermal management, especially dynamic thermal management, is able to bring great potential to energy-efficient electronic system operation. These large-scale electronics cooling systems normally include multiple, distributed, and transient heat sources. Multi-evaporator vapor compression refrigeration cycle provides such a promising cooling solution. Due to the complexity of multiple evaporator structure, its transient analysis and active control become very challenging. This paper applies our previous distributed heat exchanger modeling techniques to study the dynamics of multi-evaporator refrigeration cycles. A comprehensive first-principle multi-evaporator vapor compression cycle model is formulated for its transient analysis. Some preliminary expansion valve control results are presented to show the excellent active electronics cooling capability. This general tool is expected to bring instructive guidelines for the optimal design and operation of energy-efficient transient electronics cooling systems with multiple heat loads and hot spots.

Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop

2003 ◽  
Author(s):  
Laura J. Meyer ◽  
Leslie M. Phinney
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Electronic Devices ◽  
Maximum Size ◽  
Power Electronic ◽  
Power Devices ◽  
Pressure Balance ◽  
Capillary Pumped Loop ◽  
Two Phase ◽  
Bandgap Semiconductors

Wide bandgap semiconductors such as SiC and GaN are materials that are advantageous for high power electronic devices. High power devices generate large amounts of energy that must be removed, and traditional cooling methods are insufficient for maintaining the desired operating temperatures. Thus, thermal management methods for high power electronic devices need to be developed. A SiC micro-capillary pumped loop thermal management system is being evaluated to cool SiC high power devices. Mathematical models incorporating two-phase flow and capillary wicking have been developed to analyze capillary pumped loops or loop heat pipes. This investigation uses a model based on the methodology of Dickey and Peterson (1994). The model takes an energy balance on the condenser and evaporator regions, as well as a pressure balance across the meniscus. A parametric study has been performed on the micro-CPL to determine the best design for a p-i-n diode that is less than 1 cm square and which produces a heat flux at the junction of over 300 W/cm2. The micro-CPL will be limited to a maximum size of 6.5 cm2. The liquid and vapor line lengths, number of grooves, and groove dimensions are varied to determine optimal values. The results and trends of the optimization calculations are discussed.

Improved thermal management of low voltage power devices with optimized bond wire positions

2011 ◽  
Vol 51 (9-11) ◽  
pp. 1913-1918 ◽  
Author(s):  
Helmut Köck ◽  
Christian Djelassi ◽  
Stefano de Filippis ◽  
Robert Illing ◽  
Michael Nelhiebel ◽  
...  
Keyword(s):  
Thermal Management ◽  
Low Voltage ◽  
Power Devices ◽  
Bond Wire

A simulation approach of under-hood thermal management

2016 ◽  
Vol 100 ◽  
pp. 43-52 ◽  
Author(s):  
Guohua Wang ◽  
Qing Gao ◽  
Tianshi Zhang ◽  
Yan Wang
Keyword(s):  
Thermal Management ◽  
Simulation Approach
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