A spring-driven press device for hot embossing and thermal bonding of PMMA microfluidic chips

2010 ◽  
Vol 31 (15) ◽  
pp. 2512-2519 ◽  
Author(s):  
Zhi Chen ◽  
Luyan Zhang ◽  
Gang Chen
Keyword(s):  
Hot Embossing ◽  
Microfluidic Chips ◽  
Thermal Bonding

Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry

2007 ◽  
Vol 339 ◽  
pp. 246-251
Author(s):  
L.Q. Du ◽  
C. Liu ◽  
H.J. Liu ◽  
J. Qin ◽  
N. Li ◽  
...  
Keyword(s):  
Flow Cytometry ◽  
Microfluidic Chip ◽  
Low Cost ◽  
Hot Embossing ◽  
Microfluidic Chips ◽  
Metal Mold ◽  
Nickel Electroforming ◽  
Thick Photoresist ◽  
Nickel Base ◽  
Microfabrication Technology

Micro hot embossing mold of microfluidic chip used in flow cytometry is designed and microfabricated. After some kinds of microfabrication processes are tried, this paper presents a novel microfabrication technology of micro hot embossing metal mold. Micro metal mold is fabricated by low-cost UV-LIGA surface micro fabrication process using negative thick photoresist, SU-8. Different from other micro hot embossing molds, the micro mold with vertical sidewalls is fabricated by micro nickel electroforming directly on Nickel base. Based on the micro Nickel mold and automation fabrication system, high precision and mass-producing microfluidic chips have been fabricated and they have been used in flow cytometry

Low-deformation precision thermal bonding of nanostructured microfluidic chips

2020 ◽  
Vol 59 (SI) ◽  
pp. SIIJ08 ◽  
Author(s):  
Kazuma Kurihara ◽  
Ryohei Hokari ◽  
Taku Satoh ◽  
Shinji Sugiura ◽  
Koji Miyake ◽  
...  
Keyword(s):  
Microfluidic Chips ◽  
Thermal Bonding

Fabrication of Nanochannels on Polymer Thin Film

2009 ◽  
Author(s):  
Vinh-Nguyen Phan ◽  
Patrick Abgrall ◽  
Nam-Trung Nguyen ◽  
Peige Shao ◽  
Jeroen Anton Van Kan
Keyword(s):  
Thin Film ◽  
Low Cost ◽  
Base Material ◽  
Hot Embossing ◽  
Bonding Process ◽  
Thermal Bonding ◽  
Polymer Thin Film ◽  
Silicon Mold ◽  
Wide Range ◽  
Temperature And Pressure

Recent advances in nanotechnology allow the fabrication of structures down to the nanometer range. Various theoretical and experimental studies on the characteristics of fluid in nanochannels have been carried out in recent years. The results show that transport phenomena in nanoscale promise a wide range of applications in biological and chemical analysis. Practical applications require fabrication of nanochannels with a short production time and at a low cost. Polymer is considered as a suitable material for mass production of nanochannels due to the wide range of properties available, as well as the low cost of material and fabrication process. This paper reports the fabrication of planar nanochannels using hot embossing and thermal bonding technique on a polymer thin film. The mold for hot embossing was fabricated on a silicon wafer using photolithography and Reactive Ion Etching (RIE). Polymethylmethacrylate (PMMA) thin film with a thickness of 250 μm was used as the base material to emboss the nanochannels from the silicon mold. Temperature and pressure were controlled and recorded continuously during the embossing process. The channels then were examined by Atomic Force Microscope (AFM) in tapping mode to verify the width and the depth of the channel. Next, another piece of PMMA thin film was bonded to the first piece by thermal bonding process to make closed nanochannels. Temperature and pressure during the bonding process were controlled and recorded. Access to the channels was made on the thin film by a laser cutter before embossing. The results showed that open planar channels with the depth down to 30nm can be fabricated on PMMA thin film with a process time less than 30 minutes. Width and depth of the channels agree well with appropriate dimensions on the mold. Bonding can be achieved within 40 minutes. Closed planar channels with the depth of 300nm were fabricated successfully by a combination of embossing and thermal bonding processes. This project demonstrates the possibility of fabricating nanochannels with low cost and short processing time using polymer material. The processes are suitable not only for nanochannels but also for more complicated nanostructures. The presented technique allows the fabrication of nanodevices with various designs.

Hands on: thermal bonding of nano- and microfluidic chips

2009 ◽  
Vol 166 (1-2) ◽  
pp. 177-181 ◽  
Author(s):  
Björn Renberg ◽  
Kae Sato ◽  
Takehiko Tsukahara ◽  
Kazuma Mawatari ◽  
Takehiko Kitamori
Keyword(s):  
Microfluidic Chips ◽  
Thermal Bonding ◽  
Hands On

Low‐Temperature Thermal Bonding of PMMA Microfluidic Chips

2005 ◽  
Vol 38 (7) ◽  
pp. 1127-1136 ◽  
Author(s):  
Jianhua Li ◽  
Di Chen ◽  
Gang Chen
Keyword(s):  
Low Temperature ◽  
Microfluidic Chips ◽  
Thermal Bonding

Microfluidic chip fabrication using hot embossing and thermal bonding of COP

2009 ◽  
Vol 21 (7) ◽  
pp. 457-466 ◽  
Author(s):  
Boe-Yu Pemg ◽  
Chih-Wei Wu ◽  
Yung-Kang Shen ◽  
Yi Lin
Keyword(s):  
Microfluidic Chip ◽  
Hot Embossing ◽  
Thermal Bonding ◽  
Chip Fabrication
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