Microfluidic chip fabrication using hot embossing and thermal bonding of COP
2009 ◽
Vol 21
(7)
◽
pp. 457-466
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2018 ◽
Vol 18
(4)
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pp. 2530-2535
Keyword(s):
2013 ◽
Vol 20
(10-11)
◽
pp. 1987-1992
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Keyword(s):
2015 ◽
Vol 723
◽
pp. 884-887