Handbook of Wafer Bonding
Latest Publications

TOTAL DOCUMENTS

21
(FIVE YEARS 0)

H-INDEX

5
(FIVE YEARS 0)

Published By Wiley-VCH Verlag Gmbh & Co. Kgaa

9783527644223, 9783527326464
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Eutectic AuIn Bonding

2012 ◽  
pp. 139-159
Author(s):  
Mitsumasa Koyanagi ◽  
Makoto Motoyoshi

Au/Sn Solder

2012 ◽  
pp. 119-138 ◽  
Author(s):  
Hermann Oppermann ◽  
Matthias Hutter

Three-Dimensional Integration

2012 ◽  
pp. 301-328 ◽  
Author(s):  
Philip Garrou ◽  
James Jian-Qiang Lu ◽  
Peter Ramm
Keyword(s):  
Three Dimensional
Load More ...
Sign in / Sign up

Export Citation Format

Share Document